1. An apparatus, comprising:
an audio capturing device to receive an audio signal corresponding to media presented in a local environment;
a user interface including:
an audience member input, the selection of which is to indicate presence of an audience member; and
a plurality of device inputs each corresponding to a respective type of media presentation device, the selection of one of the device inputs to indicate a type of media presentation device generating the captured audio signal; and
memory to store first data associated with a first selection of the audience member input, the memory to store second data associated with a second selection of one of the device inputs, the memory to store the audio signal.
2. An apparatus as defined in claim 1, further comprising a processor to associate presence data gathered via the audience member input with media device type data gathered via the device inputs.
3. An apparatus as defined in claim 1, further comprising a processor to extract media identifying information from the captured audio signal.
4. An apparatus as defined in claim 3, wherein the processor is to associate presence data gathered via the audience member input with the extracted media identifying information.
5. An apparatus as defined in claim 3, wherein the processor is to associate the extracted media identifying information with media device type data gathered via the device inputs.
6. An apparatus as defined in claim 1, further comprising a feedback mechanism for each of the device inputs indicative of whether the corresponding one of the device inputs is currently selected.
7. An apparatus as defined in claim 6, wherein the feedback mechanisms comprise a visual indicator.
8. An apparatus as defined in claim 1, further comprising a feedback display associated with the audience member input, the feedback display to identify a name of a panel member assigned to the audience member input.
9. An apparatus as defined in claim 1, further comprising a communication device to transmit data stored in the memory to a collection device.
10. A method, comprising:
capturing an audio signal from an environment in which media is presented;
in response to receiving a first selection of an audience member input of a user interface implemented on a handheld device, storing first data indicative of presence of a first audience member in the environment;
in response to receiving a second selection of a first one of a plurality of device inputs of the user interface, storing second data indicative of a first type of media presentation device corresponding to the first device input; and
in response to receiving a third selection of a second one of the plurality of device inputs of the user interface, storing third data indicative of a second type of media presentation device corresponding to the second device input.
11. A method as defined in claim 10, further comprising associating media identifying information with the first data.
12. A method as defined in claim 10, further comprising associating media identifying information with one of the second and third data.
13. A method as defined in claim 10, further comprising associating the first data with one of the second and third data.
14. A method as defined in claim 10, further comprising displaying feedback indicative of the second selection of the first one of the plurality of device inputs.
15. A method as defined in claim 10, further comprising communicating the first, second, and third data to a collection device.
16. A method as defined in claim 10, further comprising electronically displaying a name of a panel member assigned to the audience member input.
17. A method as defined in claim 10, wherein the audience member input is assigned to a first panel member of a household.
18. A method, comprising:
processing a received audio signal with a processor of a portable device to extract media identifying information;
capturing presence information entered by a panel member via a respective one of a plurality of member inputs;
receiving an indication of a type of media presentation device generating the audio signal via a respective one of a plurality of device inputs, each of the device inputs selectable to indicate a respective type of media presentation devices; and
storing the media identifying information, the indication of the type of media presentation device generating the received audio signal, and the presence information in memory.
19. A method as defined in claim 18, further comprising associating the media identifying information with the second.
20. A method as defined in claim 18, further comprising associating the first data with the second data.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor wafer having a lamination which is formed on a semiconductor substrate and in which a plurality of semiconductor elements and division regions for separating the plurality of semiconductor elements into individual semiconductor devices are provided, the semiconductor wafer comprising:
a modification region from which formation of a cleavage starts, the modification region being provided in the semiconductor substrate; and
a division guide pattern for guiding progress of the cleavage, the division guide pattern being formed at least in a portion of each division region.
2. The semiconductor wafer according to claim 1, wherein the division guide pattern is formed through the lamination in the lamination direction.
3. The semiconductor wafer according to claim 1, wherein the division guide pattern is formed in a continuous line configuration.
4. The semiconductor wafer according to claim 1, wherein the division guide pattern is formed of a group of a plurality of discontinuous pattern portions in a band configuration.
5. The semiconductor wafer according to claim 1, wherein the division guide pattern comprises a combination of a division guide pattern in a continuous line configuration and a group of a plurality of discontinuous pattern portions in a band configuration.
6. The semiconductor wafer according to claim 1, wherein the division guide pattern includes a slit formed in the lamination.
7. The semiconductor wafer according to claim 1, wherein the division guide pattern includes a metal layer pattern in the lamination including an interlayer insulating film and a passivation film.
8. The semiconductor wafer according to claim 7, wherein the metal layer pattern has a stack structure in which vias and wiring layers are stacked.
9. The semiconductor wafer according to claim 7, wherein the metal layer pattern is in a dot form.
10. The semiconductor wafer according to claim 1, wherein the width of the division region in which the division guide pattern is formed is 30 \u03bcm or less.
11. A method of manufacturing a semiconductor device, comprising:
forming a semiconductor wafer by forming a lamination on a semiconductor substrate; and
performing scanning with laser light, wherein
when the semiconductor wafer is formed, a plurality of semiconductor elements, division regions for separating the plurality of semiconductor elements into individual semiconductor devices and a division guide pattern formed at least in a portion of each division region are provided in the lamination, and
when scanning with laser light is performed, laser light is moved for scanning along the division guide pattern formed in each division region in the semiconductor wafer, a modification region is formed in the semiconductor substrate by irradiation with the laser light, and a cleavage produced from a starting point corresponding to the modification region is guided by the division guide pattern.
12. The method of manufacturing a semiconductor device according to claim 11, further comprising dividing the semiconductor wafer, wherein when the semiconductor wafer is divided, a mechanical stress is produced in the semiconductor wafer along the division guide pattern, the cleavage produced from a starting point corresponding to the modification region is guided by the division guide pattern, and the semiconductor wafer is divided along the division guide patterns to be separated into the individual semiconductor devices.
13. The method of manufacturing a semiconductor device according to claim 11, wherein when scanning with the laser light is performed, the laser light is radiated while adjusting a focal point to an internal portion of the semiconductor substrate to form the modification region in the semiconductor substrate by multi-photon absorption.
14. The method of manufacturing a semiconductor device according to claim 13, wherein scanning with the laser light is performed a certain number of times by changing the focal point.
15. The method of manufacturing a semiconductor device according to claim 13, wherein when scanning with the laser light is performed, the modification region is formed adjacent to the division guide pattern.
16. A semiconductor device comprising a semiconductor element and a division guide pattern in a lamination formed on a semiconductor substrate, wherein
a modification region formed in the semiconductor substrate and a cleavage surface extending from the modification region to the division guide pattern exist in a division surface along the division guide pattern forming a side surface of the semiconductor device.