1. A method for fabricating a chip package, comprising:
providing a copper pillar on a chip and a first tin-containing layer over said copper pillar, wherein said first tin-containing layer has a thickness less than that of said copper pillar;
providing a second tin-containing layer on a substrate, wherein said second tin-containing layer has a thickness less than said thickness of said copper pillar; and joining said first tin-containing layer with said second tin-containing layer.
2. The method of claim 1, wherein said providing said copper pillar is performed with said providing said copper pillar over a pad in said chip, wherein said copper pillar has a transverse dimension less than that of said pad.
3. The method of claim 1, wherein said providing said first tin-containing layer is performed with said first tin-containing layer comprising silver.
4. The method of claim 1, wherein said providing said second tin-containing layer comprises a process comprising a screen-printing process.
5. The method of claim 1, wherein said providing said second tin-containing layer is performed with said second tin-containing layer comprising silver.
6. The method of claim 1, wherein said joining said first tin-containing layer with said second tin-containing layer comprises a reflow process.
7. A method for fabricating a chip package, comprising:
providing a copper pillar on a chip and a tin-containing layer over said copper pillar, wherein said tin-containing layer has a thickness less than that of said copper pillar;
providing a gold-containing layer on a substrate, wherein said gold-containing layer has a thickness less than said thickness of said copper pillar; and
joining said tin-containing layer with said gold-containing layer.
8. The method of claim 7, wherein said providing said copper pillar is performed with said providing said copper pillar over a pad in said chip, wherein said copper pillar has a transverse dimension less than that of said pad.
9. The method of claim 7, wherein said providing said tin-containing layer is performed with said tin-containing layer comprising silver.
10. The method of claim 7, wherein said joining said tin-containing layer with said gold-containing layer comprises a reflow process.
11. A method for fabricating a chip package, comprising:
providing a metal bump on a chip, wherein said metal bump comprises a copper pillar over said chip;
providing a tin-containing layer on a substrate, wherein said tin-containing layer has a thickness greater than 15 micrometers and less than a thickness of said copper pillar; and
joining said metal bump with said tin-containing layer using a process comprising a reflow process.
12. The method of claim 11, wherein said providing said tin-containing layer is performed with said tin-containing layer comprising silver.
13. The method of claim 11, wherein said providing said tin-containing layer is performed with said tin-containing layer comprising silver and copper.
14. The method of claim 11, wherein said providing said tin-containing layer is performed with said tin-containing layer comprising lead.
15. A method for fabricating a chip package, comprising:
providing a copper pillar on a chip and a first gold-containing layer over said copper pillar, wherein said first gold-containing layer has a thickness less than that of said copper pillar;
providing a second gold-containing layer on a substrate, wherein said second gold-containing layer has a thickness less than said thickness of said copper pillar; and
joining said first gold-containing layer with said second gold-containing layer.
16. The method of claim 15, wherein said providing said copper pillar is performed with said providing said copper pillar over a pad in said chip, wherein said copper pillar has a transverse dimension less than that of said pad.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for automatically managing computer assets comprising:
discovering presence and identification information of computer assets on a network;
performing diagnostic tests on the discovered assets;
backing up the data of the discovered assets;
restoring OS and software with licenses on selected assets;
sanitizing data storage on non-selected assets.
2. The method of claim 1 wherein the network is a LAN.
3. The method of claim 1 wherein the network is a WAN.
4. The method of claim 1 wherein performing diagnostic tests on said assets is accomplished by defining assets to be tested, establishing parameters of the diagnostic tests, and performing the diagnostic tests pursuant to the parameters.
5. The method of claim 1 wherein backing up the assets is accomplished by defining assets to be backed up and performing the backup of those assets.
6. The method of claim 1 wherein restoration of OS is accomplished by retrieving a license key for each asset to be restored, sanitizing each asset, and restoring the OS to each asset using the license key of each asset.
7. The method of claim 1 wherein performing sanitizing is accomplished by selecting assets to be sanitized, erasing the assets, overwriting the assets as desired, and preparing a certificate of data destruction for each asset.
8. The method of claim 7 wherein sanitization is performed pursuant to DOD standards.