1. Apparatus for sensing parameters, which apparatus comprises a housing, a plurality of sockets in the housing, a sensor in each of the sockets, first electrical contacts on the sensor, and second electrical contacts in each socket at an end of the socket remote from the sensor, and the apparatus being such that:
(i) the sensors are for sensing different parameters;
(ii) the sockets are such that when they contain their sensors then the sockets are sealed from each other whereby a liquid caused to be present in a socket consequent upon an operator error is unable to pass to the other sockets;
(iii) the second electrical contacts define the type of sensor that is appropriate for each socket; and
(iv) the sensors each comprise a flat sensor part, a traversely extending mounting part, and a body part, the traversely extending mounting part being located in a bore in the body part, and the body part being sealingly located in the socket for the sensor.
2. Apparatus according to claim 1 in which the body part is a tubular body part having a first groove containing a first O-ring seal.
3. Apparatus according to claim 2 in which the sockets are sized to minimize pressure trapped air behind the first O-ring seal.
4. Apparatus according to claim 2 or in which the tubular body part has a second groove containing a second O-ring seal.
5. Apparatus according to claim 1 in which the body part is made of a plastics material.
6. Apparatus according to claim 1 in which the second electrical contacts are sprung electrical contacts.
7. Apparatus according to claim 6 in which the sprung electrical contacts each comprise a sprung pin mounted in a mounting member, and in which the mounting member is located in the bore in the body part of the sensor.
8. Apparatus according to claim 1 in which the flat sensor part is made of a ceramic material, in which the transversely extending mounting part is made of a ceramic material, in which the two ceramic materials are thermally expansion-matched.
9. Apparatus according to claim 1 in which the transversely extending part is a tube.
10. Apparatus according to claim 1 and including a printed circuit board, the second electrical contacts being such that they are connected to the printed circuit board.
11. Apparatus according to claim 1 in which the first electrical contacts are connected to the second electrical contacts by conductors.
12. Apparatus according to claim 11 in which the conductors are wires.
13. Apparatus according to claim 1 in which the first electrical contacts are electrical contact pads.
14. Apparatus according to claim 1 in which there are eight of the sensors.
15. (canceled)
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A circuit board for a second electronic circuit that is laminated on a side of a first electronic circuit on which a high exothermic element is disposed wherein:
said circuit board comprises a substrate, which comprises at least one dielectric layer mainly comprising ceramics, and at least one first surface electrode formed on a first side of said circuit board that faces said first electronic circuit,
at least a part of said first surface electrode is embedded inside of said substrate,
a remaining part of said first surface electrode is exposed outside of said circuit board for said second electronic circuit and defines a major portion of said first side of said substrate that faces said first electronic circuit such that a portion of a first surface of said first surface electrode is opposed to at least one terminal of said high exothermic element, and
the thickness of said first surface electrode is not less than 100 micrometers in a direction perpendicular to said first surface.
2. The circuit board according to claim 1, wherein:
said dielectric layer is formed of a plurality of dielectric layers and a dielectric layer forming a second surface which is a surface opposite to said first surface has a thermal expansion coefficient larger than that of a dielectric layer forming said first surface.
3. A circuit board for a second electronic circuit that is laminated on a side of a first electronic circuit on which a high exothermic element is disposed wherein:
said circuit board comprises a substrate, which comprises at least one dielectric layer mainly comprising ceramics, at least one first surface electrode formed on a first side of said circuit board that faces said first electronic circuit, and at least one inner layer electrode, which is embedded inside of the dielectric layer of said circuit board,
at least a part of said first surface electrode is embedded inside of said substrate,
a remaining part of said first surface electrode is exposed outside of said circuit board for said second electronic circuit and defines a major portion of said first side of said substrate that faces said first electronic circuit such that a portion of a first surface of said first surface electrode is opposed to at least one terminal of said high exothermic element, and
the thicknesses of said first surface electrode and said inner layer electrode are not less than 100 micrometers in a direction perpendicular to said first surface.
4. The circuit board according to claim 3, wherein:
the thickness of said inner layer electrode in a direction perpendicular to said first surface is larger than the thickness of said first surface electrode in a direction perpendicular to said first surface.
5. The circuit board according to claim 4, wherein:
said dielectric layer is formed of a plurality of dielectric layers and a dielectric layer forming a second surface which is a surface opposite to said first surface has a thermal expansion coefficient larger than that of a dielectric layer forming said first surface.
6. The circuit board according to claim 3, wherein:
said dielectric layer is formed of a plurality of dielectric layers and a dielectric layer forming a second surface which is a surface opposite to said first surface has a thermal expansion coefficient larger than that of a dielectric layer forming said first surface.
7. A high-capacity module which comprises a first electronic circuit containing a high exothermic element, and a second electronic circuit laminated through said high exothermic element on the side, on which said high exothermic element is disposed, of said first electronic circuit, wherein:
a circuit board for said second electronic circuit comprises a substrate, which comprises at least one dielectric layer mainly comprising ceramics, and at least one first surface electrode formed on a first side of said circuit board that faces said first electronic circuit,
at least a part of said first surface electrode is embedded inside of said substrate,
a remaining part of said first surface electrode is exposed outside of said circuit board for said second electronic circuit and defines a major portion of said first side of said substrate that faces said first electronic circuit such that a portion of a first surface of said first surface electrode is opposed to at least one terminal of said high exothermic element, and
the thicknesses of said first surface electrode is not less than 100 micrometers in a direction perpendicular to said first surface.
8. The high-capacity module according to claim 7, wherein:
said dielectric layer is formed of a plurality of dielectric layers and a dielectric layer forming a second surface which is a surface opposite to said first surface has a thermal expansion coefficient larger than that of a dielectric layer forming said first surface.
9. A high-capacity module which comprises a first electronic circuit containing a high exothermic element, and a second electronic circuit laminated through said high exothermic element on the side, on which said high exothermic element is disposed, of said first electronic circuit, wherein:
a circuit board for said second electronic circuit comprises a substrate, which comprises at least one dielectric layer mainly comprising ceramics, and at least one first surface electrode formed on a first side of said circuit board that faces said first electronic circuit, and at least one inner layer electrode which is embedded inside of inner layer(s) of said circuit board,
at least a part of said first surface electrode is embedded inside of said substrate,
a remaining part of said first surface electrode is exposed outside of said circuit board for said second electronic circuit and defines a major portion of said first side of said substrate that faces said first electronic circuit such that a portion of a first surface of said first surface electrode is opposed to at least one terminal of said high exothermic element, and
the thicknesses of said first surface electrode and said inner layer electrode is not less than 100 micrometers in a direction perpendicular to said first surface.
10. The high-capacity module according to claim 9, wherein:
the thickness of said inner layer electrode in a direction perpendicular to said first surface is larger than the thickness of said first surface electrode in a direction perpendicular to said first surface.
11. The high-capacity module according to claim 10, wherein:
said dielectric layer is formed of a plurality of dielectric layers and a dielectric layer forming a second surface which is a surface opposite to said first surface has a thermal expansion coefficient larger than that of a dielectric layer forming said first surface.
12. The high-capacity module according to claim 9, wherein:
said dielectric layer is formed of a plurality of dielectric layers and a dielectric layer forming a second surface which is a surface opposite to said first surface has a thermal expansion coefficient larger than that of a dielectric layer forming said first surface.