1. An operation device comprising:
a screen display section configured to display a login screen on a touch panel;
a key position changing section configured to change positions of a plurality of keys that are displayed on the login screen such that the plurality of keys are displayed for a current login process at positions that are different from previous positions at which the plurality of keys were displayed for a previous login process;
a key information reception section configured to receive a press of a key on the login screen among the plurality of keys and generate input information representing the key pressed;
a storage section; and
a key information determination section configured to determine whether or not a combination of pieces of input information corresponding to a plurality of key presses that are performed by a user on the login screen matches registration information preregistered in the storage section, and allow login of the user when the combination of the pieces of input information matches the registration information and not allow login of the user when the combination of the pieces of input information does not match the registration information.
2. The operation device according to claim 1, wherein
once one of the plurality of keys is pressed, the key position changing section defines the one key being pressed as a first key and the others of the plurality of keys as second keys, and arranges the second keys around the first key.
3. The operation device according to claim 2, wherein
the second keys are candidate keys that are each suited to be pressed after the first key.
4. The operation device according to claim 2, wherein
each of the plurality of keys has a circular shape, and the first key has a larger diameter than the second keys.
5. The operation device according to claim 2, wherein
the second keys are arranged around the first key in a radial fashion.
6. The operation device according to claim 2, wherein
a background color in each of the second keys changes in response to a press thereof.
7. The operation device according to claim 1, wherein
the key position changing section changes the positions of the plurality of keys randomly.
8. The operation device according to claim 1, wherein
in response to a press of a key among the plurality of keys, the key information reception section:
temporarily holds input information representing the key pressed;
determines whether or not the press of the key is a press and hold; and
when the press of the key is a press and hold, deletes the input information representing the key pressed and held.
9. An operation method comprising:
displaying, on a first login screen displayed for a current login process, a plurality of keys at positions that are different from positions at which the plurality of keys were displayed on the first login screen displayed for a previous login process;
receiving a press of a key among the plurality of keys and generating input information representing the key pressed; and
displaying, on a second login screen displayed for the current login process based on the generated input information, the plurality of keys at positions that are different from positions at which the plurality of keys were displayed on the second login screen displayed for the previous login process.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A light sensor comprising:
a substrate having a surface;
one or more photodetectors formed in the substrate, the one or more photodetectors configured to detect light and provide a signal in response thereto;
one or more color pass filters positioned over the surface and configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors;
an IR suppression filter positioned over the surface and configured to filter infrared light to at least substantially block infrared light from reaching the one or more photodetectors;
a buffer layer formed over the surface of the substrate to furnish insulation to the one or more color pass filters;
a transparent substrate positioned over the IR suppression filter; and
a through-substrate via formed in the substrate and configured to provide an electrical interconnect with the one or more photodetectors,
wherein the IR suppression filter comprises a contiguous IR suppression filter disposed continuously over the plurality of color pass filters and the plurality of photodetectors.
2. The light sensor as recited in claim 1, further comprising one or more color pass filters formed proximate to the IR suppression filter and configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors.
3. The light sensor as recited in claim 2, further comprising:
an adhesion layer formed over the surface for holding the one or more color pass filters in position.
4. The light sensor as recited in claim 3, wherein the one or more color filters is formed on the adhesion layer, the buffer layer is formed over the surface such that the buffer layer substantially encapsulates the one or more color pass filters.
5. The light sensor as recited in claim 2, wherein the one or more photodetectors comprises a clear photodetector, the clear photodetector configured to receive light unfiltered by a color pass filter to detect an ambient light environment.
6. The light sensor as recited in claim 1, wherein the one or more photodetectors comprise at least one of photodiodes or phototransistors.
7. The light sensor as recited in claim 1, further comprising a dark current sensor configured to provide dark current.
8. A light sensor comprising:
a substrate having a surface;
a plurality of photodetectors formed in the substrate and configured to detect light and to provide a signal in response thereto;
a plurality of color pass filters positioned over the surface and configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors, each color pass filter corresponding to a respective photodetector;
a first buffer layer positioned over the surface such that the buffer layer at least substantially encapsulates the one or more color pass filters;
an IR suppression filter disposed over the buffer layer and configured to filter infrared light to at least substantially block infrared light from reaching the plurality of photodetectors;
a second buffer layer positioned over the IR suppression filter;
a transparent substrate positioned over the second buffer layer; and
a through-substrate via formed in the substrate and configured to provide an electrical interconnect with the one or more photodetectors,
wherein the IR suppression filter comprises a contiguous IR suppression filter disposed continuously over the plurality of color pass filters and the plurality of photodetectors.
9. The light sensor as recited in claim 8, wherein the first buffer layer and the second buffer layer comprise a Benzocyclobutene (BCB) polymer.
10. The light sensor as recited in claim 8, further comprising a clear photodetector, the clear photodetector configured to receive light unfiltered by the one or more color pass filters to detect an ambient light environment.
11. The light sensor as recited in claim 8, wherein the transparent substrate is bonded to IR suppression filter with via the second buffer layer.
12. The light sensor as recited in claim 8, further comprising an adhesion layer disposed between the surface and the plurality of color pass filters.
13. The light sensor as recited in claim 8, further comprising:
an insulation layer disposed over the surface such that the insulation layer substantially encapsulates the one or more color filters, the buffer layer, and the IR suppression filter.
14. The light sensor as recited in claim 8, further comprising a dark current sensor configured to provide dark current.
15. A process comprising:
forming one or more photodetectors in a substrate, the one or more photodetectors configured to detect light and to provide a signal in response thereto;
forming one or more color pass filters over a surface of the substrate, the one or more color pass filters configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors;
forming a buffer layer over the one or more color pass filters;
forming an IR suppression filter on a transparent substrate, the IR suppression filter configured to at least substantially block infrared light from reaching the surface and the transparent substrate configured to facilitate formation of the IR suppression filter; and
forming a through-substrate via in the substrate to provide an electrical interconnect with the one or more photodetectors,
wherein the IR suppression filter comprises a contiguous IR suppression filter disposed continuously over the plurality of color pass filters and the plurality of photodetectors.
16. The process as recited in claim 15, further comprising positioning the IR suppression filter and the glass substrate over the buffer layer and bonding the IR suppression filter to the buffer layer.
17. The process as recited in claim 15, wherein forming the one or more color pass filters further comprises:
forming an adhesion layer over the surface, the adhesion layer configured to hold the one or more color pass filters in position; and
forming the one or more color pass filters on the adhesion layer.
18. The process as recited in claim 15, further comprising forming an edge trim region about an edge of the substrate.
19. The process as recited in claim 15, wherein the buffer layer is a Benzocyclobutene (BCB) based polymer.
20. The process as recited in claim 15, wherein the buffer layer at least substantially encapsulates the color pass filters.
21. The process as recited in claim 15, wherein the one or more photodetectors, the one or more color pass filters, and the buffer layer are formed at wafer level, and wherein the wafer is thereafter diced into one or more dies, at least one of the dies being packaged individually to form a light sensor.
22. The process as recited in claim 15, wherein the one or more photodetectors, the one or more color pass filters, and the buffer layer are formed at wafer level, and wherein the wafer is further processed using wafer level packaging (WLP) and diced to form one or more light sensors.