1. A speckle reducing system for reducing speckle on a display screen, the system comprising:
at least one actuating element located proximate to, but not in physical contact with, a display screen;
wherein the at least one actuating element is configured to generate waves directed towards the display screen, the waves impacting the display screen to impart vibration to the display screen, wherein the vibration reduces speckle on the display screen, wherein the at least actuating element comprises at least one electromagnetic wave generator, and the waves generated are electromagnetic waves.
2. A speckle reducing system according to claim 1, wherein the waves impart vibration to the display screen at a velocity larger than one-half of an optical wavelength of light divided by the integration time of the eye of the viewer.
3. A speckle reducing system according to claim 2, wherein the velocity of the vibration of the display screen is greater than about 20 Hz.
4. A speckle reducing system according to claim 1, wherein the screen may be excited at an excitation frequency which is a low frequency.
5. A speckle reducing system according to claim 4, wherein the excitation frequency is in the range of 10 Hz to 100 Hz.
6. A speckle reducing system according to claim 1, the waves impact the screen at a frequency substantially equal to a resonance frequency of the screen.
7. A speckle reducing system according to claim 1, wherein the at least actuating element comprises at least one audio speaker, and the waves generated are sound waves.
8. A speckle reducing system according to claim 7, wherein the at least one audio speaker is located behind the screen, in front of the screen, or a combination thereof.
9. A speckle reducing system according to claim 7, wherein the at least one audio speaker also provides audio content for media displayed on the screen.
10. A speckle reducing system according to claim 7, wherein the sounds waves comprise an audio frequency greater than or lesser than a frequency that can be heard by a viewer.
11. A speckle reducing system according to claim 1, further comprising a plurality of radiating antennas located on a surface of the display screen, each of the plurality of radiating antennas configured to receive electromagnetic waves thereby imparting the vibration to the display screen.
12. A speckle reducing system according to claim 11, wherein the plurality of radiating antennas are located on a back surface of the screen, on a front surface of the screen, or a combination thereof.
13. A method of reducing speckle on a display screen, the method comprising:
positioning at least one actuating element proximate to, but not in physical contact with, a display screen;
generating waves with the at least one actuating element; and
directing the generated waves towards the display screen, the waves impacting the display screen to impart vibration to the display screen, wherein the vibration reduces speckle on the display screen, wherein the at least actuating element comprises at least one electromagnetic wave generator, and generating waves comprises generating electromagnetic waves.
14. A method according to claim 13, wherein the waves impart vibration to the display screen at a velocity larger than one-half of an optical wavelength of light divided by the integration time of the eye of the viewer.
15. A method according to claim 14, wherein the velocity of the vibration of the display screen is greater than about 20 Hz.
16. A method according to claim 13, wherein the screen may be excited at an excitation frequency which is bandwidth limited.
17. A method according to claim 16, wherein the excitation frequency is in the range of 10 Hz to 100 Hz.
18. A method according to claim 13, the waves impact the screen at a frequency substantially equal to a resonance frequency of the screen.
19. A method according to claim 13, wherein the at least actuating element comprises at least one audio speaker, and generating waves comprises generating sound waves.
20. A method according to claim 19, wherein directing waves towards the screen further comprises directing waves towards the back surface of the screen, towards the front surface of the screen, or a combination thereof.
21. A method according to claim 19, further comprising providing audio content for media displayed on the screen while generating the sound waves using the at least one audio speaker.
22. A method according to claim 19, wherein generating sounds waves comprises generating sound waves at an audio frequency greater than or lesser than a frequency that can be heard by a viewer.
23. A method according to claim 13, further comprising positioning a plurality of radiating antennas on a surface of the display screen, each of the plurality of radiating antennas configured to receive electromagnetic waves thereby imparting the vibration to the display screen.
24. A method according to claim 23, further comprising positioning the plurality of radiating antennas on a back surface of the screen, on a front surface of the screen, or a combination thereof.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A silane adduct as expressed formula below,
6
wherein, X is a dehydrogenated form selected from one of epoxy compounds, amino compounds and bisphenolics; and R1 is a organoalkyi group, which is one of the functional group selected among glycidyloxypropyl group, 2-(3,4-epoxycyclohexyl)ethyl group, 3-acryloxypropyl group, 3-methacryloxypropyl group, amino-propyl group, 3-2-(2-aminoethylamino)ethylaminopropyl group, N-methylaminopropyl group, N-phenylaminopropyl group, N, N-dimethyl-3-aminopropyl group, mercapto-propyl group, cyano-propyl group, and isocyanato-propyl group.
2. The silane adduct according to claim 1, wherein the epoxy compound is selected from one of diglycidyl ether of bisphenol A (Mn38050,000), diglycidyl ether of bisphenol F (Mn3404,000), phenol-novolac epoxy, o-cresol novolac epoxy, bisphenol A-novolac epoxy, and diglycidyl terephtalate.
3. The silane adduct according to claim 1, wherein the amino compound is selected from one of imidazole, piperidine, dicyandiamide, 4,4,-diaminodiphenylsulfone(DDS), 4,4-diaminodiphenylmethane(DDM), 4,4-diaminodiphenylpropane, 4,4-oxydianiline, 1,4-cyclohexanediamine, hexamethylenediamine, heptamethylenediamine, nonamethylenediamine, decamethylenediamine, 2,4-diaminotoluene, and 2,6-diaminotoluene.
4. The silane adduct according to claim 1, wherein the bisphenolics is selected from one of 4,4-isopropylidene diphenol, 4,4-isopropylidenebis(2,6-dimethyl phenol), 4,4-ethylidenebisphenol, Bis(4-hydroxyphenyl)methane, 4,4-(1,3-phenylenediisopropylidene)bisphenol, 4,4-(1,4-phenylenedi-isopropylidene)bisphenol, 4,4-Sulfonyldiphenol, 4,4-cyclohexylidene bisphenol, and bis(4-hydroxyphenyl)-2,2-dichloroethylene.
5. A manufacturing method of a silane adduct as expressed formula 1 according to the reaction 2.
7
reaction 2
(RO)3SiR13XX3SiR13ROH
wherein, X is selected from one of epoxy compounds, amino compounds and bisphenolics. Here, (a) the epoxy compounds above is selected one of diglycidyl ether of bisphenol A (Mn38050,000), diglycidyl ether of bisphenol F (Mn3404,000), phenol-novolac epoxy, o-cresol novolac epoxy, bisphenol A-novolac epoxy and diglycidyl terephtalate;
(b) The amino compounds is selected from one of imidazole, piperidine, dicyandiamide, 4,4,-diaminodiphenyisulfone(DDS), 4,4-diaminodiphenylmethane (DDM), 4,4-diaminodiphenylpropane, 4,4-oxydianiline, 1,4-cyclohexanediamine, hexamethylenediamine, heptamethylenediamine, nonamethylenediamine, decamethylenediamine, 2,4-diaminotoluene, and 2,6-diaminotoluene;
(c) The bisphenolics is selected from one of 4,4-isopropylidene diphenol, 4,4-isopropylidenebis (2,6-dimethyl phenol), 4,4-ethylidenebisphenol, Bis(4-hydroxyphenyl)methane, 4,4-(1,3-phenylenediisopropylidene)bisphenol, 4,4-(1,4-phenylenedi-isopropylidene)bisphenol, 4,4-Sulfonyldiphenol, 4,4-cyclohexylidene bisphenol, and bis(4-hydroxyphenyl)-2,2-dichloroethylene and;
R1 is a organoalkyl group, which is one of the functional group selected among glycidyloxypropyl group, 2-(3,4-epoxycyclohexyl)ethyl group, 3-acryloxypropyl group, 3-methacryloxypropyl group, amino-propyl group, 3-2-(2-aminoethylamino)ethylaminopropyl group, N-methylaminopropyl group, N-phenylaminopropyl group, N, N-dimethyl-3-aminopropyl group, mercapto-propyl group, cyano-propyl group, and isocyanato-propyl group and;
R is a methyl or ethyl group.
6. A manufacturing method of a silane adduct as expressed formula 1 which is made by adding organic material X of 50 to 500 weight %, triphenylophospine of 0.1 to 5 weight %, and a silane coupling agent of 10 to 100 weight % as expressed formula 2 to a solvent of 200 to 500 ml which is selected from one of waterethanol co-solvent of 5:95 to 20:80 weight %, ethanol, toluene, n-hexane, methylene chloride, chloroform, trichloroethene, tetrachloroethene, N,N-dimethylformamide(DMF), N,N-dimethylacetamide(DMAc), and dimethyl sulfoxide(DMSO); and reacting the added materials;
8
wherein X is a dehydrogenated form selected from one of epoxy compounds, amino compounds and bisphenolics and;
R1 is an organo-alkyl group selected from one of glycidyloxypropyl group, 2-(3,4-epoxycyclohexyl)ethyl group, 3-acryloxypropyl group, 3-methacryloxypropyl group, amino-propyl group, 3-2-(2-aminoethylamino)ethylaminopropyl group, N-methylaminopropyl group, N-phenylaminopropyl group, N, N-dimethyl-3-aminopropyl group, mercapto-propyl group, cyano-propyl group, and isocyanato-propyl group and;
R is a methyl or ethyl group.
7. A manufacturing method of a silane adduct according to claim 6, wherein the epoxy compound is selected from one of diglycidyl ether of bisphenol A (Mn38050,000), diglycidyl ether of bisphenol F (Mn3404,000), phenol-novolac epoxy, o-cresol novolac epoxy, bisphenol A-novolac epoxy, and diglycidyl terephtalate.
8. A manufacturing method of a silane adduct according to claim 6, wherein the amino compound is selected from one of imidazole, piperidine, dicyandiamide, 4,4,-diaminodiphenylsulfone(DDS), 4,4-diaminodiphenylmethane(DDM), 4,4-diaminodiphenylpropane, 4,4-oxydianiline, 1,4-cyclohexanediamine, hexamethylenediamine, heptamethylenediamine, nonamethylenediamine, decamethylenediamine, 2,4-diaminotoluene, and 2,6-diaminotoluene.
9. A manufacturing method of a silane adduct according to claim 6, wherein the bisphenolic is one of 4,4-isopropylidene diphenol, 4,4-isopropylidenebis(2,6-dimethyl phenol), 4,4-ethylidenebisphenol, Bis(4-hydroxyphenyl)methane, 4,4-(1,3-phenylenediisopropylidene)bisphenol, 4,4-(1,4-phenylenedi-isopropylidene)bisphenol, 4,4-Sulfonyldiphenol, 4,4-cyclohexylidene bisphenol, and bis(4-hydroxyphenyl)-2,2-dichloroethylene.
10. A manufacturing method of a silane adduct according to claim 6, wherein the reaction is stirred with a speed of 100500 rpm at 50200 C. for 28 hours.
11. A manufacturing method of a silane adduct according to claim 10, wherein the reaction step further comprises continuously removing by-product produced according as the reaction proceeds.
12. A manufacturing method of a silane adduct according to claim 10, further comprises refluxing the solution thereto.
13. A manufacturing method of a silane adduct according to claim 6, wherein in the case that waterethanol or ethanol is chosen as a solvent, an acetate acid of 0.010.5 weight % to 100 weight % solvent is added thereto.
14. A method of bonding organic die attach adhesive to inorganics using compounds of claim 1.
15. A method of bonding according to claim 14 wherein said adhesive is one of epoxy resin, polyimide resin, polyimide-siloxane resin, and siloxane resin.
16. A method of bonding according to claim 14 wherein said inorganic is one of metal, glass, printed circuit board (PCB) and ceramic.