1-44. (canceled)
45. A medical device for removing an object from a body comprising:
a retrieval basket having a distal section and a proximal section, at least two strands extending through the proximal section of the retrieval basket, at least three prestressed filaments extending from a distal end of each of the at least two strands through the distal section of the retrieval basket, wherein the filaments are spaced from each other through the entire distal section of the retrieval basket between a proximal end of the filaments and a distal end of the filaments, the filaments converging at a distal end of the distal section of the retrieval basket, the filaments being entwined to form each of the at least two strands.
46. The medical device of claim 45, wherein the filaments are connected to a substantially straight end-cap at the distal end of the distal section of the retrieval basket.
47. The medical device of claim 46, wherein a distal end of the end-cap is a distalmost end of the medical device.
48. The medical device of claim 45, wherein the at least three filaments extending from a distal end of each of the at least two strands comprises four filaments.
49. The medical device of claim 45 further comprising a flexible sheath having a lumen extending longitudinally therein; and
an elongate member connected to the at least two strands, wherein the elongate member is configured to be received in the lumen of the sheath.
50. The medical device of claim 49, wherein the retrieval basket is configured to be received in a collapsed configuration within the lumen.
51. The medical device of claim 50, wherein the retrieval basket is configured to expand outward when the retrieval basket is outside of the lumen, wherein prestress on the at least two strands causes them to diverge so that the retrieval basket expands.
52. A medical device for removing an object from a body comprising:
a retrieval basket having a distal section and a proximal section, at least two strands extending through the proximal section of the retrieval basket, at least three prestressed filaments extending from a distal end of each of the at least two strands through the distal section of the retrieval basket, wherein the filaments are spaced from each other through the entire distal section of the retrieval basket between a proximal end of the filaments and a distal end of the filaments, the filaments converging at a distal end of the distal section of the retrieval basket, wherein a space between the at least two strands is entirely open for capturing an object between the strands.
53. The medical device of claim 52, wherein the filaments are entwined to form each of the at least two strands.
54. The medical device of claim 52, wherein the filaments are connected to a substantially straight end-cap at the distal end of the distal section of the retrieval basket.
55. The medical device of claim 54, wherein a distal end of the end-cap is a distalmost end of the medical device.
56. The medical device of claim 52, wherein the at least two strands are prestressed to diverge from each other.
57. The medical device of claim 52, wherein the at least three prestressed filaments extending from a distal end of each of the at least two strands comprises four filaments.
58. The medical device of claim 52 further comprising a flexible sheath having a lumen extending longitudinally therein; and
an elongate member connected to the at least two strands, wherein the elongate member is configured to be received in the lumen of the sheath.
59. A medical device for removing an object from a body comprising:
a flexible sheath having a proximal end, a distal end, and a lumen extending longitudinally between the proximal end and the distal end; and
a retrieval basket configured to be received in a collapsed configuration within the lumen, the retrieval basket configured to expand outward when the retrieval basket is outside of the lumen, the retrieval basket comprising a distal section and a proximal section, at least two prestressed strands extending through the proximal section of the retrieval basket, and at least three prestressed filaments extending from a distal end of each of the at least two strands through the distal section of the retrieval basket, wherein when the retrieval basket is outside of the lumen, the prestress on the at least two strands causes them to diverge, and the filaments are spaced from each other through the entire distal section of the retrieval basket between a proximal end of the filaments and a distal end of the filaments, the filaments converging at a distal end of the distal section of the retrieval basket.
60. The medical device of claim 59, wherein the filaments are entwined to form each of the at least two strands.
61. The medical device of claim 59, wherein a space between the at least two strands is entirely open for capturing an object between the strands.
62. The medical device of claim 59, wherein the filaments are connected to a substantially straight end-cap at the distal end of the distal section of the retrieval basket.
63. The medical device of claim 62, wherein a distal end of the end-cap is a distalmost end of the medical device.
64. The medical device of claim 59 further comprising an elongate member connected to the at least two strands, wherein the elongate member is configured to be received in the lumen of the sheath.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A circuit board structure with embedded electronic components, the circuit board structure comprising:
a carrier board comprising an adhesive layer integrated between first and second metal oxide layers, wherein a first metal layer is on the first metal oxide layer, and a second metal layer is on the second metal oxide layer, and wherein the carrier board defines at least one through hole, and the at least one through hole penetrates through the adhesive layer, first and second metal oxide layers, and first and second metal layers;
at least one semiconductor chip received in the at least one through hole of the carrier board;
an adhesive material filling a gap between the carrier board and the semiconductor chip so as to secure the semiconductor chip in position to the through hole of the carrier board;
a high dielectric material layer on the second metal layer; and
at least one electrode board on the high dielectric material layer such that the second metal layer, high dielectric material layer, and electrode board together are a capacitance component.
2. The circuit board structure of claim 1, wherein the semiconductor chip has an active surface and a non-active surface opposite to the active surface, allowing the active surface to be provided with a plurality of electrode pads and positioned at the same side with the second metal layer with respect to the carrier board.
3. The circuit board structure of claim 2, further comprising a circuit build-up structure formed on the active surface of the semiconductor chip, high dielectric material layer, and electrode board, and having a plurality of conductive structures for electrical connection with the electrode pads of the semiconductor chip and the electrode board of the capacitance component.
4. The circuit board structure of claim 3, wherein the circuit build-up structure comprises a dielectric layer, a circuit layer superimposed on the dielectric layer, and the conductive structures in the dielectric layer.
5. The circuit board structure of claim 3, wherein a plurality of electrical connection pads are on the circuit build-up structure.
6. The circuit board structure of claim 5, further comprising a solder mask covering the circuit build-up structure and defining a plurality of openings exposing the electrical connection pads of the circuit build-up structure.
7. The circuit board structure of claim 5, further comprising a plurality of conductive components mounted on the electrical connection pads.
8. The circuit board structure of claim 3, further comprising another circuit build-up structure on the first metal layer and the non-active surface of the semiconductor chip, wherein the carrier board defines at least one plated through hole electrically connecting the circuit build-up structures.
9. The circuit board structure of claim 8, wherein the another circuit build-up structure comprises a dielectric layer, a circuit layer superimposed on the dielectric layer, and a plurality of conductive structures in the dielectric layer.
10. The circuit board structure of claim 8, wherein a plurality of electrical connection pads are on the another circuit build-up structure.
11. The circuit board structure of claim 10, further comprising a solder mask covering the another circuit build-up structure and defining a plurality of openings exposing the electrical connection pads of the another circuit build-up structure.
12. The circuit board structure of claim 10, further comprising a plurality of conductive components mounted on the electrical connection pads.
13. The circuit board structure of claim 1, wherein the semiconductor chip has an active surface and a non-active surface opposite to the active surface, allowing the active surface to be provided with a plurality of electrode pads and positioned at the same side with the first metal layer with respect to the carrier board.
14. The circuit board structure of claim 13, further comprising a circuit build-up structure on surfaces of the non-active surface of the semiconductor chip, high dielectric material layer, and electrode board, and having a plurality of conductive structures for electrical connection with the electrode board of the capacitance component.
15. The circuit board structure of claim 14, wherein the circuit build-up structure comprises a dielectric layer, a circuit layer superimposed on the dielectric layer, and the conductive structures in the dielectric layer.
16. The circuit board structure of claim 14, wherein a plurality of electrical connection pads are on the circuit build-up structure.
17. The circuit board structure of claim 16, further comprising a solder mask covering the circuit build-up structure and defining a plurality of openings exposing the electrical connection pads of the circuit build-up structure.
18. The circuit board structure of claim 16, further comprising a plurality of conductive components mounted on the electrical connection pads.
19. The circuit board structure of claim 13, further comprising another circuit build-up structure on the first metal layer and the active surface of the semiconductor chip and having a plurality of conductive structures for electrical connection with the electrode pads of the semiconductor chip, wherein the carrier board defines at least one plated through hole for electrically connecting the circuit build-up structures.
20. The circuit board structure of claim 19, wherein the another circuit build-up structure comprises a dielectric layer, a circuit layer superimposed on the dielectric layer, and a plurality of conductive structures in the dielectric layer.
21. The circuit board structure of claim 19, wherein a plurality of electrical connection pads are on the another circuit build-up structure.
22. The circuit board structure of claim 21, further comprising a solder mask covering the another circuit build-up structure and defining a plurality of openings exposing the electrical connection pads of the another circuit build-up structure.
23. The circuit board structure of claim 21, further comprising a plurality of conductive components mounted on the electrical connection pads.
24. The circuit board structure of claim 1, wherein the first and second metal layers are aluminum, and the first and second metal oxide layers are aluminum oxide.
25. The circuit board structure of claim 1, wherein the adhesive layer is one of a thermosetting resin and a glue.