1. A bracket for a display device which can be fixed in either of two orientations and moved quickly between the orientations, the bracket comprising:
a first plate;
a second plate;
a sliding hinge connection between the first plate and the second plate, whereby the second plate can both slide and pivot relative to the first plate;
a bridge hinged to both the first plate and the second plate;
the bracket having a deployed configuration in which the second plate and the bridge form angles with the first plate;
the bracket having a retracted configuration in which the first plate, the second plate and the bridge form a flatter profile that in the deployed configuration; and
means for locking the bracket in either of a selected one of the configurations.
2. The bracket of claim 1 wherein the locking means comprises:
a catch mechanism translatably connected to the second plate, the catch mechanism piercing a general plane occupied by the second plate;
means for translating the catch mechanism;
a first catch engagement region on the first plate;
a second catch engagement region on the bridge;
wherein the catch mechanism engages the first region during the retracted configuration and engages the second region during the deployed configuration.
3. The bracket of claim 2 wherein the translating means comprises:
a first member fixed to the second plate;
a second member slidable on the first member;
a drive edge defined by the second member;
a bar to which the catch mechanism is fixed, the bar translatably connected to the second plate; and
a tapered end of the bar;
wherein sliding the second member engages an edge of the aperture with the tapered end.
4. A bracket for mounting a display screen to a structure, wherein the screen can be quickly reoriented from one securely fixed position to another securely fixed position, the bracket comprising:
a base fixed to the structure;
a carrier capable of carrying the screen;
a sliding hinge connection between the base and the carrier, whereby the carrier can both pivot and slide relative to the base;
a bridge hinged both to the base and to the carrier;
the bracket having a deployed configuration in which the carrier and the bridge form angles with the base;
the bracket having a retracted position in which the base, the carrier and the bridge form a flatter profile than in the deployed configuration; and
means for locking the bracket in either of a selected one of the configurations.
5. The bracket of claim 4 wherein the locking means comprises:
a finger translatably connected to the carrier, the finger piercing a general plane occupied by the carrier;
means for translating the finger;
a first finger engagement region on the base;
a second finger engagement region on the bridge;
wherein the finger engages the first region during the retracted configuration and engages the second region during the deployed configuration.
6. The bracket of claim 5 wherein the translating means comprises means for inhibiting accidental operation thereof.
7. The bracket of claim 5 wherein the translating means comprises a grip-squeeze actuator on a lower portion of the carrier wherein the actuator is also a handle for holding the carrier.
8. The bracket of claim 5 wherein the translating means comprises:
a first member fixed to the carrier;
a second member slidable on the first member;
a drive edge defined by the second member;
a translatable bar connected to the carrier, the finger fixed to the bar;
a tapered end of the bar; and
means to bias the bar such that the tapered end is biased toward a location adjacent the drive edge;
wherein sliding the second member engages the drive edge with the tapered end.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A method of processing a wafer comprising: applying a laminate to the wafer, said laminate including a plurality of layers, said plurality of layers including a layer of low K material and an etch stop layer; forming at least one line area and at least one via in the laminate; depositing copper on the laminate.
2. A method as recited in claim 1, further comprising applying a second laminate to the laminate on the wafer, said second laminate including a plurality of layers; forming at least one line area and at least one via in the second laminate; depositing copper on the second laminate.
3. A method as recited in claim 1, wherein said laminate includes a plurality of layers of low K material.
4. A method as recited in claim 1, wherein said laminate includes a plurality of etch stop layers and a plurality of layers of low K material.
5. A method as recited in claim 4, wherein said laminate includes a layer of low K material between two etch stop layers.
6. A method as recited in claim 1, wherein the step of applying the laminate to the wafer comprising rolling the laminate onto the wafer, trimming the laminate to edges of the wafer and performing an anneal process to bond the laminate to the wafer.
7. A method as recited in claim 1, wherein the laminate includes a sacrificial layer.
8. A method as recited in claim 1, wherein the laminate includes a sacrificial layer and said method further comprises removing said sacrificial layer after said laminate has been applied to the wafer.
9. A method as recited in claim 1, wherein the step of forming at least one line area and at least one via in the laminate comprises performing at least one photo masking step and at least one etching step.
10. A method as recited in claim 1, further comprising performing an electro polish and etching step after depositing copper.
11. A method as recited in claim 1, further comprising forming at least one pillar in the laminate.
12. A method as recited in claim 1, wherein said layer of low K material has a K value of less than 2.7.
13. A wafer configuration comprising a first layer of low K material; a second layer of low K material; a third layer disposed between the first and second layers, said third layer comprising an etch stop layer; at least one copper line on the first layer of low K material; and at least one via formed proximate the copper line, through the etch stop layer and second layer of low K material.
14. A wafer configuration as recited in claim 13, further comprising at least one pillar formed through the first, second and third layers.
15. A wafer configuration as recited in claim 13, further comprising a layer of low K material on the first layer of low K material.
16. A wafer configuration as recited in claim 13, further comprising a fourth layer, said fourth layer comprising a layer of low K material on the first layer of low K material, a fifth layer, said fifth layer on the fourth layer and comprising a stop etch layer, a sixth layer, said sixth layer on the fifth layer and comprising a layer of low K material; a seventh layer, said seventh layer on the sixth layer and comprising an etch stop layer.
17. A wafer configuration as recited in claim 13, wherein said first and second layers have a K value of less than 2.7.