1. A method of wireless communication, comprising:
determining a first pre-coding matrix for use on a portion of a set of resource blocks (RBs), wherein the first pre-coding matrix includes a set of beamforming vectors;
modifying at least one beamforming vector of the set of beamforming vectors by applying a phase rotation to generate a modified pre-coding matrix; and
applying the modified pre-coding matrix to one or more demodulation reference signals and data associated with the portion of the set of RBs for transmission using at least one antenna.
2. The method of claim 1, further including transmitting the one or more demodulation reference signals and the data using the at least one antenna.
3. The method of claim 1, wherein the determining further includes obtaining the pre-coding matrix from a database associated with a base station.
4. The method of claim 1, further including:
obtaining information for at least one of channel quality indicator (CQI) feedback from one or more user equipments (UEs), pre-coding matrix index (PMI) feedback from one or more UEs, and channel measurements detected by a base station; and
determining the pre-coding matrix based on the obtained information.
5. The method of claim 1, wherein the modifying further includes selecting the phase rotation to reduce transmission power variations across two or more orthogonal frequency domain modulation (OFDM) symbols.
6. The method of claim 5, wherein each of the two or more OFDM symbols are used for communicating one of the one or more demodulation reference signals.
7. The method of claim 1, wherein the applying further includes:
generating a first bundling group and a second bundling group, wherein the first and second bundling groups include different subsets of RBs of the set of RBs; and
applying the modified pre-coding matrix to the first bundling group and applying the first pre-coding matrix to the second bundling group.
8. The method of claim 7, further including transmitting the first bundling group and the second bundling group to a user equipment (UE), wherein the UE is enabled to perform joint channel estimation across each of the first bundling group and the second bundling group.
9. A method of wireless communications, comprising:
determining a scrambling sequence vector pair associated with a scrambling sequence matrix with a high level of frequency domain orthogonalization;
determining a spreading sequence vector pair associated with a spreading sequence matrix with a low level of time domain orthogonalization; and
generating an orthogonal cover code (OCC) matrix by assigning the determined scrambling sequence vector pair to the determined spreading sequence vector pair.
10. An apparatus for wireless communication, comprising:
means for determining a first pre-coding matrix for use on a portion of a set of resource blocks (RBs), wherein the first pre-coding matrix includes a set of beamforming vectors;
means for modifying at least one beamforming vector of the set of beamforming vectors by applying a phase rotation to generate a modified pre-coding matrix; and
means for applying the modified pre-coding matrix to one or more demodulation reference signals and data associated with the portion of the set of RBs for transmission using at least one antenna.
11. The apparatus of claim 10, further including means for transmitting the one or more demodulation reference signals and the data using the at least one antenna.
12. The apparatus of claim 10, wherein the means for selecting further includes means for obtaining the pre-coding matrix from a database associated with a base station.
13. The apparatus of claim 10, further including:
means for obtaining information for at least one of CQI feedback from one or more user equipments (UEs), PMI feedback from one or more UEs, and channel measurements detected by a base station; and
means for determining the pre-coding matrix based on the obtained information.
14. The apparatus of claim 10, wherein the means for modifying further includes means for selecting the phase rotation to reduce transmission power variations across two or more OFDM symbols.
15. The apparatus of claim 14, wherein each of the two or more OFDM symbols are used for communicating one of the one or more demodulation reference signals.
16. The apparatus of claim 10, wherein the means for applying further includes:
means for generating a first bundling group and a second bundling group, wherein the first and second bundling groups include different subsets of RBs of the set of RBs; and
means for applying the modified pre-coding matrix to the first bundling group and applying the first pre-coding matrix to the second bundling group.
17. The apparatus of claim 16, further including means for transmitting the first bundling group and the second bundling group to a user equipment (UE), wherein the UE is enabled to perform joint channel estimation across each of the first bundling group and the second bundling group.
18. An apparatus for wireless communications, comprising:
means for determining a scrambling sequence vector pair associated with a scrambling sequence matrix with a high level of frequency domain orthogonalization;
means for determining a spreading sequence vector pair associated with a spreading sequence matrix with a low level of time domain orthogonalization; and
means for generating an orthogonal cover code (OCC) matrix by assigning the determined scrambling sequence vector pair to the determined spreading sequence vector pair.
19. A computer program product comprising a computer-readable storage medium, the computer-readable medium comprising:
instructions for causing a computer to determine a first pre-coding matrix for use on a portion of a set of resource blocks (RBs), wherein the first pre-coding matrix includes a set of beamforming vectors;
instructions for causing the computer to modify at least one beamforming vector of the set of beamforming vectors by applying a phase rotation to generate a modified pre-coding matrix; and
instructions for causing the computer to apply the modified pre-coding matrix to one or more demodulation reference signals and data associated with the portion of the set of RBs for transmission using at least one antenna.
20. The computer program product of claim 19, wherein the computer-readable medium further includes instructions for causing the computer to transmit the one or more demodulation reference signals and the data using the at least one antenna.
21. The computer program product of claim 19, wherein the computer-readable medium further includes instructions for causing the computer to obtain the pre-coding matrix from a database associated with a base station.
22. The computer program product of claim 19, wherein the computer-readable medium further includes:
instructions for causing the computer to obtain information for at least one of: CQI feedback from one or more user equipments (UEs), PMI feedback from one or more UEs, and channel measurements detected by a base station; and
instructions for causing the computer to determine the pre-coding matrix based on the obtained information.
23. The computer program product of claim 19, wherein the computer-readable medium further includes instructions for causing the computer to select the phase rotation to reduce transmission power variations across two or more OFDM symbols.
24. The computer program product of claim 23, wherein each of the two or more OFDM symbols are used for communicating one of the one or more demodulation reference signals.
25. The computer program product of claim 19, wherein the computer-readable medium further includes:
instructions for causing the computer to generate a first bundling group and a second bundling group, wherein the first and second bundling groups include different subsets of RBs of the set of RBs; and
instructions for causing the computer to apply the modified pre-coding matrix to the first bundling group and applying the first pre-coding matrix to the second bundling group.
26. The computer program product of claim 25, wherein the computer-readable medium further includes instructions for causing the computer to transmit the first bundling group and the second bundling group to a user equipment (UE), wherein the UE is enabled to perform joint channel estimation across each of the first bundling group and the second bundling group.
27. A computer program product comprising a computer-readable storage medium, the computer-readable storage medium comprising:
instructions for causing a computer to determine a scrambling sequence vector pair associated with a scrambling sequence matrix with a high level of frequency domain orthogonalization;
instructions for causing the computer to determine a spreading sequence vector pair associated with a spreading sequence matrix with a low level of time domain orthogonalization; and
instructions for causing the computer to generate an orthogonal cover code (OCC) matrix by assigning the determined scrambling sequence vector pair to the determined spreading sequence vector pair.
28. An apparatus for wireless communication, comprising:
at least one processor configured to:
determine a first pre-coding matrix for use on a portion of a set of resource blocks (RBs), wherein the first pre-coding matrix includes a set of beamforming vectors;
modify at least one beamforming vector of the set of beamforming vectors by applying a phase rotation to generate a modified pre-coding matrix; and
apply the modified pre-coding matrix to one or more demodulation reference signals and data associated with the portion of the set of RBs for transmission using at least one antenna; and
memory coupled to the at least one processor.
29. The apparatus of claim 28, wherein the at least one processor is further configured to transmit the one or more demodulation reference signals and the data using the at least one antenna.
30. The apparatus of claim 28, wherein the at least one processor is further configured to obtain the pre-coding matrix from a database associated with a base station.
31. The apparatus of claim 28, wherein the at least one processor is further configured to:
obtain information for at least one of: CQI feedback from one or more user equipments (UEs), PMI feedback from one or more UEs, and channel measurements detected by a base station; and
determine the pre-coding matrix based on the obtained information.
32. The apparatus of claim 28, wherein the at least one processor is further configured to select the phase rotation to reduce transmission power variations across two or more OFDM symbols.
33. The apparatus of claim 32, wherein each of the two or more OFDM symbols are used for communicating one of the one or more demodulation reference signals.
34. The apparatus of claim 28, wherein the at least one processor is further configured to:
generate a first bundling group and a second bundling group, wherein the first and second bundling groups include different subsets of RBs of the set of RBs; and
apply the modified pre-coding matrix to the first bundling group and applying the first pre-coding matrix to the second bundling group.
35. The apparatus of claim 34, wherein the at least one processor is further configured to transmit the first bundling group and the second bundling group to a user equipment (UE), wherein the UE is enabled to perform joint channel estimation across each of the first bundling group and the second bundling group.
36. An apparatus for wireless communications, comprising:
at least one processor configured to:
determine a scrambling sequence vector pair associated with a scrambling sequence matrix with a high level of frequency domain orthogonalization;
determine a spreading sequence vector pair associated with a spreading sequence matrix with a low level of time domain orthogonalization; and
generate an orthogonal cover code (OCC) matrix by assigning the determined scrambling sequence vector pair to the determined spreading sequence vector pair; and
memory coupled to the at least one processor.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for fabricating a liquid crystal display (LCD) panel using a substrate bonding device having a base frame; a lower chamber unit mounted to the base frame, wherein the lower chamber unit includes an upper surface; an upper chamber unit arranged over the lower chamber unit, wherein the upper chamber unit is moveable relative to the base frame and wherein the upper chamber unit includes a lower surface; chamber moving means mounted to the base frame for raising and lowering the upper chamber unit; an upper stage fixed to the upper chamber unit for securing a first substrate; a lower stage fixed to the lower chamber unit for securing a second substrate; and sealing means provided to at least one of the upper and lower surfaces for sealing an interior space surrounding the first and second substrates, wherein the sealed interior space is definable joined ones of the upper and lower chamber units, the method comprising:
loading the first and second substrates onto the upper and lower stages, respectively;
lowering the upper chamber unit to seal the interior space from an external environment via the sealing means;
evacuating the sealed interior space;
moving the upper chamber unit and the upper stage aligning the first and second substrates;
contacting the first and second substrates with a sealant material;
venting the sealed interior space to apply pressure to the first and second substrates contacted by the sealant material, wherein, after the venting, the first and second substrates are bonded together; and
unloading the bonded substrates,
wherein the moving the upper chamber unit and the upper stage includes:
spacing the first and second substrates apart by a first predetermined distance;
aligning at least one set of rough alignment marks; and
aligning at least one set of fine alignment marks after aligning the rough alignment marks, wherein the distance between the first and second substrates is varied during the aligning of the fine alignment marks.
2. The method as claimed in claim 1, wherein a distance between the first and second substrates is less than the first predetermined distance during the aligning of the fine alignment marks.
3. The method as claimed in claim 1, wherein aligning the rough alignment marks includes determining a state of alignment using two cameras arranged at at least two diagonally opposed regions of the first and second substrates.
4. The method as claimed in claim 1, wherein aligning the fine alignment marks includes determining a state of alignment using cameras arranged at four corner regions of the first and second substrates.
5. The method as claimed in claim 1, wherein varying the distance between the first and second substrates includes:
arranging the upper stage such that the first and second substrates do not contact each other; and
lowering the upper stage such that a central portion of the first contacts a central portion of the second substrate,
wherein the fine alignment marks are aligned between the arranging and the lowering of the upper stage.
6. The method as claimed in claim 1, wherein aligning the rough alignment marks includes focusing an alignment camera at an intermediate point between the first and second substrates.
7. The method as claimed in claim 1, wherein aligning the fine alignment marks includes focusing an alignment camera at an intermediate point between the first and second substrates.
8. The method as claimed in claim 1, wherein aligning the rough alignment marks includes further comprising alternating a focusing of an alignment camera between rough alignment marks formed on the second substrate and on rough alignment marks formed on the first substrate.
9. The method as claimed in claim 1, wherein aligning the fine alignment marks includes further comprising alternating a focusing of an alignment camera between fine alignment marks formed on the second substrate and on fine alignment marks formed on the first substrate.
10. A method for fabricating a liquid crystal display (LCD) panel using a substrate bonding device having a base frame; a lower chamber unit mounted to the base frame, wherein the lower chamber unit includes an upper surface; an upper chamber unit arranged over the lower chamber unit, wherein the upper chamber unit is moveable relative to the base frame and wherein the upper chamber unit includes a lower surface; chamber moving means mounted to the base frame for raising and lowering the upper chamber unit; an upper stage fixed to the upper chamber unit for securing a first substrate; a lower stage fixed to the lower chamber unit for securing a second substrate; and sealing means provided to at least one of the upper and lower surfaces for sealing an interior space surrounding the first and second substrates, wherein the sealed interior space is definable joined ones of the upper and lower chamber units, the method comprising:
loading the first and second substrates onto the upper and lower stages, respectively;
lowering the upper chamber unit to seal the interior space from an external environment via the sealing means;
evacuating the sealed interior space;
moving the upper chamber unit and the upper stage aligning the first and second substrates;
contacting the first and second substrates with a sealant material;
venting the sealed interior space to apply pressure to the first and second substrates contacted by the sealant material, wherein, after the venting, the first and second substrates are bonded together;
unloading the bonded substrates,
wherein loading the first substrate to the upper stage includes applying a suction force and an electrostatic charge from the upper stage to the first substrate and, after aligning the first and second substrates, the method further comprising:
deactivating the electrostatic charge applied from the upper stage;
raising the upper chamber unit to a predetermined height;
determining an alignment state of the first and second substrates; and
realigning the aligned first and second substrates based upon the determination of the alignment state.
11. The method as claimed in claim 10, wherein the determining the alignment state includes using at least one set of fine alignment marks.
12. A method for fabricating a liquid crystal display (LCD) panel using a substrate bonding device having a base frame; a lower chamber unit mounted to the base frame, wherein the lower chamber unit includes an upper surface; an upper chamber unit arranged over the lower chamber unit, wherein the upper chamber unit is moveable relative to the base frame and wherein the upper chamber unit includes a lower surface; chamber moving means mounted to the base frame for raising and lowering the upper chamber unit; an upper stage fixed to the upper chamber unit for securing a first substrate; a lower stage fixed to the lower chamber unit for securing a second substrate; and sealing means provided to at least one of the upper and lower surfaces for sealing an interior space surrounding the first and second substrates, wherein the sealed interior space is definable joined ones of the upper and lower chamber units, the method comprising:
loading the first and second substrates onto the upper and lower stages, respectively;
lowering the upper chamber unit to seal the interior space from an external environment via the sealing means;
evacuating the sealed interior space;
moving the upper chamber unit and the upper stage aligning the first and second substrates;
contacting the first and second substrates with a sealant material;
venting the sealed interior space to apply pressure to the first and second substrates contacted by the sealant material, wherein, after the venting, the first and second substrates are bonded together;
unloading the bonded substrates;
providing a plurality of venting holes within the upper and lower stages; and
providing low vacuum chamber pipelines to the sealed interior space, wherein the venting includes:
in a first venting step, injecting nitrogen gas into the sealed interior space through the plurality of venting holes provided within the upper and lower stages; and
in a second step, injecting nitrogen gas through the low vacuum chamber pipelines increase the pressure inside the sealed interior space equal to an atmospheric pressure.
13. A method for fabricating a liquid crystal display (LCD) panel using a substrate bonding device having a base frame; a lower chamber unit mounted to the base frame, wherein the lower chamber unit includes an upper surface; an upper chamber unit arranged over the lower chamber unit, wherein the upper chamber unit is moveable relative to the base frame and wherein the upper chamber unit includes a lower surface; chamber moving means mounted to the base frame for raising and lowering the upper chamber unit; an upper stage fixed to the upper chamber unit for securing a first substrate; a lower stage fixed to the lower chamber unit for securing a second substrate; and sealing means provided to at least one of the upper and lower surfaces for sealing an interior space surrounding the first and second substrates, wherein the sealed interior space is definable joined ones of the upper and lower chamber units, the method comprising:
loading the first and second substrates onto the upper and lower stages, respectively;
lowering the upper chamber unit to seal the interior space from an external environment via the sealing means;
evacuating the sealed interior space;
moving the upper chamber unit and the upper stage, aligning the first and second substrates;
contacting the first and second substrates with a sealant material;
venting the sealed interior space to apply pressure to the first and second substrates contacted by the sealant material, wherein, after the venting, the first and substrates are bonded together; and
unloading the bonded substrates,
wherein the unloading includes:
securing the bonded substrates to the upper stage;
raising the upper stage to which the bonded substrates are secured;
arranging a loader proximate the bonded substrates, secured to the upper stage;
releasing the bonded substrates from the upper stage, wherein the released bonded substrates are supported by the loader; and
removing the loader supporting the bonded substrates from the substrate bonding machine.
14. A method for fabricating a liquid crystal display (LCD) panel using a substrate bonding device having a base frame; a lower chamber unit mounted to the base frame, wherein the lower chamber unit includes an upper surface; an upper chamber unit arranged over the lower chamber unit, wherein the upper chamber unit is moveable relative to the base frame and wherein the upper chamber unit includes a lower surface; chamber moving means mounted to the base frame for raising and lowering the upper chamber unit; an upper stage fixed to the upper chamber unit for securing a first substrate; a lower stage fixed to the lower chamber unit for securing a second substrate; and sealing means provided to at least one of the upper and lower surfaces for sealing an interior space surrounding the first and second substrates, wherein the sealed interior space is definable joined ones of the upper and lower chamber units, the method comprising:
loading the first and second substrates onto the upper and lower stages, respectively;
lowering the upper chamber unit to seal the interior space from an external environment via the sealing means;
evacuating the sealed interior space;
moving the upper chamber unit and the upper stage aligning the first and second substrates;
contacting the first and second substrates with a sealant material;
venting the sealed interior space to apply pressure to the first and second substrates contacted by the sealant material, wherein, after the venting, the first and second substrates are bonded together;
unloading the bonded substrates,
wherein the unloading includes:
securing the bonded substrates to the upper stage;
raising the upper stage to which the bonded substrates are secured;
raising a lift pin through the lower stage and over the upper surface, wherein the raised lift pin is proximate the secured bonded substrates;
releasing the bonded substrates from the upper stage, wherein the released bonded substrates are supported by the raised lift pin; and
arranging a loader proximate the bonded substrates supported by the raised lift pin;
lowering the raised lift pin such that the bonded substrates are supported by the loader; and
removing the loader supporting the bonded substrates from the substrate bonding machine.
15. A method for fabricating a liquid crystal display (LCD) panel using a substrate bonding device having a base frame; a lower chamber unit mounted to the base frame, wherein the lower chamber unit includes an upper surface; an upper chamber unit arranged over the lower chamber unit, wherein the upper chamber unit is moveable relative to the base frame and wherein the upper chamber unit includes a lower surface; chamber moving means mounted to the base frame for raising and lowering the upper chamber unit; an upper stage fixed to the upper chamber unit for securing a first substrate; a lower stage fixed to the lower chamber unit for securing a second substrate; and sealing means provided to at least one of the upper and lower surfaces for sealing an interior space surrounding the first and second substrates, wherein the sealed interior space is definable joined ones of the upper and lower chamber units, the method comprising:
loading the first and second substrates onto the upper and lower stages, respectively;
lowering the upper chamber unit to seal the interior space from an external environment via the sealing means;
evacuating the sealed interior space;
moving the upper chamber unit and the upper stage aligning the first and second substrates;
contacting the first and second substrates with a sealant material;
venting the sealed interior space to apply pressure to the first and second substrates contacted by the sealant material, wherein, after the venting, the first and second substrates are bonded together;
unloading the bonded substrates,
wherein the unloading includes:
raising the bonded substrates above the upper surface, wherein the raised bonded substrates are supported by a raised lift pin arranged through the lower stage and over the upper surface;
arranging a loader proximate the raised bonded substrates supported by the lift pin;
lowering the raised lift pin such that the bonded substrates are supported by the loader; and
removing the loader supporting the bonded substrates from the substrate bonding machine.
16. The method as claimed in claim 15, further comprising loading an unbonded substrate onto the upper stage prior to removing the loader supporting the bonded substrates from the substrate bonding machine.