1460901373-4feb0243-0206-411b-a1e3-97ea8c7377cb

What is claimed is:

1. A voice recognition apparatus comprising:
a voice input device for receiving a voice input from a user;
a recognition processing device for performing a recognition processing to determine a plurality of word candidates corresponding to said voice input, through a matching processing with respective standby words in preset standby word groups;
a judging device for judging as whether or not said plurality of word candidates include a correct answer; and
a setting device for determining a combination of most recognizable candidates in said plurality of word candidates and convertible word candidates thereof and setting same for said standby word groups to be used in a next recognition processing, in case where said judging device judges that said plurality of word candidate does not include the correct answer.
2. The apparatus as claimed in claim 1, wherein:
said setting device comprises:
an analyzing unit for analyzing phonemes, which composes respective word candidates, for each of said plurality of word candidates and the convertible word candidates thereof; and
a setting unit for setting a combination of word candidates, which have a smallest number of same phoneme, as said standby words.
3. The apparatus as claimed in claim 1, wherein:
said setting device comprises:
an analyzing unit for analyzing phonemes, which composes respective word candidates, for each of said plurality of word candidates and the convertible word candidates thereof; and
a setting unit for setting a combination of word candidates, which have a smallest number of same phoneme and a largest total number of phoneme, as said standby words.
4. The apparatus as claimed in claim 1, wherein:
said setting device includes a standby error word in said standby word groups, said standby error word indicating that the voice input from the user corresponds to a word candidate other than the word candidates included in said standby words.
5. The apparatus as claimed in claim 4, wherein:
said setting device comprises a storage unit for storing the standby word groups as previously used, said setting device setting a last standby word group, which is stored in said storage unit, for the standby word groups to be used in the next recognition processing, in case where said judging device judges said standby error word as the correct answer.
6. The apparatus as claimed in claim 4, wherein:
said standby error word is others and convertible words thereof.
7. The apparatus as claimed in claim 4, wherein:
when the voice input from said user includes said standby error word, the word candidates other than the word candidate corresponding to said standby error ward, of the word candidates in said standby word groups at this time are excluded from the word candidate to be included in a next standby word groups.
8. The apparatus as claimed in claim 1, further comprising:
an informing device for informing said user of the standby words, which belong to the standby word groups as set by said setting device, through at least one of output of synthesized voice and character representation, in case where said judging device judges that said plurality of word candidates includes no correct answer.
9. The apparatus as claimed in claim 1, wherein:
said judging device eases criteria by which said word candidates are to be judged as the correct answer, every time said recognition processing is repeated.
10. The apparatus as claimed in claim 9, wherein:
said judging device judges, when reliability of the word candidate exceeds a predetermined threshold, said word candidate as the correct answer, and decreases said threshold, every time said recognition processing is repeated.
11. A voice recognition program to be executed by a computer, wherein said program causes said computer to function as:
a voice input device for receiving a voice input from a user;
a recognition processing device for performing a recognition processing to determine a plurality of word candidates corresponding to said voice input, through a matching processing with respective standby words in preset standby word groups;
a judging device for judging as whether or not said plurality of word candidates include a correct answer; and
a setting device for determine a combination of most recognizable candidates in said plurality of word candidates and convertible word candidates thereof and set same for said standby word groups to be used in a next recognition processing, in case where said judging device judges that said plurality of word candidate does not include the correct answer.
12. The apparatus as claimed in claim 4, wherein:
said setting device determines the combination of most recognizable candidates in said plurality of word candidates, convertible word candidates thereof and said standby error word and sets same for said standby word groups to be used in the next recognition processing.
13. A voice recognition apparatus comprising:
a voice input device for receiving a voice input from a user;
a recognition processing device for performing a recognition processing to determine a plurality of word candidates corresponding to said voice input, through a matching processing with respective standby words in preset standby word groups;
a judging device for judging as whether or not said plurality of word candidates include a correct answer; and
a setting device for determining a combination of most recognizable candidates in convertible word candidates of said plurality of word candidates and setting same for said standby word groups to be used in a next recognition processing, in case where said judging device judges that said plurality of word candidate does not include the correct answer.
14. The apparatus as claimed in claim 13, wherein:
said setting device comprises:
an analyzing unit for analyzing phonemes, which composes respective word candidates, for each of the convertible word candidates of said plurality of word candidates; and
a setting unit for setting a combination of word candidates, which have a smallest number of same phoneme, as said standby words.
15. The apparatus as claimed in claim 13, wherein:
said setting device comprises:
an analyzing unit for analyzing phonemes, which composes respective word candidates, for each of the convertible word candidates of said plurality of word candidates; and
a setting unit for setting a combination of word candidates, which have a smallest number of same phoneme and a largest total number of phoneme, as said standby words.
16. The apparatus as claimed in claim 13, wherein:
said setting device includes a standby error word in said standby word groups, said standby error word indicating that the voice input from the user corresponds to a word candidate other than the word candidates included in said standby words.
17. The apparatus as claimed in claim 16, wherein:
said setting device comprises a storage unit for storing the standby word groups as previously used, said setting device setting a last standby word group, which is stored in said storage unit, for the standby word groups to be used in the next recognition processing, in case where said judging device judges said standby error word as the correct answer.
18. The apparatus as claimed in claim 16, wherein:
said standby error word is others and convertible words thereof.
19. The apparatus as claimed in claim 16, wherein:
when the voice input from said user includes said standby error word, the word candidates other than the word candidate corresponding to said standby error ward, of the word candidates in said standby word groups at this time are excluded from the word candidate to be included in a next standby word groups.
20. The apparatus as claimed in claim 13, further comprising:
an informing device for informing said user of the standby words, which belong to the standby word groups as set by said setting device (8), through at least one of output of synthesized voice and character representation, in case where said judging device judges that said plurality of word candidates includes no correct answer.
21. The apparatus as claimed in claim 13, wherein:
said judging device eases criteria by which said word candidates are to be judged as the correct answer, every time said recognition processing is repeated.
22. The apparatus as claimed in claim 21, wherein:
said judging device judges, when reliability of the word candidate exceeds a predetermined threshold, said word candidate as the correct answer, and decreases said threshold, every time said recognition processing is repeated.
23. A voice recognition program to be executed by a computer, wherein said program causes said computer to function as:
a voice input device for receiving a voice input from a user;
a recognition processing device for performing a recognition processing to determine a plurality of word candidates corresponding to said voice input, through a matching processing with respective standby words in preset standby word groups;
a judging device for judging as whether or not said plurality of word candidates include a correct answer; and
a setting device for determine a combination of most recognizable candidates in convertible word candidates of said plurality of word candidates and set same for said standby word groups to be used in a next recognition processing, in case where said judging device judges that said plurality of word candidate does not include the correct answer.
24. The apparatus as claimed in claim 13, wherein:
said setting device determines the combination of most recognizable candidates in the convertible word candidates of said plurality of word candidates and said standby error word and sets same for said standby word groups to be used in the next recognition processing.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A microelectronic assembly, comprising:
a MEMS substrate;
a MEMS device on the MEMS substrate, the MEMS device having a MEMS component which is movable relative to the MEMS substrate;
a cover piece having a side over a side of the MEMS substrate on which the MEMS device is located; and
a plurality of perimeter components, each having opposing portions sealing with the MEMS substrate and the cover piece respectively, the perimeter components forming a continuous perimeter around the MEMS device to seal the MEMS device.
2. The microelectronic assembly of claim 1, further comprising:
a plurality of interconnection elements between the MEMS substrate and the cover piece, the cover piece being a carrier substrate and the interconnection elements connecting the carrier substrate electrically to the MEMS substrate.
3. The microelectronic assembly of claim 2, wherein the interconnection elements are within the perimeter.
4. The microelectronic assembly of claim 3, wherein each interconnection element includes a respective solder ball and a respective land to which the respective solder ball is soldered, and each perimeter piece includes a respective bar and a respective pad to which the respective bar is soldered.
5. The microelectronic assembly of claim 1, further comprising:
a thermal interface component placed over the MEMS substrate, heated so that edge portions thereof reflow and drop onto the cover piece over the MEMS device, and allow it to cool.
6. The microelectronic assembly of claim 5, further comprising:
a heat sink on the thermal interface component.
7. The microelectronic assembly of claim 5, further comprising:
an electronic component on the thermal interface material; and
wirebonding wires connecting the electronic component with the cover piece over the MEMS device.
8. The microelectronic assembly of claim 5, further comprising:
a plurality of interconnection elements between the MEMS substrate and the cover piece, the cover piece being the carrier substrate and the interconnection elements connecting the carrier substrate electrically to the MEMS substrate.
9. The microelectronic assembly of claim 8, wherein the interconnection elements are within the perimeter.
10. The microelectronic assembly of claim 1, further comprising:
a plurality of interconnection elements between the MEMS substrate and the cover piece, the cover piece being a carrier substrate and the interconnection elements connecting the carrier substrate electrically to the MEMS substrate, the interconnection elements being located outside the perimeter.
11. The microelectronic assembly of claim 10, wherein each interconnection element includes a respective solder ball and a respective land to which the respective solder ball is soldered, and each perimeter piece includes a respective bar and a respective pad to which the respective bar is soldered.
12. The microelectronic assembly of claim 10, wherein the perimeter forms a continuous ring around the MEMS device to seal the MEMS device.
13. The microelectronic assembly of claim 10, wherein the perimeter components have gaps between them so that the perimeter is not continuous around the MEMS device.
14. The microelectronic assembly of claim 1, further comprising:
a support substrate, the MEMS substrate being placed on the support substrate;
first contact pads on the MEMS substrate outside the perimeter;
second contact pads on the support substrate; and
wirebonding wires connecting each one of the first contact pads with a respective one of the second contact pads.
15. The microelectronic assembly of claim 14, wherein the perimeter forms a continuous ring around the MEMS device to seal the MEMS device.
16. The microelectronic assembly of claim 14, wherein the perimeter components form gaps between them so that the perimeter is not continuous around the MEMS device.
17. A microelectronic assembly, comprising:
a first substrate;
a second substrate having a side facing aside of the first substrate;
a plurality of interconnection, elements between the first and second substrates, the interconnection elements connecting the first substrate electrically to the second substrate; and
a plurality of perimeter components, each having opposing portions sealing with the first substrate and the second substrate respectively, the perimeter components forming a perimeter around the interconnection elements wherein the perimeter components have gaps between them so that the perimeter is not continuous around the interconnection elements.
18. The microelectronic assembly of claim 17, wherein each interconnection element includes a respective solder ball and a respective land to which the respective solder ball is soldered, and each perimeter piece includes a respective bar and a respective pad to which the respective bar is soldered.
19. A microelectronic assembly, comprising:
a MEMS substrate;
a MEMS device on the MEMS substrate, the MEMS device having a MEMS component which is movable relative to the MEMS substrate;
a cover piece having a side over a side of the MEMS substrate on which the MEMS device is located;
a plurality of perimeter components, each having opposing portions sealing with the MEMS substrate and the cover piece respectively, the perimeter components forming a perimeter around the MEMS device; and
a plurality of interconnection elements between the MEMS substrate and the cover piece, the cover piece being a carrier substrate and the interconnection elements connecting the carrier substrate electrically to the MEMS substrate, the interconnection elements being located outside the perimeter.
20. The microelectronic assembly of claim 19, wherein each interconnection element includes a respective solder ball and a respective land to which the respective solder ball is soldered, and each perimeter piece includes a respective bar and a respective pad to which the respective bar is soldered.
21. The microelectronic assembly of claim 19, wherein the perimeter forms a continuous ring around the MEMS device to seal the MEMS device.
22. A microelectronic assembly, comprising:
a MEMS substrate;
a MEMS device on the MEMS substrate, the MEMS device having a MEMS component which is movable relative to the MEMS substrate;
a cover piece having a side over a side of the MEMS substrate on which the MEMS device is located;
a plurality of perimeter components, each having opposing portions sealing with the MEMS substrate and the cover piece respectively, the perimeter components forming a perimeter around the MEMS device;
a support substrate, the MEMS substrate being placed on the support substrate;
first contact cads on the MEMS substrate outside the perimeter;
second contact pads on the support substrate; and
wirebonding wires connecting each one of the first contact pads with a respective one of the second contact pads.
23. The microelectronic assembly of claim 22, wherein the perimeter forms a continuous ring around the MEMS device to seal the MEMS device.
24. The microelectronic assembly of claim 22, wherein the perimeter components form gaps between them so that the perimeter is not continuous around the MEMS device.
25. A microelectronic assembly, comprising:
a first substrate;
a second substrate having a side facing a side of the first substrate;
a plurality of interconnection elements between the first and second substrates, the interconnection elements connecting the first substrate electrically to the second substrate wherein each interconnection element includes a respective solder ball and a respective land to which the respective solder ball is soldered;
a plurality of perimeter components, each having opposing portions sealing with the first substrate and the second substrate respectively, the perimeter components forming a perimeter around the interconnection elements, and each perimeter component includes a respective bar and a respective pad to which the respective bar is soldered.