We claim:
1. An apparatus for separating a discrete element from a first substrate web moving at a first speed and applying said discrete element onto a second substrate web moving at a second speed, said apparatus comprising:
a first station for making lines of perforations across a width, at least partially through a thickness, and at predetermined spaced apart intervals along a length of said first substrate web; and
a second station for separating said discrete element from said first substrate web at a first of said lines of perforations and placing said discrete element on said second substrate web.
2. The apparatus of claim 1, wherein said first station includes a perforation cutter assembly having first and second rollers, said first roller having least one anvil-type member with a flat cutting surface for being cut against, said at least one anvil-type member being partially embedded in and having said flat cutting surface extending radially outwardly from an outer circumferential surface of said first roller, and said second roller having at least one discontinuous cutting blade extending from an outer circumferential surface thereof, whereby said first and second rollers are timed to rotate so that said at least one cutting blade contacts said flat cutting surface of said at least one anvil-type member to make said lines of perforations at said spaced intervals along said length of said first substrate web to form said pre-perforated first substrate web.
3. The apparatus of claim 2, wherein said at least one discontinuous cutting blade comprises a rectangular metal plate having two long sides, each long side having a discontinuous cutting edge.
4. The apparatus of claim 3, wherein said first station further includes a conveyor assembly for conveying said pre-perforated first substrate web from said perforation assembly to said second station.
5. The apparatus of claim 2, further comprising a web guide located prior to said second station, wherein said web guide keeps said first substrate web centered during operation of said apparatus.
6. The apparatus of claim 1, wherein said second station includes a separation and transfer mechanism having at least one separation and transfer segment for separating and transferring said discrete element from said pre-perforated first substrate web to said second substrate web.
7. The apparatus of claim 6, wherein said at least one separation and transfer segment includes first, second, and third separation and transfer segments.
8. The apparatus of claim 7, wherein said first, second, and third separation and transfer segments each include a holding means for holding said pre-perforated first substrate web against an outer surface thereof and for holding said discrete element, once separated from said pre-perforated first substrate web, against an outer surface thereof.
9. The apparatus of claim 8, wherein said holding means is vacuum assisted.
10. The apparatus of claim 1, further comprising an adhesive applicator assembly for applying adhesive to a first surface of said first substrate web in order for said discrete element separated from said first substrate web to be adhered to said second substrate web.
11. The apparatus of claim 10, wherein said adhesive applicator assembly for applying adhesive to said first surface of said first substrate web is preferably located between said first and second stations.
12. The apparatus of claim 1, wherein said first substrate web comprises stretchable material which has been stretched prior to entering said first station so that both said discrete element and said first substrate web re main stretched after said discrete element is separated from said first substrate web and after said discrete element is transferred from said second station onto said second substrate web.
13. A method of separating a discrete element from a first substrate web moving at a first speed and applying said discrete element onto a second substrate web moving at a second speed, said method comprising the steps of:
making lines of perforations across a width, at least partially through a thickness, and at predetermined spaced apart intervals along a length of said first substrate web;
separating said discrete element from said first substrate web along a first of said lines of perforations; and
placing said discrete element on said second substrate web.
14. The method of claim 13, wherein making said lines of perforations in said first substrate web forms a pre-perforated first substrate web for transport to a separation and transfer mechanism having at least first, second, and third separation and transfer segments.
15. The method of claim 14, wherein moving said pre-perforated first substrate web onto an outer surface of said first and second separation and transfer segments occurs between making said lines of perforation and separating said discrete element.
16. The method of claim 15, wherein vacuum holding of said pre-perforated first substrate web onto said outer surface of said first and second separation and transfer segments is accomplished after moving said pre-perforated first substrate web onto said first and second separation and transfer segments.
17. The method of claim 16, wherein separating said discrete element from said first substrate web at said first of said lines of perforations is done by accelerating said first separation and transfer segment so that said first separation and transfer segment moves away from said second separation and transfer segment, which is initially adjacent to said first separation and transfer segment.
18. The method of claim 17, wherein placing said discrete element includes rotating said separation and transfer mechanism around a central axis thereof in a range of from approximately 90 degrees to approximately 180 degrees.
19. The method of claim 18, wherein after said separation and transfer mechanism is rotated, pivoting said first separation and transfer platform vacuum holding said discrete element thereon around an axis perpendicular to said central axis of said separation and transfer mechanism, said pivoting being in a range of from approximately 90 degrees to approximately 180 degrees.
20. The method of claim 19, further comprising releasing vacuum so that said discrete piece vacuumed adhered to said first separation and transfer platform can be placed on said second substrate web.
21. The method of claim 13, further comprising between making said lines of perforations and separating said discrete element, applying adhesive to a first surface of said first substrate web.
22. The method of claim 13, wherein prior to making lines of perforations in said first substrate web, stretching a stretchable material of said first substrate web so that said stretchable material of both said discrete element and said first substrate web remains stretched after said discrete element is separated from said first substrate web and said discrete element is transferred to said second substrate web.
23. The method of claim 13, wherein making said lines of perforation includes entirely cutting through said thickness of said first substrate web.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of encapsulating an integrated circuit package, the method comprising:
attaching an integrated circuit die having a plurality of bonding pads formed thereon to a lead frame having a plurality of leads;
electrically connecting at least some of the leads to at least some of the bond pads;
encasing the integrated circuit die and at least a portion of the lead frame within a cavity of a mould comprising a mould top portion having a relief and a mould bottom portion, the mould top and bottom portions shaped such that when joined together to encase the integrated circuit die, the mould substantially closes spaces between adjacent leads of the lead frame while allowing the leads to extend out of the cavity, and the relief produces a narrow peripheral moulded flange when filled with a resin that supports the integrated circuit die, wherein the formed peripheral moulded flange includes a narrow flat surface which supports the integrated circuit die along the peripheral edge of the integrated circuit die and wherein the peripheral moulded flange includes an opening that is surrounded by the peripheral moulded flange and wherein the opening does not provide support to some portion of the integrated circuit die;
introducing the resin into the cavity to encapsulate the integrated circuit die;
clamping down the lead frame; and
separating the encapsulated integrated circuit die from the lead frame by severing the leads with a punch that is cleared from cutting into a moulded flange by a guide so that the entire punching action is used to sever the lead only and avoids stressing the edges of the integrated circuit die.
2. The method of claim 1 wherein the integrated circuit die is attached to a lead frame die pad that is integrally connected to an outer frame of the lead frame by a plurality of tie bars.
3. The method of claim 2 wherein the mould substantially prevents resin injected into the cavity during the injecting step from flowing out of the cavity between adjacent leads.
4. The method of claim 1 wherein the top portion of the mould includes a plurality of stepped structures positioned and sized such that when the top mould portion is engaged with the bottom mould portion to encase an integrated circuit die, each stepped structure projects towards the bottom mould portion into a space between adjacent leads to substantially close the space.