1. A circular retrocyclin polypeptide comprising two linked nonapeptides, wherein one nonapeptide sequence has the sequence set forth in SEQ ID NO:74 and one nonapeptide has a sequence selected from the group consisting of SEQ ID NO:19 to SEQ ID NO:64: and SEQ ID NO:74 to SEQ ID NO:119; and wherein said circular retrocyclin polypeptide comprises D-amino acids.
2. The circular polypeptide of claim 1, and a pharmaceutically acceptable excipient.
3. The circular polypeptide of claim 1, wherein said polypeptide comprises all D-amino acids.
4. The polypeptide according to claim 3 wherein one nonapeptide has the sequence set forth in SEQ ID NO:19 and one nonapeptide has the sequence set forth in SEQ ID NO:74.
5. The polypeptide according to claim 1 wherein one nonapeptide has the sequence set forth in SEQ ID NO:19 and one nonapeptide has the sequence set forth in SEQ ID NO:74.
6. A method for administering retrocyclin as a prophylactic agent, the method comprising: administering a peptide according to claim 1 to a patient to inhibit a microbial infection in a patient at risk of developing such infection.
7. A method for killing microbial organisms, the method comprising:
contacting said microbial organism with an effective dose of a cyclic polypeptide as set forth in claim 1.
8. The method of claim 7, wherein said microbial organism is present in a patient with an established microbial or viral infection.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An embossing tool having a microstructure on its surface wherein the surfaces of the microstructures are overcoated with a precious metal or an alloy thereof.
2. The tool of claim 1, wherein the precious metal is gold, silver, platinum, palladium, ruthenium, rhodium, osmium or iridium.
3. The tool of claim 1, wherein the precious metal is gold.
4. The tool of claim 1, wherein the alloy comprises a precious metal and a non-precious metal selected from the group consisting of copper, tin, cobalt, nickel, iron, indium, zinc and molybdenum.
5. The tool of claim 4, wherein the total weight of the non-precious metal in the alloy is in the range of 0.001% to 50%.
6. The tool of claim 4, wherein the total weight of the non-precious metal in the alloy is in the range of 0.001% to 10%.
7. The tool of claim 1, wherein the coating has a thickness in the range of 0.001 to 10 microns.
8. The tool of claim 1, wherein the coating has a thickness in the range of 0.001 to 3 microns.
9. A embossing process, which comprises:
a) providing an embossing composition on a supporting layer;
b) providing the embossing tool of claim 1;
c) embossing the embossing composition with the embossing tool;
d) curing or hot embossing the embossing composition after step c); and
e) releasing the embossing tool,
10. The process of claim 9, wherein the adhesion between the embossing tool and the cured embossing composition or hot embossed material is weaker than the adhesion between the supporting layer and the cured embossing composition or hot embossed material.
11. The process of claim 10, wherein the cured embossing composition or hot embossed material is hydrophobic and the supporting layer is hydrophilic, or vice versa.
12. An electrophoretic display film comprising microcells filled with an electrophoretic fluid comprising charged particles dispersed in a solvent or solvent mixture, wherein the microcells are prepared by the embossing process of claim 9.