1. A semiconductor light emitting element comprising:
multiple semiconductor layers formed on a substrate and then delaminated therefrom, wherein
a two-dimensional periodic structure is formed in a first principal surface of the multiple semiconductor layers which was in contact with the substrate.
2. The semiconductor light emitting element of claim 1, wherein the substrate is made of silicon.
3. The semiconductor light emitting element of claim 1, wherein the multiple semiconductor layers include an active layer for generating light, the semiconductor light emitting element further comprising:
a first electrode provided on a second principal surface of the multiple semiconductor layers and having a reflectivity of 80% or more with respect to a peak wavelength of the light generated in the active layer; and
a second electrode provided on a region of the first principal surface of the multiple semiconductor layers in which the two-dimensional periodic structure is not formed.
4. A semiconductor light emitting element comprising:
a substrate having a two-dimensional periodic structure in a principal surface thereof; and
multiple semiconductor layers formed over the principal surface of the substrate and including an active layer for generating light, wherein
the substrate is made of silicon.
5. A semiconductor light emitting element comprising:
a substrate having a two-dimensional periodic structure in a principal surface thereof; and
multiple semiconductor layers formed over the principal of the substrate and including an active layer for generating light, wherein
a cavity is formed locally between the principal surface of the substrate and a first principal surface of the multiple semiconductor layers.
6. A method for fabricating a semiconductor light emitting element, the method comprising the steps of:
(a) forming a first two-dimensional periodic structure in a principal surface of a substrate;
(b) forming multiple semiconductor layers over the first two-dimensional periodic structure; and
(c) delaminating the multiple semiconductor layers from the substrate.
7. The method of claim 6, wherein the step (b) includes the step of forming a first principal surface of the multiple semiconductor layers into a configuration complementary to the first two-dimensional periodic structure.
8. The method of claim 7, wherein the configuration complementary to the first two-dimensional structure which is formed in the step (b) is composed of a depressed portion, the method further comprising the step of:
after the step (c), increasing a depth of the depressed portion or changing a cross-sectional configuration of the depressed portion by allowing electricity to flow in the multiple semiconductor layers in an electrolytic solution.
9. The method of claim 6, wherein the substrate is made of silicon.
10. The method of claim 6, wherein the step (c) is performed by at least either of polishing of the substrate or wet etching of the substrate.
11. The method of claim 6, wherein the step (c) is performed by a laser lift-off process.
12. The method of claim 6, wherein the substrate removed in the step (c) is reusable.
13. The method of claim 7, further comprising the step of:
after the step (c), performing wet etching under a condition where an etching speed differs depending on a crystal plane to form a second two-dimensional periodic structure composed of polygonal projections or depressions in the first principal surface of the multiple semiconductor layers.
14. The method of claim 6, wherein the step (b) includes forming the multiple semiconductor layers such that a cavity is formed in a local region of an interface between the principal surface of the substrate and a back surface of the multiple semiconductor layers.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A detachable and retrievable stent assembly comprising:
an introducer sheath;
a self-expanding stent having a pre-deployed configuration, an initially deployed configuration, and a fully deployed configuration; the stent having a plurality of adjacent strut members being affixed to one another, the adjacent strut members having a plurality of curved portions; wherein, at least in the fully deployed configuration, at least six of the plurality of the adjacent strut members are directly affixed to one another along their curved portions at a plurality of joints and the curved portions of adjacent strut members are tangential to one another at the joints; and
a push wire having a severable junction; in the pre-deployed configuration, the push wire being connected to the stent at the severable junction; the push wire and stent being disposed within the introducer sheath when the stent is in the pre-deployed configuration;
the stent having a smaller diameter in the pre-deployed configuration than in the initially deployed and fully deployed configurations and the stent having substantially the same diameter in the initially deployed configuration as in the fully deployed configuration.
2. The detachable and retrievable stent assembly of claim 1, wherein the stent is a wire stent.
3. The detachable and retrievable stent assembly of claim 2, wherein the plurality of adjacent strut members define a stent proximal portion, a stent distal portion, and an intermediate portion between the stent proximal and distal portions;
the adjacent strut members of the stent distal portion including six longitudinally directed strut members forming three pairs of distal strut members, wherein in an fully deployed configuration, the three pairs of distal strut members are circumferentially offset from one another.
4. The detachable and retrievable stent assembly of claim 3 further comprising a retrieved configuration, wherein in a retrieved configuration, the stent has a smaller diameter than in the initially deployed and fully deployed configurations.
5. The detachable and retrievable stent assembly of claim 4, wherein, in the initially deployed configuration, the stent is disposed exteriorly to the introducer sheath and connected to the push wire, in the retrieved configuration the stent is disposed within the introducer sheath and connected to the push wire, and in the fully deployed configuration the stent is disposed exteriorly to the introducer sheath and disconnected from the push wire.
6. The detachable and retrievable stent assembly of claim 5 further comprising a proximal marker, the proximal marker being distal and immediately adjacent to the severable junction, wherein the adjacent strut members of the stent proximal portion include at least three proximal strut members, the at least three proximal strut members engaged to one another and to the proximal marker.
7. The detachable and retrievable stent assembly of claim 6, wherein the at least three proximal strut members are parallel to one another in the pre-deployed configuration.
8. A detachable and retrievable stent assembly comprising:
an introducer catheter;
a self-expanding wire stent having an unexpanded configuration and an expanded configuration, opposing proximal and distal portions, and an intermediate portion between the proximal and distal portions;
the proximal, distal, and intermediate portions comprising a plurality of adjacent strut members being affixed to one another, the adjacent strut members defining a plurality of closed cells;
the strut members of the stent distal portion comprising six longitudinally directed strut members being affixed one to another to form three pairs of distal strut members, wherein in an expanded configuration, the three pairs of distal strut members are circumferentially offset from one another; and
a push wire having a severable junction; the push wire being connected to the stent at the severable junction; the push wire and stent being disposed within the introducer catheter when the stent is in an unexpanded configuration.
9. The stent assembly of claim 8, wherein the wire stent further comprises a plurality of radiopaque markers attached thereto.
10. The stent assembly of claim 8, wherein at least two of the adjacent strut members that are affixed to one another extend longitudinally along the stent and undulate toward and away from one another, the at least two of the adjacent strut members that are affixed to one another being connected to one another at a plurality of joints.