1. A portable shelter for sheltering a vehicle, comprising:
a) a canopy for sheltering the vehicle;
b) a plurality of masts each having a first end secured to said canopy;
c) a plurality of mast bases each secured to a respective second end of said masts;
d) said mast bases each including a plurality of hooks that attach to an outside of a tire of the vehicle, a bolt having an outer end and an inner end, a plate having a threaded opening for threadedly receiving said bolt therethrough, a holder for rotatably receiving therein said inner end of said bolt, a plurality of arms each having a first end attached to said holder and a second end attached to a respective one of said hooks, and a plurality of braces each having a first end pivotally connected to said plate and a second end pivotally connected to a respective one of said arms;
e) said holder of each of said mast bases is spaced from the tire when said mast bases are secured to the tire;
f) said plate is movable toward said holder when said bolt is turned one way to cause each of said braces to push a respective one of said arms and cause said first end of each of said arms and said holder to move away from the tire, whereby said hooks are secured to the tire; and
g) said plate is movable away from said holder when said bolt is turned another way to cause each of said braces to pull a respective one of said arms and cause said first end of each of said arms and said holder to move toward the tire, whereby said hooks are loosened from the tire.
2. A portable shelter as in claim 1, wherein said canopy includes a frame bent into an inverted V-shape.
3. A portable shelter as in claim 2, wherein said canopy includes a fabric attached to said frame.
4. A portable shelter as in claim 3, where said frame includes interconnected tubes.
5. A portable shelter as in claim 1, wherein each second end of said masts includes a clamp for attaching to said canopy.
6. A portable shelter as in claim 5, wherein said clamp includes an U-shaped element.
7. A portable shelter as in claim 1, wherein said arms are U-shaped in cross-section.
8. A portable shelter as in claim 1, wherein each of said hooks includes a member adjustably attached to each of said arms.
9. A portable shelter as in claim 1, wherein:
a) said arms each includes a U-shaped cross-section; and
b) each of said hooks includes a member disposed within said U-shaped cross-section.
10. A portable shelter as in claim 1, and further comprising a handle attached to said outer end of said bolt for turning said bolt.
11. A portable shelter as in claim 1, wherein each of said masts includes an inner tubing disposed within an outer tubing.
12. A method of sheltering a vehicle, comprising:
a) providing a plurality of mast bases, each mast base including a plurality of hooks that attach to an outside of a tire of the vehicle, a bolt having an outer end and an inner end, a plate having a threaded opening for threadedly receiving said bolt therethrough, a holder for rotatably receiving said inner end of said bolt therein, a plurality of arms each having a first end attached to said holder and a second end attached to a respective one of said hooks, and a plurality of braces each having a first end pivotally connected to said plate and a second end pivotally connected to a respective one of said arms;
b) for each of said mast bases, attaching said hooks to an outside of a respective tire of the vehicle, turning said bolt one way to move said plate toward said holder to cause each of said braces to push a respective one of said arms and cause said first end of each of said arms and said holder to move away from the tire, whereby said hooks are secured to the tire;
c) providing a plurality of masts each having a first end and a second end;
d) for each mast, securing said mast first end to a respective one of said mast bases; and
e) securing a canopy to said second end of each of said masts.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of making a microelectronic assembly comprising:
(a) providing a first element having a first surface and a plurality of leads extending over said first surface, said leads having anchor ends attached to said first element and tip ends remote from said anchor ends, the tip ends being releasably attached to said first element;
(b) connecting said tip ends of said leads to an a second element, said releasable attachment maintaining said tip ends in position relative to said first element at least until commencement of said connecting step; and then
(c) causing differential expansion or contraction of said elements so as to move said tip ends relative to said first element and break at least some of said releasable attachments.
2. A method as claimed in claim 1 wherein said step of causing differential expansion or contraction of said elements includes altering the temperature of at least one of said elements.
3. A method as claimed in claim 2 wherein said first and second elements have different coefficients of thermal expansion.
4. A method as claimed in claim 3 wherein said step of causing differential expansion or contraction includes altering the temperature of both of said elements.
5. A method as claimed in claim 3 wherein said step of causing differential expansion or contraction includes altering the temperature of at least one of said elements by a different amount than the other one of said elements.
6. A method as claimed in claim 3 wherein said connecting step includes bonding said tip ends of said leads to said second element while both of said elements are at an elevated temperature and said step of altering the temperature of both of said elements includes cooling said elements.
7. A method as claimed in claim 1 wherein one of said elements includes one or more semiconductor chips and the other one of said elements includes a connection component having oppositely-directed inner and outer surfaces and terminals exposed to said outer surface, said connecting step being performed so that the inner surface of the connection component faces toward said one or more semiconductor chips, the outer surface of said connection component faces away from said one or more semiconductor chips and so that at least some of said leads are electrically connected to at least some of said terminals, whereby said chips are connected to said terminals.
8. A method as claimed in claim 7 wherein said one of said elements includes a plurality of semiconductor chips and said other one of said elements includes a plurality of sets of said terminals, the method further comprising subdividing said elements after connecting said tip ends of said leads to said second element to thereby provide a plurality of units, each said unit including one or more of said semiconductor chips and a set of terminals connected to the one or more chips included in such unit.
9. A method as claimed in claim 8 wherein said one of said elements is a unitary wafer including said plurality of chips, said subdividing step including severing said wafer.
10. A method as claimed in claim 8 wherein said one of said elements includes a plurality of separate chips, said connecting step being performed so as to connect leads between said separate chips and said other one of said element seriatim.
11. A method as claimed in claim 8 wherein said other one of said elements includes a unitary structure including a plurality of regions, each said region bearing one said set of terminals, said subdividing step including severing said unitary structure so as to separate said regions from one another.
12. A method as claimed in claim 1 wherein one of said elements includes one or more semiconductor chips and the other one of said elements includes a conductive sheet, the method further comprising the step of removing portions of said conductive sheet so as to form a plurality of terminals connected to said leads after the adhesion between said portions of said leads adjacent the tip ends and said first element is broken.
13. A method as claimed in claim 12 further comprising the steps of moving said elements away from one another so as to bend the tip ends of the leads toward a vertically-extensive disposition; introducing a curable material between said elements during or after said moving step; and curing said curable material to form a layer between said elements surrounding said leads prior to said step of removing portions of said conductive sheet to form said terminals.
14. A method as claimed in claim 12 wherein said conductive sheet constitutes said second element, and wherein said step of connecting the tip ends of the leads to said second element includes bonding the tip ends of the leads to said conductive sheet.
15. A method as claimed in claim 1 further comprising the step of moving said elements away from one another through a predetermined displacement so as to bend the tip ends of the leads toward a vertically-extensive disposition.
16. A method as claimed in claim 15 wherein buckling of the leads impels the elements vertically away from one another.
17. A method as claimed in claim 15 further comprising connecting restraining straps between said elements prior to said step of causing differential expansion or contraction, said restraining straps being stronger than said leads, said restraining straps urging said elements away from one another during said movement step.
18. A method as claimed in claim 17 wherein said restraining straps at least partially constrain relative movement of said elements in horizontal directions parallel to said first surface.
19. A method as claimed in claim 15 wherein at least some of said leads are curved at the conclusion of said moving step.
20. A method as claimed in claim 19 wherein at least some of said leads are curved prior to said moving step.
21. A method as claimed in claim 15 further comprising the step of introducing a curable material between said elements during or after said moving step, and curing said curable material to form a layer between said elements surrounding said leads.
22. A method as claimed in claim 1 wherein, prior to said step of causing differential expansion or contraction of said elements, said portions of said leads adjacent the tip ends of said leads are attached to frangible elements so that said portions of said leads adjacent said tip ends are releasably attached to said first surface by said frangible elements and wherein at least some of said frangible elements are broken by said differential expansion or contraction.
23. A method as claimed in claim 22 wherein said frangible elements are disposed between said portions of said leads adjacent said tip ends of said leads and said first surface.
24. A method as claimed in claim 1 wherein, prior to said step of causing differential expansion or contraction of said elements, said leads have an upward pull bond strength of at least 0.25 grams force.
25. A method as claimed in claim 1 wherein both of said elements are rigid.
26. A method as claimed in claim 1 wherein one of said elements is rigid and the other one of said elements includes a flexible sheet and a frame holding said flexible sheet in tension at least until commencement of said step of causing differential expansion or contraction.
27. A method as claimed in claim 26 wherein said step of causing differential expansion or contraction includes releasing said sheet from said frame.
28. A method as claimed in claim 1 wherein said step of causing differential thermal expansion or contraction includes causing at least one of said elements to warp so as to deform in a vertical direction transverse to said surface after said bonding step.
29. A method as claimed in claim 28 wherein said at least one of said elements includes a structural element having a plurality of dissimilar layers, said layers in said structural element having different coefficients of thermal expansion from one another, said step of causing differential expansion or contraction including changing the temperature of said structural element.
30. A method as claimed in claim 29 wherein said structural element defines a substantially flat surface when said structural element is at an elevated temperature, said bonding step being performed while said structural element is at a said elevated temperature.
31. A method as claimed in claim 30 wherein said step of causing at least one of said elements to warp includes cooling said structural element after said bonding step.
32. A method as claimed in claim 29 wherein said structural element is a temporary carrier, said at least one of said elements including one or more microelectronic elements releasably bonded to said carrier, the method further including removing said microelectronic elements from said carrier after the step of causing differential expansion or contraction.
33. A method of making a microelectronic assembly comprising:
(a) providing first and second elements having opposing surfaces extending in horizontal directions and leads connected between said opposing surfaces, and leads extending between said opposing surfaces;
(b) causing at least one of said elements to warp so as to deform at least a part of at least one of said opposing surfaces in a vertical direction away from the other one of said opposing surfaces and thereby deform at least some of said leads towards a vertically-extensive disposition.
34. A method as claimed in claim 33 wherein at least one of said elements includes a structural element having a plurality of dissimilar layers, said layers in said structural element having different coefficients of thermal expansion from one another, said step of causing differential expansion or contraction including changing the temperature of said structural element.
35. An element for use in a semiconductor assembly, said element having a body defining a first surface and a plurality of leads, said leads having anchor ends attached to said body and having tip ends releasably attached to said body or movable with respect to said body, the element further comprising restraining straps, each said restraining strap having a first end permanently connected to said body and a second end adapted to be connected to a second element, each of said restraining straps having a direction vector from its first end to its second end, different ones of said restraining straps having direction vectors pointing in different directions.
36. An element as claimed in claim 35 wherein said restraining straps are substantially straight, substantially all of said direction vectors pointing generally outwardly, away from a common center point.
37. An element as claimed in claim 35 wherein said restraining straps are substantially straight, substantially all of said direction vectors pointing generally inwardly, toward a common center point.
38. An element for use in manufacturing microelectronic assemblies comprising a carrier defining a surface extending in horizontal directions, said structural element including a plurality of layers having different coefficients of thermal expansion, and one or more microelectronic elements secured to said surface, said one or more microelectronic elements having leads thereon, said leads on said one or more microelectronic elements extending generally horizontally, said leads having anchor ends attached to said microelectronic elements and tip ends displaceable in a vertical direction away from said surface.