1. An ejection device comprising:
a nozzle plate comprising a silicon substrate having a first surface and a second surface;
a plurality of first nozzle portions each having a circular cross-section, each of the first nozzle portions formed in the silicon substrate;
a plurality of second nozzle portions each having a circular cross-section, each of the second nozzle portions formed on the second surface of the silicon substrate, and communicating with a corresponding first nozzle portion, the circular cross-section of each of the first nozzle portions being smaller than the circular cross-section of each of the second nozzle portions, the first and second nozzle portions forming nozzles each having a cross-section smaller stepwise from a rear end toward a front end of each nozzle; and
a recess formed on the first surface of the silicon substrate, the recess having a flat bottom surface commonly communicating with the plurality of first nozzle portions such that the front end of each of the nozzles is exposed to the recess; and
wherein the plurality of first and second nozzle portions are formed by applying dry-etching by plasma discharge to the second surface of the silicon substrate, and the recess is formed by applying wet-anisotropic-etching to the first surface of the silicon substrate.
2. An ejection device according to claim 1, wherein the plurality of first and second nozzle portions are formed by patterning a stepwise exposed portion on a resist film formed on the second surface of the silicon substrate and applying dry-etching by plasma discharge to the stepwise exposed portion.
3. An inkjet head comprising:
a nozzle plate comprising a silicon substrate having a first surface and a second surface;
a plurality of first nozzle portions each having a circular cross-section, each of the first nozzle portions formed in the silicon substrate;
a plurality of second nozzle portions each having a circular cross-section, each of the second nozzle portions formed on the second surface of the silicon substrate, and communicating with a corresponding first nozzle portion, the circular cross-section of each of the first nozzle portions being smaller than the circular cross-section of each of the second nozzle portions, the first and second nozzle portions forming nozzles each having a cross-section smaller stepwise from a rear end toward a front end of each nozzle;
a recess formed on the first surface of the silicon substrate, the recess having a flat bottom surface commonly communicating with the plurality of first nozzle portions such that the front end of each of the nozzles is exposed to the recess; and
a second substrate including ink passages, the second substrate being bonded to the second surface of the silicon substrate such that each ink passage communicates with a rear end of a corresponding one of the nozzles; and
wherein the first nozzle portions and the second nozzle portions are formed by applying dry-etching by plasma discharge to the second surface of the silicon substrate, and the recess is formed by applying wet-anisotropic-etching to the first surface of the silicon substrate.
4. An inkjet head according to claim 3, wherein the first and second nozzle portions are formed by patterning a stepwise exposed portion on a resist film formed on the second surface of the silicon substrate and applying dry-etching by plasma discharge to the stepwise exposed portion.
5. An inkjet head according to claim 3, further comprising:
a plurality of pressure generators each corresponding to an ink passage;
a plurality of terminal portions that each supply a control signal to a corresponding pressure generator; and
a through-hole formed in the silicon substrate that exposes the terminal portions.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A board placement system for a printed circuit board having multiple interconnected printed circuit board units, comprising:
a reference platform including a work surface and an opening formed in said work surface;
a micro-adjusting unit provided within said reference platform, and including a micro-adjusting table, and a support seat which is disposed on said micro-adjusting table, which is located within said opening, and which is flush with said work surface, said micro-adjusting table being capable of bringing said support seat to move and rotate relative to said work surface;
a measuring unit disposed on said reference platform and including a camera for measuring planar precision, and a laser for measuring levelness; and
a computer device connected electrically to said micro-adjusting unit and said measuring unit, and capable of driving said measuring unit to move along a predetermined work path.
2. The board placement system according to claim 1, wherein said micro-adjusting table is operable to bring said support seat to move relative to said work surface along an X-axis direction, a Y-axis direction, and a Z-axis direction.
3. The board placement system according to claim 2, wherein a first axial line passing through midpoints of two opposite sides of said support seat, a second axial line passing through midpoints of two other sides of said support seat, and a third axial line at an intersection of said first and second axial lines and parallel to the Z-axis direction are defined, said micro-adjusting table being capable of driving said support seat to rotate relative to said work surface with said first, second and third axial lines as axes, respectively.
4. The board placement system according to claim 1, further comprising a mechanical arm disposed on said reference platform, said mechanical arm including a first support frame disposed on a rear side of said reference platform, and a second support frame disposed on a front side of said first support frame and located above said work surface, said first support frame being movable leftward and rightward relative to said reference platform along an X-axis direction, said second support frame being movable forward and rearward along a Y-axis direction and being movable upward and downward along a Z-axis direction relative to said first support frame.
5. The board placement system according to claim 4, wherein said camera and said laser of said measuring unit are respectively disposed at a bottom end of said second support frame.
6. The board placement system according to claim 4, further comprising a glue injecting unit disposed at a bottom end of said second support frame and capable of operation along a work path.
7. The board placement system according to claim 4, further comprising a glue clearing unit disposed at a bottom end of said second support frame and capable of operation along a work path.
8. The board placement system according to claim 7, wherein said glue clearing unit is a high-speed glue clearing head.
9. The board placement system according to claim 6, further comprising a curing unit disposed at the bottom end of said second support frame.
10. The board placement system according to claim 9, wherein said glue injecting unit is capable of injecting ultraviolet curable glue, and said curing unit is a light source capable of radiating ultraviolet light.
11. The board placement system according to claim 1, wherein said work surface is provided with a positioning member in the form of a positioning frame.
12. The board placement system according to claim 1, wherein said work surface is provided with a positioning member in the form of a plurality of insert pins.
13. The board placement system according to claim 1, wherein a top face of said support seat is provided with a plurality of positioning members in the form of positioning pins.