1. A method of manufacturing a superluminescent diode, the method comprising:
forming a passive waveguide layer, a lower clad layer, an active layer, and a first upper clad layer on a substrate having an active region and an optical mode size conversion region;
removing the active layer and the first upper clad layer in the optical mode size conversion region;
forming a tapered waveguide region connected the active layer and the first upper clad layer on the lower clad layer in the optical mode size conversion region; forming a passive waveguide region connected tapered waveguide region; and
forming a second upper clad layer having a mesa structure on the first upper clad layer in the active region, and surrounding the tapered waveguide region and the passive waveguide region in the optical mode size conversion region.
2. The method of claim 1, further comprising forming an etch stop layer and a first cap layer on the first upper clad layer.
3. The method of claim 2 wherein the tapered waveguide region comprises a junction layer, the junction layer is butt-regrown with the same thickness as that of the active layer of the active region.
4. The method of claim 3, further comprising forming a second cap layer having the same thickness as that of each of the first upper clad layer, the etch stop layer, and the first cap layer on the junction layer.
5. The method of claim 4, wherein the second upper clad layer comprises doped p-InP equal to that of each of the first and second cap layers.
6. The method of claim 5, wherein the second upper clad layer of the optical mode size conversion region is formed through a selective growth method.
7. The method of claim 6, wherein the selective growth method comprises:
forming mask patterns on the substrate out of the tapered waveguide region and the passive waveguide region; and
forming the second upper clad layer on the tapered waveguide region, the passive waveguide, and the substrate which are exposed by the mask patterns.
8. The method of claim 5, further comprising:
forming an ohmic contact layer on the second upper clad layer;
forming planarizing layers on sides of the ridge waveguide, the tapered waveguide region, and the passive waveguide region on the substrate; and
forming an electrode and a pad on an ohmic contact layer and the planarizing layer etch other.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. Device for manufacturing a label for a container, particularly for a bottle, comprising:
a RFID production device which forms at least a part of a Radio Frequency Identification (RFID) transponder during the manufacture of the label.
2. Device according to claim 1, wherein the RFID production device comprises a printing device (7) for printing a part of a RFID transponder.
3. Device according to claim 2, in which the printing device (7) prints an electrically conductive ink.
4. Device according to claim 1, wherein the RFID production device forms an antenna as apart of the RFID transponder.
5. Device according to claim 1, wherein the RFID production device forms at least a part of the RFID transponder on one of a support medium (20) or immediately on a surface of the container.
6. Device according to claim 1, wherein the RFID production device forms at least apart of a RFID microchip (23) as a part of the RFID transponder.
7. Device according to additionally claim 1, and one of an embossing device (6), an ink and color control device (8), a drying device (9), a hardening device (10), an insulation device (11), a device for arranging a RFID microchip (12), a printing device for printing color ink, and combinations thereof.
8. Labeling machine comprising a device for manufacturing a label for a container according to claim 1, and a carousel for conveying containers.
9. Procedure for manufacturing a label for a container, comprising forming at least a part of a RFID transponder during the manufacture of the label.
10. Procedure according to claim 9, and forming the at least one part of the RFID transponder by printing.
11. Procedure according to claim 10, wherein the printing comprises the printing of an electrically conductive ink (22).
12. Procedure according to claim 9, where and forming an antenna as a part of the RFID transponder.
13. Procedure according to claim 9, where, and forming the at least one part of the RFID transponder on a support medium (20).
14. Procedure according to claim 13, and applying the support medium (20) to a surface of the container.
15. Procedure according to claim 9, and forming the at least one part of a RFID transponder directly on a surface of the container.
16. Procedure according to claim 9, and forming at least a part of a RFID microchip (23) as a part of the RFID transponder.
17. Procedure according to claim 10, and
embossing one of a support medium 20 or a surface of the container, to form an embossed area, and
the printing of at least a part of the RFID transponder occurs in the embossed area.
18. Procedure according to claim 17, and:
one of drying, hardening, and a combination thereof, of the electrically conductive ink.)
19. Procedure according to claim 17, comprising
forming one of an insulation layer or at least a part of the RFID transponder.
20. Procedure according to claim 12, comprising:
arranging a RFID microchip (23) so that the RFID microchip is in electrical contact with the antenna.
21. Label for a container, bottle, the label including at least a part of an RFID transponder.
22. Procedure according to claim 18, wherein the drying comprises near infrared drying.
23. Procedure according to claim 18, wherein the hardening comprises ultraviolet hardening.
24. Label according to claim 21, wherein said at least one part of the RFID transponder is printed in an electronically conductive ink.