1. A method of forming doubly self-aligned semiconductor contacts, comprising:
depositing a first metal contact onto a Group III-V semiconductor substrate;
depositing a dielectric sidewall spacer on a vertical side of said first metal contact;
depositing a dielectric blanket layer on a side of said dielectric sidewall spacer opposite from said first metal contact;
depositing a planarizing layer on said dielectric blanket layer;
removing a portion of said planarizing layer to expose a portion of said dielectric blanket layer;
etching said portion of said dielectric blanket layer to form a second contact opening bounded by said dielectric sidewall spacer and said planarizing layer; and
providing a second metal contact in said second contact opening.
2. The method of claim 1, wherein said providing a second metal contact comprises electroplating a second metal contact.
3. The method of claim 1, further comprising:
evaporating a base contact on a substrate prior to said depositing said dielectric blanket layer.
4. An apparatus, comprising:
a first metal contact on a substrate;
a first dielectric sidewall spacer on vertical sides of said first metal contact;
a second dielectric sidewall layer on vertical sides of said first dielectric spacer and on said substrate, said second dielectric sidewall layer having a greater etching speed than said first dielectric sidewall spacer; and
a planarization layer on said second dielectric sidewall layer;
wherein said second dielectric sidewall layer is configured to etch at a faster rate than said first dielectric sidewall spacer.
5. The apparatus of claim 4, further comprising:
a base layer formed in said substrate; and
an emitter layer on said base layer.
6. The apparatus of claim 5, further comprising:
a plating base layer between said emitter layer and said first metal contact.
7. The apparatus of claim 6, further comprising:
a plating base layer on said substrate.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An apparatus for manufacturing light guide plate, comprising:
a coater for containing UV curable glue therein;
a first pressing roller; and
a second pressing roller;
wherein the first pressing roller and the second pressing roller are located nearby each other and spaced a predetermined distance from each other, the coater is configured for distributing UV curable glue on a surface of on of the first pressing roller and the second pressing roller, the first pressing roller and the second pressing roller are configured for cooperatively pressing the distributed UV curable glue, at least one of the first pressing roller and the second pressing roller comprises a transparent shell and a UV lamp positioned in the transparent shell, the UV lamp is configured for emitting UV light to solidify the UV curable glue pressed between the first pressing roller and the second pressing roller.
2. The apparatus of claim 1, wherein the seconding pressing roller comprises the transparent shell and the UV lamp.
3. The apparatus of claim 2, wherein the first pressing roller comprises a copper layer coated on an outer surface thereof, the copper layer comprises a plurality of first microstructures thereon for printing corresponding microstructures on a surface of the UV curable glue.
4. The apparatus of claim 1, wherein the transparent shell comprises a plurality of second microstructures formed on an outer surface thereof for printing corresponding microstructures on a surface of the UV curable glue.
5. The apparatus of claim 4, wherein the second microstructures are substantially dot-shaped.
6. The apparatus of claim 5, further comprising a winding roller configured for winding solidified UV curable glue thereon.
7. A method for manufacturing light guide plate, comprising:
providing a first pressing roller and a second pressing roller, the first pressing roller and the second pressing roller being located nearby each other and spaced for a predetermined distance from each other, at least one of the first pressing roller and the second pressing roller comprising a transparent shell and an UV lamp located in the transparent shell;
rotating the first pressing roller and the second pressing roller, a rotating direction of the first pressing roller being reverse to that of the second pressing roller;
distributing UV curable glue on one of the rotating first pressing roller and the second pressing roller, the UV curable glue being carried between the first pressing roller and the second pressing roller and being pressed by the first pressing roller and the second pressing roller; and
illuminating the pressed UV curable glue with UV light emitted from the UV lamp to solidify the pressed UV curable glues.
8. The method of claim 7, further comprising:
winding the solidified curable glue by using a winding roller.
9. The method of claim 7, wherein the first pressing roller comprises a number of first microstructures formed on an outer surface thereof, the first microstructures print corresponding microstructures on a surface of the pressed UV curable glue.
10. The method of claim 9, wherein the second pressing roller comprises a number of second microstructures formed on an outer surfaces thereof, the second microstructures print corresponding microstructures on another surface of the pressed UV curable glue.