1. A method of manufacturing silicon nano wires, the method comprising:
forming microgrooves on a silicon substrate,
forming a first doping layer doped with a first dopant on the silicon substrate, and forming a second doping layer doped with a second dopant between the first doping layer and the silicon substrate;
forming a metal layer on the silicon substrate;
forming catalysts by heating the metal layer within the microgrooves; and
growing the nano wires between the catalysts and the silicon substrate using a thermal process.
2. The method of claim 1, wherein the forming of the microgrooves comprises:
forming a microgroove structure by oxidizing a surface of the silicon substrate to form a silicon oxide layer; and
exposing the microgroove structure by removing the silicon oxide layer.
3. The method of claim 1, wherein, the forming of the metal layer comprises depositing a catalyst material.
4. The method of claim 1, wherein, the forming of the metal layer comprises coating a transition metal.
5. The method of claim 1, wherein the metal layer comprises one of Au, Ni, Ti, Fe, and a combination including at least one of the foregoing.
6. The method of claim 1, wherein the growing the nano wires comprises controlling a temperature and atmospheric pressure of the thermal process.
7. The method of claim 1, wherein the thermal process is performed at a temperature higher than a eutectic temperature of the catalysts and the silicon substrate.
8. The method of claim 1, wherein the growing the nano wires comprises forming an oxide layer on sides of the nano wires after forming the nano wires.
9. The method of claim 1, wherein the first dopant is a p-type dopant, and the second dopant is an n-type dopant.
10. The method of claim 1, wherein the first dopant is an n-type dopant, and the second dopant is a p-type dopant.
11. The method of claim 1, wherein, growing of the nano wires comprises forming a p-n junction structure in the nano wires, the p-n structure comprising a first doping region and a second doping in the nano wires.
12. A silicon nano wire structure comprising:
a p-n junction structure in which a first doping region and a second doping region are formed; and
a metal catalyst on one end of each of the nano wires.
13. The silicon nano wires of claim 12, wherein the metal catalyst comprises a transition metal.
14. The silicon nano wires of claim 12, wherein the metal catalyst comprises one of Au, Ni, Ti, Fe and a combination including at least one of the foregoing.
15. A semiconductor device comprising:
a semiconductor substrate including a plurality of microgrooves on a surface of the semiconductor substrate;
nano wires formed in each of the microgrooves, extending in a direction substantially perpendicular to the semiconductor substrate, and having a p-n junction structure in which a first doping region and a second doping region are formed; and
a metal catalyst formed on an end of each of the nano wires.
16. The semiconductor device of claim 15, wherein the microgrooves comprise a substantially uniform distribution.
17. The semiconductor device of claim 15, further comprising an oxide layer on sides of the nano wires.
18. The semiconductor device of claim 15, further comprising intermediate layers between the nano wires disposed substantially perpendicular to the microgrooves.
19. The semiconductor device of claim 18, wherein the intermediate layers comprises a photoresist material.
20. The semiconductor device of claim 15, further comprising:
a first electrode formed on a region of the semiconductor substrate on which the nano wires are not formed; and
a second electrode formed on the nano wires.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A modular cross flow fan, comprising:
a housing having an upper wall, a lower wall and two side boards, wherein the upper wall, the lower wall and the two side boards define an accommodating space therebetween, the housing is formed with an inflow opening and an outflow opening, and the inflow direction of the inflow opening and the outflow direction of the outflow opening lie in a line;
a cross flow fan disposed in the accommodating space; and
a motor, disposed at the housing and connected to the cross flow fan.
2. The modular cross flow fan according to claim 1, wherein the two side boards are disposed at two opposite ends of the housing, the upper wall is connected to the upper ends of the two side boards, the lower wall is connected to the lower ends of the two side boards, and the upper ends of the two side boards and the lower ends of the two side boards have shapes corresponding respectively to the cross-sectional shapes of the upper wall and the lower wall.
3. The modular cross flow fan according to claim 1, wherein the upper wall has a first board body, a second board body and a third board body, the first board body is connected between the second board body and the third board body, the third board is proximal to the side of the housing with the inflow opening, the second board body is proximal to the side of the housing with the outflow opening, the second board body and the third board body are horizontal, the first board body is slanted, and the height of the first board body decreases in the direction from the inflow opening to the outflow opening.
4. The modular cross flow fan according to claim 1, wherein the upper wall has a first board body, a second board body and a first opening, the first board body is arranged between the second board body and the first opening, the first board body is connected to the second board body, the first opening is proximal to the side of the housing with the inflow opening, the second board body is proximal to the side of the housing with the outflow opening, the second board body is horizontal, the first board body is slanted, and the height of the first board body decreases in the direction from the inflow opening to the outflow opening.
5. The modular cross flow fan according to claim 1, wherein the upper wall has a first board body, a first opening and a second opening, the first board body is arranged between the first opening and the second opening, the first opening is proximal to the side of the housing with the inflow opening, the second opening is proximal to the side of the housing with the outflow opening, the first board body is slanted, and the height of the first board body decreases in the direction from the inflow opening to the outflow opening.
6. The modular cross flow fan according to claim 1, wherein the upper wall has a first board body, a second board body and a first opening, the first board body is arranged between the second board body and the first opening, the first board body is connected to the second board body, the first opening is proximal to the side of the housing with the inflow opening, the second board body is proximal to the side of the housing with the outflow opening, the first board body and the second board body are slanted, the height of the first board body decreases in the direction from the inflow opening to the outflow opening, and the height of the second board body increases in the direction from the inflow opening to the outflow opening.
7. The modular cross flow fan according to claim 1, wherein the inflow opening and the outflow opening are respectively formed on two opposite sides of the housing.
8. An air conditioning device, comprising:
a modular cross flow fan having a housing, a cross flow fan and a motor, wherein the housing has an upper wall, a lower wall and two side boards, the upper wall, the lower wall and the two side boards define an accommodating space therebetween, the housing is formed with an inflow opening and an outflow opening, the inflow direction of the inflow opening and the outflow direction of the outflow opening lie in a line, the cross flow fan is disposed in the accommodating space, and the motor is disposed at the housing and connected to the cross flow fan;
a flow channel joined to the inflow opening of the modular cross flow fan; and
a heat exchanger disposed in the flow channel proximal to the inflow opening of the modular cross flow fan.
9. The air conditioning device according to claim 8, wherein the two side boards are disposed at two opposite ends of the housing, the upper wall is connected to the upper ends of the two side boards, the lower wall is connected to the lower ends of the two side boards, and the upper ends of the two side boards and the lower ends of the two side boards have shapes corresponding respectively to the cross-sectional shapes of the upper wall and the lower wall.
10. The air conditioning device according to claim 8, wherein the upper wall has a first board body, a second board body and a third board body, the first board body is connected between the second board body and the third board body, the third board is proximal to the side of the housing with the inflow opening, the second board body is proximal to the side of the housing with the outflow opening, the second board body and the third board body are horizontal, the first board body is slanted, and the height of the first board body decreases in the direction from the inflow opening to the outflow opening.
11. The air conditioning device according to claim 8, wherein a partition board is arranged between the housing and flow channel, the partition board has an upper partition board and a lower partition board, the upper partition board is connected to the flow channel and the side of the third board body proximal to the inflow opening, and the lower partition board is connected to the flow channel and the side of the lower wall proximal to the inflow opening.
12. The air conditioning device according to claim 8, wherein the cross flow fan and the heat exchanger lie in a line.