1. A disposable device comprising:
a biodegradable resin; and
a plasticizer;
wherein the resin and plasticizer are intermixed to provide a generally homogenous bioplastic that is formed to provide the device.
2. The device of claim 1, wherein the bioplastic is formed and thermally bonded in the absence of cross-linking agents
3. The device of claim 1, wherein the bioplastic in the device has a low cross-linking density, thereby providing a generally biodegradable disposable device
4. The device of claim 1, wherein the device is a multidose syringe that is large enough to hold several doses
5. The device of claim 1, wherein the device is a specimen tube.
6. The device of claim 1, wherein the device is a scalpel.
7. The device of claim 1, wherein the device is a lancet.
8. The device of claim 1, wherein the device is a sharps container.
9. The device of claim 1, wherein the device is a biodegradable suction canister.
10. The device of claim 1, wherein the biodegradable resin is Polylactic Acid (PLA)
11. The device of claim 1, wherein the biodegradable resin is polyhydroxyalkonate (PHA)
12. The device of claim 1, wherein the biodegradable resin is poly 3 hydroxybutrate co 3 hydroxyhexanote (PHBH)
14. A method of disposing of an item, comprising:
providing an item made from a biodegradable resin and a plasticizer that are intermixed to provide a generally homogenous bioplastic;
sterilizing the item utilizing radiation or ethylene oxide gas;
shredding the item; and
composting the item into a compost end product, thereby disposing of the item.
15. The method of claim 14, wherein the item is a multidose syringe, a specimen tube, a scalpel, a lancet, a sharps container, or a suction canister.
16. The method of claim 14, wherein the bioplastic includes Polylactic Acid (PLA).
17. The method of claim 14, wherein the bioplastic includes polyhydroxyalkonate (PHA).
18. The method of claim 14, wherein the bioplastic includes poly 3 hydroxybutrate co 3 hydroxyhexanote (PHBH).
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An electronic device comprising:
an electronic board on which a heat generating component is mounted;
an enclosure housing the electronic board;
a heat transport unit coupled to the enclosure and transporting heat from the heat generating component to the outside;
a heat receiving unit provided in the heat transport unit and receiving heat from the heat generating component;
a heat dissipating unit provided in the heat transport unit in such a manner that a portion of the heat dissipating unit is exposed to outside air, the heat dissipating unit being coupled to the heat receiving unit and dissipating heat received by the heat receiving unit to the outside; and
a guide duct unit formed by interconnecting the heat generating component and the heat receiving unit in a tubular form in order to send heat from the heat generating component to the heat receiving unit.
2. The electronic device according to claim 1, comprising:
a heat-receiving-unit housing chamber provided in the heat transport unit and housing the heat receiving unit;
a heat-dissipating-unit housing chamber provided in the heat transport unit and housing the heat dissipating unit; and
a heat transport partition provided between the heat-receiving-unit housing chamber and the heat-dissipating-unit housing chamber to prevent air from flowing back and forth between the heat-receiving-unit housing chamber and the heat-dissipating-unit housing chamber.
3. The electronic device according to claim 2, wherein the heat transport partition is disposed so that air containing heat from the heat generating component passes through the heat receiving unit and then flows back into the enclosure.
4. The electronic device according to claim 2 or 3,
wherein the heat-dissipating-unit housing chamber comprises a heat dissipating opening for providing air outside the heat transport unit to the heat dissipating unit; and
air outside the heat transport unit flowing through the heat dissipating opening flows along the heat transport partition into the heat dissipating unit.
5. The electronic device according to claim 2,
wherein the heat transport unit comprises a holder provided along a periphery of the heat receiving unit and holding the periphery of the heat receiving unit; and
the holder is provided to prevent passage of air between the periphery of the heat receiving unit and the heat transport partition and between the periphery of the heat receiving unit and an inner wall of the heat transport unit.
6. The electronic device according to claim 2, wherein
the heat transport partition is formed into a wavy plate.
7. The electronic device according to claim 1, comprising a connector unit connected to the electronic board and exposed outside the enclosure,
wherein the connector unit is covered with the heat transport unit.
8. The electronic device according to claim 1,
wherein the enclosure comprises:
a heat-generating-component housing chamber housing the heat generating component;
an air guide chamber forming an air flow path between the heat-receiving-unit housing chamber and the heat-generating-component housing chamber;
an enclosure partition provided between the heat-generating-component housing chamber and the air guide chamber and separating the heat-generating-component housing chamber from the air guide chamber;
a first opening communicating between the heat-generating-component housing chamber and the heat-receiving-unit housing chamber;
a second opening communicating between the heat-receiving-unit housing chamber and the air guide chamber; and
a third opening formed in the enclosure partition and communicating between the heat-generating-component housing chamber and the air guide chamber;
an air flow path is formed through which air circulates among the heat-generating-component housing chamber, the heat-receiving-unit housing chamber and the air guide chamber through the first opening, the second opening and the third opening; and
the guide duct unit includes a portion of the enclosure partition.
9. The electronic device according to claim 1, comprising a fan unit provided in the electronic-board housing chamber,
wherein the fan unit accelerates flow of heat from the heat generating component into the guide duct unit.
10. A cooling system comprising:
an enclosure housing the electronic board on which a heat generating component is mounted;
a heat transport unit coupled to the enclosure and transporting heat from the heat generating component to the outside;
a heat receiving unit provided in the heat transport unit and receiving heat from the heat generating component;
a heat dissipating unit provided in the heat transport unit in such a manner that a portion of the heat dissipating unit is exposed to outside air, the heat dissipating unit being coupled to the heat receiving unit and dissipating heat received by the heat receiving unit to the outside; and
a guide duct unit formed by interconnecting the heat generating component and the heat receiving unit in a tubular form in order to send heat from the heat generating component to the heat receiving unit.