1. A process for making a column for a rack comprising:
providing a first elongate channel comprising a web and a pair of longitudinal flanges extending therefrom a front face of the web, wherein each longitudinal flange has a distal end, and wherein the flanges and web define a trough;
providing a second elongate channel comprising a web and a pair of longitudinal flanges extending therefrom a front face of the web, wherein each longitudinal flange has a distal end; and
affixing the second elongate channel to the first elongate channel such that the front face of the web of the first elongate channel substantially faces the front face of the web of the second elongate channel, wherein the web of the first elongate channel is spaced a predetermined distance from the web of the second elongate channel, and wherein the pair of longitudinal flanges on the second elongate channel is substantially deformable.
2. The process of claim 1, wherein at least one of the distal ends of the longitudinal flanges on the second elongate channel is positioned substantially within the trough.
3. The process of claim 1, wherein the distal ends of the longitudinal flanges on the second elongate channel are positioned substantially within the trough.
4. The process of claim 1, wherein the second elongate channel is manufactured by cold-forming an elongate plate of structural steel.
5. The process of claim 1, wherein the step of affixing the second elongate channel to the first elongate channel comprises welding a portion of each respective flange of the first elongate channel to a portion of the respective adjacent flange of the second elongate channel.
6. The process of claim 5, wherein the welding step produces at least one bead of weld on a joint between respective flanges of the first and second elongate channels, and wherein each bead of weld extends outwardly away from a portion of the flange of the second elongate channel and does not extend past a plane defined by the distal end and a proximal end of the flange of the first elongate channel.
7. A column manufactured by the process of claim 1.
8. A column comprising:
a first elongate channel comprising a web and a pair of longitudinal flanges extending therefrom a front face of the web, wherein each longitudinal flange has a distal end, and wherein the flanges and web define a trough;
a second elongate channel comprising a web and a pair of longitudinal flanges extending therefrom a front face of the web, wherein each longitudinal flange has a distal end, wherein the second elongate channel is affixed to the first elongate channel such that the front face of the web of the first elongate channel substantially faces the front face of the web of the second elongate channel, wherein the web of the first elongate channel is spaced a predetermined distance from the web of the second elongate channel, and wherein the distal ends of the longitudinal flanges on the second elongate channel are positioned substantially within the trough.
9. The column of claim 8, wherein the pair of longitudinal flanges on the second elongate channel is substantially deformable, enabling them to be force fit into a portion of the trough.
10. The column of claim 8, wherein the second elongate channel is manufactured by cold-forming an elongate plate of structural steel.
11. The column of claim 8, wherein the first elongate channel is affixed to the second elongate channel by welding a portion of each respective flange of the first elongate channel to a portion of the respective adjacent flange of the second elongate channel.
12. The column of claim 11, further comprising a bead of weld on a joint between respective flanges of the first and second elongate channels, and wherein each bead of weld extends outwardly away from a portion of the flange of the second elongate channel and does not extend past a plane defined by the distal end and a proximal end of the flange of the first elongate channel.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A circuit board connection structure having a first circuit board and a second circuit board bonded together with a conductive resin layer,
wherein the first circuit board has a first terminal region including a plurality of first terminal electrodes arranged in a first direction and a dummy electrode placed next to the first terminal region in the first direction,
the second circuit board has a second terminal region including a plurality of second terminal electrodes arranged in the first direction,
the second terminal region is placed to face the first terminal region via the conductive resin layer, the respective second terminal electrodes being electrically connected to the corresponding first terminal electrodes, and
the conductive resin layer covers at least part of the dummy electrode, and the at least part of the dummy electrode covered with the conductive resin layer has a plurality of openings.
2. The circuit board connection structure of claim 1, wherein the plurality of openings are arranged in the first direction and a second direction substantially perpendicular to the first direction.
3. The circuit board connection structure of claim 1, wherein the plurality of openings are arranged in a matrix in the first direction and a second direction substantially perpendicular to the first direction.
4. The circuit board connection structure of claim 1, wherein each of the plurality of openings has a side parallel to the first direction and a side parallel to a second direction substantially perpendicular to the first direction.
5. The circuit board connection structure of claim 1, wherein the plurality of openings have an identical shape and size.
6. The circuit board connection structure of claim 1, wherein the conductive resin layer has a first side extending in the first direction and a second side extending in a second direction substantially perpendicular to the first direction, the first side crosses the plurality of first terminal electrodes, and the second side is located on the dummy electrode.
7. The circuit board connection structure of claim 1, wherein at least part of a periphery of the dummy electrode has a concave and convex shape, and the first side of the conductive resin layer crosses the periphery of the concave and convex shape.
8. The circuit board connection structure of claim 1, wherein the dummy electrode has a misalignment check mark.
9. The circuit board connection structure of claim 1, wherein an outermost first terminal electrode located outermost in the first direction among the plurality of first terminal electrodes is electrically connected with an outermost second terminal electrode located outermost in the first direction among the plurality of second terminal electrodes, and
the outermost first terminal electrode has a third side extending in the first direction, and the third side has a concave and convex shape.
10. The circuit board connection structure of claim 9, wherein the outermost first terminal electrode has two fourth sides extending in a second direction substantially perpendicular to the first direction, and the distance between the two fourth sides is greater than a width of each of the plurality of first terminal electrodes other than the outermost first terminal electrode in the first direction.
11. The circuit board connection structure of claim 1, wherein the first circuit board is a printed circuit board, and the second circuit board is a flexible board.
12. A display device having the circuit board connection structure of claim 1, comprising a display panel having at least one substrate, the second circuit board connected to the at least one substrate, and the first circuit board.
13. The display device of claim 12, wherein the display panel is a liquid crystal panel, an organic EL panel, an inorganic EL panel or a PDP.
14. A display device having the circuit board connection structure of claim 1, comprising a display panel having the first circuit board as at least one substrate, and the second circuit board.
15. The display device of claim 14, wherein the display panel is a liquid crystal panel, an organic EL panel, an inorganic EL panel or a PDP.
16. A circuit board connection structure having a first circuit board and a second circuit board bonded together with a conductive resin layer,
wherein the first circuit board has a first terminal region including a plurality of first terminal electrodes arranged in a first direction,
the second circuit board has a second terminal region including a plurality of second terminal electrodes arranged in the first direction,
the second terminal region is placed to face the first terminal region via the conductive resin layer, the respective second terminal electrodes being electrically connected to the corresponding first terminal electrodes,
an outermost first terminal electrode located outermost in the first direction among the plurality of first terminal electrodes is electrically connected with an outermost second terminal electrode located outermost in the first direction among the plurality of second terminal electrodes, and
the outermost first terminal electrode has a first side extending in the first direction, and the first side has a concave and convex shape.
17. The circuit board connection structure of claim 16, wherein the outermost first terminal electrode has two second sides extending in a second direction substantially perpendicular to the first direction, and the distance between the two second sides is greater than a width of each of the plurality of first terminal electrodes other than the outermost first terminal electrode in the first direction.
18. The circuit board connection structure of claim 16, wherein the concave and convex shape of the first side of the outermost first terminal electrode has a plurality of third sides substantially parallel to the first direction and a plurality of fourth sides substantially parallel to a second direction substantially perpendicular to the first direction.
19. The circuit board connection structure of claim 18, wherein the conductive resin layer has a fifth side extending in the first direction, and the fifth side crosses the plurality of fourth sides of the outermost first terminal electrode.
20. The circuit board connection structure of claim 16, wherein the outermost first terminal electrode has a plurality of openings.
21. The circuit board connection structure of claim 20, wherein the plurality of openings are arranged in the first direction and a second direction substantially perpendicular to the first direction.
22. The circuit board connection structure of claim 20, wherein the plurality of openings are arranged in a matrix in the first direction and a second direction substantially perpendicular to the first direction.
23. The circuit board connection structure of claim 20, wherein each of the plurality of openings has a side parallel to the first direction and a side parallel to a second direction substantially perpendicular to the first direction.
24. The circuit board connection structure of claim 20, wherein the conductive resin layer has a fifth side extending in the first direction and a sixth side extending in a second direction substantially perpendicular to the first direction, and
at least part of the fifth side is placed in at least one opening among the plurality of openings of the outermost first terminal electrode, and at least part of the sixth side is placed in at least one opening among the plurality of openings of the outermost first terminal electrode.
25. The circuit board connection structure of claim 20, wherein the plurality of openings have an identical shape and size.
26. The circuit board connection structure of claim 16, wherein the first circuit board further has a dummy electrode placed next to the first terminal region in the first direction, the conductive resin layer covers at least part of the dummy electrode, and the at least part of the dummy electrode covered with the conductive resin layer has a plurality of openings.
27. The circuit board connection structure of claim 26, wherein the plurality of openings of the dummy electrode are placed in a matrix in the first direction and a second direction substantially perpendicular to the first direction.
28. The circuit board connection structure of claim 26, wherein the conductive resin layer has a sixth side extending in a second direction substantially perpendicular to the first direction, and the sixth side is located on the dummy electrode.
29. The circuit board connection structure of claim 26, wherein at least part of a periphery of the dummy electrode has a concave and convex shape, the conductive resin layer has a fifth side extending in the first direction, and the fifth side of the conductive resin layer crosses the periphery of the concave and convex shape.
30. The circuit board connection structure of claim 16, wherein the first circuit board is a printed circuit board, and the second circuit board is a flexible board.
31. A display device having the circuit board connection structure of claim 16, comprising a display panel having at least one substrate, the second circuit board connected to the at least one substrate, and the first circuit board.
32. The display device of claim 31, wherein the display panel is a liquid crystal panel, an organic EL panel, an inorganic EL panel or a PDP.
33. A display device having the circuit board connection structure of claim 16, comprising a display panel having the first circuit board as at least one substrate, and the second circuit board.
34. The display device of claim 33, wherein the display panel is a liquid crystal panel, an organic EL panel, an inorganic EL panel or a PDP.
35. A circuit board connection structure having a first circuit board and a second circuit board bonded together with a conductive resin layer,
wherein the first circuit board has a first terminal region including a plurality of first terminal electrodes arranged in a first direction,
the second circuit board has a second terminal region including a plurality of second terminal electrodes arranged in the first direction,
the second terminal region is placed to face the first terminal region via the conductive resin layer, the respective second terminal electrodes being electrically connected to the corresponding first terminal electrodes, and
an outermost first terminal electrode located outermost in the first direction among the plurality of first terminal electrodes is electrically connected with an outermost second terminal electrode located outermost in the first direction among the plurality of second terminal electrodes, and the outermost first terminal electrode has a plurality of openings.
36. The circuit board connection structure of claim 35, wherein the outermost first terminal electrode has two first sides extending in a second direction substantially perpendicular to the first direction, and the distance between the two first sides is greater than a width of each of the plurality of first terminal electrodes other than the outermost first terminal electrode in the first direction.
37. The circuit board connection structure of claim 35, wherein the plurality of openings are arranged in the first direction and a second direction substantially perpendicular to the first direction.
38. The circuit board connection structure of claim 35, wherein the plurality of openings are arranged in a matrix in the first direction and a second direction substantially perpendicular to the first direction.
39. The circuit board connection structure of claim 35, wherein each of the plurality of openings has a side parallel to the first direction and a side parallel to a second direction substantially perpendicular to the first direction.
40. The circuit board connection structure of claim 35, wherein the conductive resin layer has a second side extending in the first direction and a third side extending in a second direction substantially perpendicular to the first direction, and
at least part of the second side is placed in at least one opening among the plurality of openings of the outermost first terminal electrode, and at least part of the third side is placed in at least one opening among the plurality of openings of the outermost first terminal electrode.
41. The circuit board connection structure of claim 35, wherein the plurality of openings have an identical shape and size.
42. The circuit board connection structure of claim 35, wherein the first circuit board further has a dummy electrode placed next to the first terminal region in the first direction, the conductive resin layer covers at least part of the dummy electrode, and the at least part of the dummy electrode covered with the conductive resin layer has a plurality of openings.
43. The circuit board connection structure of claim 42, wherein the plurality of openings of the dummy electrode are placed in a matrix in the first direction and a second direction substantially perpendicular to the first direction.
44. The circuit board connection structure of claim 42, wherein the conductive resin layer has a third side extending in a second direction substantially perpendicular to the first direction, and the third side is located on the dummy electrode.
45. The circuit board connection structure of claim 42, wherein at least part of a periphery of the dummy electrode has a concave and convex shape, the conductive resin layer has a second side extending in the first direction, and the second side of the conductive resin layer crosses the periphery of the concave and convex shape.
46. The circuit board connection structure of claim 35, wherein the first circuit board is a printed circuit board, and the second circuit board is a flexible board.
47. A display device having the circuit board connection structure of claim 35, comprising a display panel having at least one substrate, the second circuit board connected to the at least one substrate, and the first circuit board.
48. The display device of claim 47, wherein the display panel is a liquid crystal panel, an organic EL panel, an inorganic EL panel or a PDP.
49. A display device having the circuit board connection structure of claim 35, comprising a display panel having the first circuit board as at least one substrate, and the second circuit board.
50. The display device of claim 49, wherein the display panel is a liquid crystal panel, an organic EL panel, an inorganic EL panel or a PDP.
51. A method for forming a connection structure of a first circuit board and a second circuit board bonded together with a conductive resin layer, the method comprising the steps of:
preparing the first circuit board having a first terminal region including a plurality of first terminal electrodes arranged in a first direction and a dummy electrode placed next to the first terminal region in the first direction, the dummy electrode having a plurality of openings arranged in the first direction and a second direction substantially perpendicular to the first direction;
preparing the second circuit board having a second terminal region including a plurality of second terminal electrodes arranged in a third direction, the plurality of second terminal electrodes having an outermost second terminal electrode located outermost in the third direction;
forming the conductive resin layer to cover at least part of each of the plurality of first terminal electrodes and at least part of the dummy electrode;
determining relative positions of the dummy electrode and the outermost second terminal electrode based on an optical pattern obtained by placing the second terminal region to face the first terminal region via the conductive resin layer so that the first direction and the third direction are parallel to each other and optically detecting placement of the plurality of openings of the dummy electrode;
aligning the first circuit board and the second circuit board with each other based on the determined relative positions; and
bonding the first circuit board and the second circuit board together by setting the conductive resin layer.
52. The method for forming a connection structure of claim 51, wherein the step of determining relative positions comprises the steps of:
taking images of the first circuit board and the second circuit board with an image pickup device; and
determining the relative positions of the dummy electrode and the outermost second terminal electrode using a difference between the reflectivity of a region of the dummy electrode other than the plurality of openings and the reflectivity of the plurality of openings and a difference between the reflectivity of a region of the second circuit board other than the outermost second terminal electrode and the reflectivity of the outermost second terminal electrode.
53. A method for forming a connection structure of a first circuit board and a second circuit board bonded together with a conductive resin layer, the method comprising the steps of:
preparing the first circuit board having a first terminal region including a plurality of first terminal electrodes arranged in a first direction, the plurality of first terminal electrodes having an outermost first terminal electrode located outermost in the first direction, the outermost first terminal electrode having a first side extending in the first direction, the first side having a concave and convex shape;
preparing the second circuit board having a second terminal region including a plurality of second terminal electrodes arranged in a second direction, the plurality of second terminal electrodes having an outermost second terminal electrode located outermost in the second direction;
forming the conductive resin layer to cover at least part of each of the plurality of first terminal electrodes;
determining relative positions of the outermost first terminal electrode and the outermost second terminal electrode based on an optical pattern obtained by placing the second terminal region to face the first terminal region via the conductive resin layer so that the first direction and the second direction are parallel to each other and optically detecting the concave and convex shape and placement of the first side of the outermost first terminal electrode;
aligning the first circuit board and the second circuit board with each other based on the determined relative positions; and
bonding the first circuit board and the second circuit board together by setting the conductive resin layer.
54. The method for forming a connection structure of claim 53, wherein in the step of preparing the first circuit board, the first circuit board further has a dummy electrode located next to the first terminal region in the first direction, the dummy electrode having a plurality of openings, and
in the step of forming the conductive resin layer, the conductive resin layer is formed to cover the plurality of openings of the dummy electrode.
55. The method for forming a connection structure of claim 53, wherein the step of determining relative positions comprises the steps of:
taking images of the first circuit board and the second circuit board with an image pickup device; and
determining the relative positions of the outermost first terminal electrode and the outermost second terminal electrode using a difference between the reflectivity of a region of the first circuit board other than the outermost first terminal electrode and the reflectivity of the outermost first terminal electrode and a difference between the reflectivity of a region of the second circuit board other than the outermost second terminal electrode and the reflectivity of the outermost second terminal electrode.
56. A method for forming a connection structure of a first circuit board and a second circuit board bonded together with a conductive resin layer, the method comprising the steps of:
preparing the first circuit board having a first terminal region including a plurality of first terminal electrodes arranged in a first direction, the plurality of first terminal electrodes having an outermost first terminal electrode located outermost in the first direction, the outermost first terminal electrode having a plurality of openings;
preparing the second circuit board having a second terminal region including a plurality of second terminal electrodes arranged in a second direction, the plurality of second terminal electrodes having an outermost second terminal electrode located outermost in the second direction;
forming the conductive resin layer to cover at least part of each of the plurality of first terminal electrodes;
determining relative positions of the outermost first terminal electrode and the outermost second terminal electrode based on an optical pattern obtained by placing the second terminal region to face the first terminal region via the conductive resin layer so that the first direction and the second direction are parallel to each other and optically detecting placement of the plurality of openings of the outermost first terminal electrode;
aligning the first circuit board and the second circuit board with each other based on the determined relative positions; and
bonding the first circuit board and the second circuit board together by setting the conductive resin layer.
57. The method for forming a connection structure of claim 56, wherein in the step of preparing the first circuit board, the first circuit board further has a dummy electrode located next to the first terminal region in the first direction, the dummy electrode having a plurality of openings, and
in the step of forming the conductive resin layer, the conductive resin layer is formed to cover the plurality of openings of the dummy electrode.
58. The method for forming a connection structure of claim 56, wherein the step of determining relative positions comprises the steps of:
taking images of the first circuit board and the second circuit board with an image pickup device; and
determining the relative positions of the outermost first terminal electrode and the outermost second terminal electrode using a difference between the reflectivity of a region of the first circuit board other than the outermost first terminal electrode and the reflectivity of the outermost first terminal electrode and a difference between the reflectivity of a region of the second circuit board other than the outermost second terminal electrode and the reflectivity of the outermost second terminal electrode.