1. A phosphorus fertilizer for fertilizing acid, iron-poor forest soils, which have a pH of below 5, so that the interval between fertilizations is more than 10 years, characterized in that it contains a phosphorus source and an iron source, at least 10% by weight of the phosphorus present in the phosphorus fertilizer being insoluble in water but soluble in neutral ammonium citrate, and the phosphorus fertilizer being in the form of granules or pellets, and in that the leaching of phosphorus from the fertilizer is insignificant when the fertilizer is used for fertilizing acid, iron-poor forest soils having a pH of below 5.
2. The phosphorus fertilizer according to claim 1, characterized in that the phosphorus source and the iron source are derived from the same compound, preferably ferric phosphate.
3. The phosphorus fertilizer according to claim 2, characterized in that the said ferric phosphate is a byproduct derived from an industrial process and suitable for fertilizer.
4. The phosphorus fertilizer according to claim 3, characterized in that the said ferric phosphate is derived from slurry formed in connection with waste water treatment.
5. The phosphorus fertilizer according to claim 1, characterized in that the phosphorus source and the iron source are partly or entirely derived from different compounds.
6. The phosphorus fertilizer according to claim 5, characterized in that the iron source is an inorganic compound not containing phosphorus, preferably ferric sulfate.
7. The phosphorus fertilizer according to any of the preceding claims, characterized in that 25-100% by weight of the phosphorus in the phosphorus fertilizer is phosphorus soluble in a neutral ammonium citrate and present in an iron-containing phosphorus compound, and any balance is derived from acid-soluble calcium phosphate.
8. The phosphorus fertilizer according to claim 7, characterized in that the acid-soluble calcium phosphate is apatite.
9. The phosphorus fertilizer according to any of claims 1-8, characterized in that in addition to the said phosphorus and iron sources it contains other nutrients, preferably potassium, nitrogen, or both, and trace nutrients, preferably boron, copper, magnesium, zinc, sulfur andor calcium.
10. The phosphorus fertilizer according to claim 1, characterized in that it is in the form of granules having a particle size within the range 1-5 mm, preferably 2-4 mm, and having a moisture content within the range 1-3%
11. The use of the phosphorus fertilizer according to any of the preceding claims as an unreachable phosphorus fertilizer for the fertilization of acid, iron-poor forest soils, which have a pH of below 5, so that the interval between fertilizations is more than 10 years.
12. A method for preparing the phosphorus fertilizer according to any of claims 1-10, characterized in that
a) the solid, pulverous raw materials are mixed together,
b) the formed powder mixture is possibly compressed into a solid mass, and
c) the mass or powder mixture is formed into granules or pellets having a strength of at least 10 N and suitable for fertilizer.
13. A method for fertilizing acid, iron-poor forest soils having a pH of below 5, characterized in that the phosphorus fertilizer according to any of claims 1-10 is spread on the forest soil to be fertilized, the iron present in the fertilizer preventing the phosphorus from being leached out, centrifugal distribution being preferably used.
14. The method according to claim 13, characterized in that the pH of the forest soil to be fertilized is approx. 4 or below 4.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An exposure apparatus for transferring a mask pattern from a mask to at least one substrate, the exposure apparatus comprising:
an illumination system that directs a first beam at the mask pattern and a second beam at the same time at the mask pattern of the mask, wherein the first beam is spaced apart from the second beam at the mask pattern.
2. The exposure apparatus of claim 1 wherein each beam is generally slit shaped.
3. The exposure apparatus of claim 1 wherein the first beam directed at the mask creates a first pattern beam that is transferred to a first substrate location and wherein the second beam directed at the mask creates a second pattern beam that is transferred to a second substrate location, and wherein the first substrate location is spaced apart from the second substrate location.
4. The exposure apparatus of claim 3 wherein the first pattern beam is transferred to a first substrate and wherein the second pattern beam is transferred to a second substrate.
5. The exposure apparatus of claim 1 wherein the illumination system includes an illumination source that generates a source beam, and an illumination optical assembly that separates the source beam into the first beam and the second beam.
6. The exposure apparatus of claim 5 wherein the illumination optical assembly includes a segmented imaging condenser that homogenizes the source beam and a diffraction grating positioned near the segmented imaging condenser that separates the source beam into the first beam and the second beam.
7. The exposure apparatus of claim 1 wherein the illumination system includes (i) a first illumination source that generates a first source beam, (ii) a second illumination source that generates a second source beam, and (iii) an illumination optical assembly that guides the source beams.
8. The exposure apparatus of claim 1 wherein the illumination system includes an illumination source that generates a source beam, and a beam splitter that splits the source beam into the first beam and the second beam.
9. A process for manufacturing a first wafer and a second wafer that includes the steps of providing a first substrate, providing a second substrate, and transferring the mask pattern to the first substrate and the second substrate with the exposure apparatus of claim 1.
10. A method for transferring a mask pattern from a mask to at least one substrate, the method comprising the steps of:
retaining the mask; and
directing a first beam and a second beam at the same time at the mask pattern of the mask with an illumination system, wherein the first beam is spaced apart from the second beam at the mask pattern.
11. The method of claim 10 wherein the first beam directed at the mask creates a first pattern beam that is transferred to a first substrate location and wherein the second beam directed at the mask creates a second pattern beam that is transferred to a second substrate location, and wherein the first substrate location is spaced apart from the second substrate location.
12. The method of claim 10 wherein the step of directing includes the step of generating a source beam with a beam source, and separating the source beam into the first beam and the second beam with an illumination optical assembly.
13. The method of claim 12 wherein the step of separating includes the step of homogenizing the source beam with a segmented imaging condenser, and separating the source beam into the first beam and the second beam with a diffraction grating positioned near the segmented imaging condenser.
14. The method of claim 10 wherein the step of directing includes the steps of (i) generating a first source beam with a first illumination source, (ii) generating a second source beam with a second illumination source, and (iii) guiding the source beams with an illumination optical assembly.
15. The method of claim 10 wherein the step of directing includes the step of generating a source beam with an illumination source, and splitting the source beam into a first beam part and a second beam part.
16. A method for manufacturing a first wafer and a second wafer that includes the steps of providing a first substrate, providing a second substrate, and transferring the mask pattern to the first substrate and the second substrate by the method of claim 10.