1. A kinetic energy generation device comprising:
a case;
a fixation gear wheel disposed at an interior rim of said case;
a movable gear wheel engaged with said fixation gear wheel;
a motion transmission member rotatably installed in said case;
a motion transmission shaft provided at the axis of said motion transmission member;
an axis gear wheel disposed in relation to said movable gear wheel so as to engage with said motion transmission shaft;
a flywheel provided external to said axis gear wheel and being engaged therewith a force applying shaft attached to an end thereof; and
several links each being connected to said force applying shaft with its one end and to a piston of a cylinder with the other end thereof;
wherein the gear ratio of said fixation gear wheel to said movable gear wheel is 3:2, and the gear ratio of said motion transmission shaft to said axis gear wheel is also 3:2.
2. The device of claim 1, wherein the number of said cylinder is a multiple of 3, each set containing 3 cylinders is disposed 120\xb0 apart from one another.
3. The device of claim 1, wherein the number of said cylinders is a multiple of 6, each set containing 3 cylinder is disposed 120\xb0 apart from one another, and rest of the two sets are each settled at two ends of said case facing to each other by turning 180\xb0.
4. The device of claim 1, a ball bearing is provided between the contact surface of said motion transmission member and said case.
5. The device of claim 1, wherein the height of said force applying shaft can be adjusted according to the actual need whether it is to be used for an engine or an air compressor.
6. The device of claim 1, wherein said axis gear wheel is pre-shifted an angle when said piston is at the initiation of the stroke.
7. The device of claim 1, wherein a follower gear wheel is interposed in a dummy area between said motion transmission shaft and said fixation gear wheel.
8. The device of claim 1, wherein said motion transmission shaft may be driven by another prime mover to rotate, the power is then transmitted to said piston via said axis gear wheel, said movable gear wheel, said flywheel, said force applying shaft and said link to compress said cylinder to store energy thereby working as an air compressor.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor device, comprising:
a die pad having an upper surface and a lower surface opposite to the upper surface, a shape in a plan view of the upper surface comprised of quadrangle;
a plurality of suspension leads supporting corner parts of the die pad, respectively;
a plurality of lead groups arranged along sides of the die pad, respectively, in the plan view;
a first semiconductor chip having a first main surface, a plurality of first pad groups formed along sides of the first main surface, respectively, and a first back surface opposite to the first main surface, and arranged over the upper surface of the die pad, and arranged at the central part of the die pad in the plan view such that the first back surface faces to the upper surface of the die pad, and such that the sides of the first main surface are arranged in parallel with the sides of the upper surface of the die pad, respectively, in the plan view;
a second semiconductor chip having a second main surface, a second pad group formed over the second main surface, and a second back surface opposite to the second main surface, and arranged over the upper surface of the die pad, and arranged next to the first semiconductor chip in the plan view; and
a plurality of first down bonding wire groups electrically connecting the first pad groups of the first semiconductor chip with a plurality of down bonding regions of the die pad, respectively,
wherein a length of a side of the second main surface of the second semiconductor chip is larger than the distance between a first down bonding region of the down bonding regions of the die pad and a first die pad side of the sides of the upper surface of the die pad, the first die pad side being closest to the first down bonding region, and
wherein the second semiconductor chip is arranged in a corner part region between the first down bonding region formed along the first die pad side of the die pad and a second down bonding region formed along a second die pad side crossing with the first die pad side in the plan view.
2. The semiconductor device according to claim 1,
wherein a part of the second semiconductor chip is arranged between the first semiconductor chip and the side of the upper surface of the die pad in a plan view.
3. The semiconductor device according to claim 2,
wherein the first semiconductor chip is mounted over the upper surface of the die pad such that a first region surrounded by a plurality of first pads formed along each side of the first main surface of the first semiconductor chip overlaps a point of intersection between respective extension lines of the suspension leads in a plan view.
4. The semiconductor device according to claim 3,
wherein the second semiconductor chip is mounted over the upper surface of the die pad such that a second region surrounded by a plurality of second pads formed along a plurality of sides of the second main surface of the second semiconductor chip overlaps a part of either of two diagonal lines of the upper surface of the die pad in a plan view.
5. The semiconductor device according to claim 3,
wherein the first semiconductor chip is stacked over a third semiconductor chip mounted over the upper surface of the die pad, and
wherein the third semiconductor chip juts out from the first semiconductor chip toward the side of the die pad opposite to the side thereof over which the second semiconductor chip is mounted.
6. The semiconductor device according to claim 3,
wherein in the die pad, a step part with the upper surface protruding from the lower surface is formed.
7. The semiconductor device according to claim 6,
wherein the step part is formed with the protrusion amount being larger on the side of the die pad over which the second semiconductor chip is mounted than on the opposite side therefrom.
8. The semiconductor device according to claim 7,
wherein a sealing body for sealing the first, second, and third semiconductor chips is formed, and the lower surface of the die pad is exposed at the back surface of the sealing body.