1. A method for forming a plurality of bonding pads on a printed circuit board (PCB) having a plurality of circuit patterns, comprising:
forming a plurality of copper patterns on a substrate, the plurality of copper patterns being electrically connected with the plurality of circuit patterns on the PCB;
filling a filler at spaces formed between the copper patterns;
flattening an upper surface of the filler such that upper surfaces of the plurality of copper patterns are exposed; and
applying a plating layer to only the exposed upper surfaces of the plurality of copper patterns,
wherein the applying the plating layer comprises applying a nickel plating layer to exposed top surfaces of the plurality of copper patterns but not to the side surfaces of the copper patterns and forming a gold plating layer on both side faces and top surfaces of the nickel plating layer formed on the copper patterns.
2. The method of claim 1, wherein an etching factor is applied when forming the copper patterns, resulting in copper patterns with cross sections that are substantially trapezoidal in cross section.
3. The method of claim 1, wherein a width of the plating layers are less than or substantially equal to a width of the copper patterns.
4. The method of claim 1, wherein a thickness of the gold plating layer is less than a thickness of the nickel plating layer.
5. The method of claim 1, wherein the filler is one of an infrared cured ink andor a solder-resist.
6. The method of claim 1, wherein flattening an upper surface of the filler such that upper surfaces of the plurality of copper patterns are exposed comprises flattening the upper surface of the filler such that the filler substantially completely covers side surfaces of the plurality of copper patterns, leaving only top surfaces of the copper patterns exposed.
7. A method for forming a plurality of bonding pads on a printed circuit board (PCB) having a plurality of circuit patterns, comprising:
forming a plurality of copper patterns on a substrate;
thereafter filling a filler at spaces formed between adjacent copper patterns;
flattening an upper surface of the filler such that upper surfaces of the plurality of copper patterns are exposed and the filler remains in the spaces formed between adjacent copper patterns; and
applying a plating layer to only the upper surfaces of the plurality of copper patterns,
wherein the applying the plating layer further comprises applying a nickel plating layer to exposed top surfaces of the plurality of copper patterns but not to the side surfaces of the plurality of copper patterns and forming a gold plating layer on both side surfaces and a top surface of the nickel plating layer.
8. The method of claim 7, wherein forming the plurality of copper patterns on a substrate further comprises applying an etching factor to the plurality of copper patterns.
9. The method of claim 8, wherein applying an etching factor to the plurality of copper patterns produces copper patterns with cross sections that are substantially trapezoidal in shape.
10. The method of claim 7, wherein a width of the plating layers are less than or equal to a width of the plurality of copper patterns.
11. The method of claim 7, wherein the gold plating layer is formed thinner than the nickel plating layer.
12. The method of claim 7, wherein the filler is one of an infrared cured ink andor a solder-resist.
13. The method of claim 7, wherein flattening an upper surface of the filler comprises flattening the upper surface of the filler such that the filler substantially completely covers side surfaces of the plurality of copper patterns, leaving only top surfaces of the copper patterns exposed.
14. A method for forming a bonding pad on a printed circuit board (PCB) having a plurality of circuit patterns, comprising:
forming a copper pattern on a substrate;
filling a filler at a space formed adjacent the copper pattern;
flattening an upper surface of the filler such that an upper surface of the copper pattern is exposed; and
applying a plating layer to only the upper surface of the copper pattern,
wherein the applying the plating layer comprises applying a nickel plating layer to an exposed top surface of the copper pattern but not to the side surfaces of the copper pattern and forming a gold plating layer on both side surfaces and a top surface of the nickel plating layer.
15. The method of claim 14, further comprising applying an etching factor when forming the copper pattern which results in a copper pattern with a substantially trapezoidal cross section.
16. The method of claim 14, wherein a width of the plating layer are less than or equal to a width of the copper pattern.
17. The method of claim 14, wherein the gold plating layer is formed thinner than the nickel plating layer.
18. The method of claim 14, wherein the filler is one of an infrared cured ink andor a solder-resist.
19. The method of claim 14, wherein flattening an upper surface of the filler such that an upper surface of the copper pattern is exposed comprises flattening the upper surface of the filler such that the filler substantially completely covers side surfaces of the copper pattern, leaving only a top surface of the copper pattern exposed.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An image forming apparatus that communicates with a remote apparatus, the image forming apparatus comprising:
a storage unit;
a reading unit configured to read a document;
a first determination unit configured to determine whether a confidentiality attribute has been set for the document read by the reading unit;
a control unit configured to, in a case that the first determination unit determines that the confidentiality attribute has been set, store the document in the storage unit, and, in a case that the first determination unit determines that the confidentiality attribute has not been set, store the document in the remote apparatus; and
a second determination unit configured to determine whether the remote apparatus includes an overwriting deletion function,
wherein the control unit is configured to, based on a determination that the remote apparatus includes the overwriting deletion function, control movement of the document when the first determination unit determines that the confidentiality attribute has been set.
2. The image forming apparatus according to claim 1, further comprising a management unit configured to manage the document stored in the storage unit as a confidential document for which a limitation is imposed on a movement of the confidential document from the storage unit to the remote apparatus.
3. The image forming apparatus according to claim 2, wherein the management unit distinguishes between documents with associated confidentiality attributes and documents without associated confidentiality attributes in order to manage each.
4. The image forming apparatus according to claim 1, further comprising:
a deletion unit configured to delete a cache document from the storage unit in response to a detection that a free capacity of the storage unit is less than or equal to a threshold.
5. The image forming apparatus according to claim 1, further comprising an inquiry unit configured to, in response to the second determination determining that the remote apparatus does not have the overwriting deletion function, inquire whether to move the document that the first determination unit determines that the confidentiality attribute has been set with the confidentiality attribute to the remote apparatus,
wherein the control unit is configured to permit movement of the file with the confidentiality attribute according to a response to the inquiry unit.
6. The image forming apparatus according to claim 1, wherein the storage unit includes a first region to store the file with the confidentiality attribute and a second region to store a file obtained from the remote apparatus.
7. A method for controlling an image forming apparatus that communicates with a remote apparatus, the method comprising:
reading a document;
determining whether a confidentiality attribute has been set for the document;
storing the document in a storage unit of the image forming apparatus in response to a determination that the confidentiality attribute has been set for the document, and storing the document in the remote apparatus in response to a determination that the confidentiality attribute has not been set;
determining whether the remote apparatus includes an overwriting deletion function; and
controlling, based on the determination that the remote apparatus includes the overwriting deletion function, movement of the document when it is determined that the confidentiality attribute has been set.
8. A non-transitory computer-readable storage medium storing computer executable instructions for causing a computer to execute a method, the method comprising:
reading a document;
determining whether a confidentiality attribute has been set for the document;
storing the document in a storage unit of the image forming apparatus in response to a determination that the confidentiality attribute has been set for the document, and storing the document in the remote apparatus in response to a determination that the confidentiality attribute has not been set;
determining whether the remote apparatus includes an overwriting deletion function; and
controlling, based on the determination that the remote apparatus includes the overwriting deletion function, movement of the document when it is determined that the confidentiality attribute has been set.