1. A fuel tank filler tube assembly for use in a tank fill system employing fuel vapor recirculation comprising:
(a) a tubular member with an enlarged diameter end for receiving a refueling nozzle and having a vapor recirculation cut-out formed in the wall of said enlarged end;
(b) a flapper formed of flexible material associated with said cut-out and moveable therein for opening and for closing said port; and,
(c) means positioning said flapper for closing said cut-out wherein said flapper upon being contacted by liquid fuel rising in the tubular member, in the closed position substantially prevents passage of liquid fuel from said tube permits fuel vapor flow into said tube.
2. The assembly defined in claim 1, wherein said means positioning said flapper includes a spring member extending from an insert in said tubular member.
3. The assembly defined in claim 1, wherein said means positioning said flapper includes a pair of spring fingers.
4. The assembly defined in claim 1, wherein said means positioning said flapper includes a pair of spring fingers resiliently positioning the flapper with respect to said cut out.
5. The assembly defined in claim 1, further comprising a grounding straptab disposed in said tubular member and contacting a nozzle upon insertion in said tubular member.
6. The assembly defined in claim 5, wherein said flapper is attached to an insert.
7. The assembly defined in claim 1, wherein said insert includes an integrally formed spring biasing said grounding straptab.
8. A method of making a fuel tank filler tube for use in a system
with fuel vapor recirculation comprising:
(a) forming a tubular member with an enlarged end for receiving a refueling nozzle and forming a cut-out in the enlarged end for vapor recirculation;
(b) disposing a flexible flapper for movement between an open and closed position with respect to the cut-out; and,
(c) moving the flapper to the closed position upon contact by liquid fuel rising in the tubular member and preventing flow of liquid fuel in the tubular member through the cut-out and permitting flow of fuel vapor through the cut-out into the enlarged end.
9. The method defined in claim 8, wherein said step of disposing a flexible flapper includes attaching the flapper to an insert and disposing the insert in said enlarged end.
10. The method defined in claim 8, wherein said step of disposing a flapper includes forming an insert with a grounding strap and attaching said flapper to said insert and disposing the insert in said tube.
11. The method defined in claim 8, wherein said step of disposing a flapper includes forming a spring integrally with the insert and contacting the flapper with the spring.
12. The method defined in claim 8, wherein said step of disposing a flapper includes providing an insert and attaching the flapper to the insert and disposing the insert in the enlarged end of said tubular member.
13. The method defined in claim 12, wherein said step of positioning the flapper includes forming a spring integrally with the insert.
14. The method defined in claim 12, wherein said step of providing an insert includes providing a grounding straptab for contacting a nozzle upon insertion of same in said enlarged end of said tubular member.
15. The method defined in claim 14, wherein said step of providing a grounding straptab includes forming same integrally with said insert.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for forming an electronic device on a flexible substrate comprising:
conditioning at least one surface of a carrier to form at least one retaining feature on said surface for retaining a flexible substrate;
forming the flexible substrate by deposition of one or more layers of substrate material onto the carrier and the at least one retaining feature;
processing a portion of the deposited substrate to form the electronic device on the processed portion of the substrate; and
releasing at least the processed portion of the substrate from the carrier to provide the flexible substrate having electronic device formed thereon.
2. The method of claim 1 wherein the carrier is glass.
3. The method of claim 1 wherein the flexible substrate is metal.
4. The method of claim 1 wherein conditioning at least one surface of the carrier comprises one or more of abrasion, chemical etching, and ion bombardment.
5. The method of claim 1 wherein conditioning at least one surface of the carrier comprises forming a pattern of treated features.
6. The method of claim 1 wherein conditioning at least one surface of the carrier comprises depositing a seed material onto the at least one surface of the carrier, wherein the seed material differs from the substrate material.
7. The method of claim 6 wherein the seed material is a metal or a dielectric material.
8. The method of claim 1 wherein forming the flexible substrate comprises one or more of the following deposition processes: electroforming, evaporation, and plasma deposition.
9. The method of claim 1 wherein releasing at least the processed portion of the substrate comprises cutting the processed portion of the substrate form an unprocessed portion.
10. The method of claim 1 wherein releasing at least the processed portion of the substrate comprises cooling the substrate, cooling the carrier, or both.
11. The method of claim 1 wherein the respective coefficient of thermal expansion values of the carrier and the flexible substrate differ from each other by more than 2 ppmdegree C.
12. The method of claim 1 wherein the releasing comprises cutting the processed portion of carrier and the substrate from an unprocessed portion
13. The method of claim 1 wherein conditioning the at least one surface forms the at least one retaining feature by treating areas outside the at least one retaining feature.
14. The method of claim 1 wherein the flexible substrate is plastic.
15. The method of claim 1 wherein the retaining feature comprises a lip formed in the carrier.
16. The method of claim 15 wherein the carrier is glass.
17. The method of claim 1 wherein the retaining feature comprises at least one groove formed in the carrier.
18. The method of claim 1 wherein the flexible substrate is selected from the group including metals and plastics.
19. An electronic device formed on a flexible substrate in accordance with the method of claim 1.
20. A method for forming an electronic device on a flexible substrate comprising:
conditioning at least one surface of a carrier to form release features pattern-wise on said surface for reducing adhesion between said surface and a flexible substrate;
forming the flexible substrate by deposition of one or more layers of substrate material onto the carrier;
processing a portion of the deposited substrate to form the electronic device on the processed portion of the said substrate; and
releasing at least the processed portion of the substrate from the carrier to provide the flexible substrate having the electronic device formed thereon.
21. The method of claim 20 wherein the releasing comprises cutting the portion of carrier and the substrate with release features from a portion without release features.
22. A method for forming an electronic device on a flexible substrate comprising:
conditioning at least one surface of a carrier to form at least one retaining feature on said surface for retaining a flexible substrate;
conditioning at least a portion of said at least one surface to form features on said surface for reducing the adhesion between said surface and a flexible substrate;
applying a flexible substrate of one or more layers of substrate material onto the at least one surface of the carrier;
processing a portion of the flexible substrate to form the electronic device; and
releasing at least the portion of the substrate from the carrier to provide the flexible substrate having electronic device formed thereon.
23. An electronic device formed on a flexible substrate in accordance with the method of claim 1.
24. An electronic device formed on a flexible substrate in accordance with the method of claim 20.
25. An electronic device formed on a flexible substrate in accordance with the method of claim 22.