What is claimed is:
1. A method for accessing a circuit region on a flip chip die, the method comprising:
attaching a backplate to the flip chip die, wherein the backplate is a silicon carcass from a discarded die; and
attaching the flip chip die to a first tool; and
accessing the circuit region of the flip chip die.
2. The method of claim 1, wherein the step of attaching the backplate to the flip chip die comprises attaching the backplate to a backside of the flip chip die, the circuit region of the flip chip die located on a front side of the flip chip die and attached to a chip package.
3. The method of claim 1, wherein attaching the flip chip die to the first tool comprises using an adhesive wax that is removable upon heating.
4. The method of claim 1, the method further comprising removing the flip chip die from the first tool and attaching the flip chip die to a second tool.
5. The method of claim 4, wherein removing the flip chip die from the first tool comprises heating the flip chip die.
6. The method of claim 2, wherein accessing the circuit of the flip chip die comprises thinning the chip package.
7. The method of claim 1, wherein attaching the flip chip die to the first tool comprises using an adhesive wax to attach the backplate to the first tool.
8. The method of claim 7, the method further comprising removing the backplate from the first tool and attaching the backplate to a second tool.
9. The method of claim 8, wherein removing the backplate from the first tool comprises heating the backplate.
10. The method of claim 1, wherein attaching the flip chip die to a first tool comprises attaching the backplate to a circuit accessing tool.
11. The method of claim 1, wherein attaching the flip chip die to a first tool comprises attaching the backplate to a circuit testing tool.
12. The method of claim 2, wherein accessing the circuit region of the flip chip die comprises using a polishing tool to thin the chip package.
13. The method of claim 1, wherein the step of accessing the circuit region of the flip chip die comprises:
a global thinning step; and
a local thinning step.
14. The method of claim 13, wherein the global thinning step comprises using a first type polishing blade, and wherein the local thinning step comprises using a second type polishing blade.
15. The method of claim 2, wherein the accessing step comprises polishing off the entire chip package in order to expose an underfill portion of the flip chip die.
16. A device for accessing a circuit region on a flip chip die mounted on a chip package, comprising:
a backplate attached to the flip chip die, wherein the backplate is a silicon carcass from a discarded die; and
a tool, the flip chip die attached thereto.
17. The device of claim 16, wherein the backplate is attached to a backside of the flip chip die, the circuit region of the flip chip die being located on a front side of the flip chip die and attached to the chip package.
18. The device of claim 16, wherein the backplate of the flip chip die is attached to the tool with an adhesive wax which is removable upon heating.
19. A system for accessing a circuit region on a flip chip die that is mounted circuit side down on a chip package, comprising:
a device for accessing the circuit region on the flip chip die, the device comprising:
a backplate attached to the flip chip die, wherein the backplate is a silicon carcass from a discarded die; and
a tool, the flip chip die attached thereto.; and
a controller electrically coupled to the tool for controlling the operation of the tool.
20. The system of claim 19, wherein the backplate of the flip chip die is attached to the tool with an adhesive wax that is removable upon heating.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A multi-piece animal food server comprising:
a feeding component, the feeding component comprising a unitary pre-packaged serving of animal food in a feeding chamber having a removable cover; and
a support component, the support component being configured so that the feeding component can be removably placed therein, wherein the feeding and support components are separate components.
2. The animal food server of claim 1, wherein the feeding component has a bottom and one or more side walls including a top edge and a bottom edge, wherein the bottom edge of the one or more side walls is connected to a perimeter of the bottom forming a feeding surface.
3. The animal food server of claim 1, wherein the feeding component has a border portion surrounding an outer perimeter of the component and a score line and tab along a top surface of the component for removal of the cover.
4. The animal food server of claim 1, wherein the cover is selected from a group consisting of a peelable film, peelable top portion, removable lid, and a removable, reclosable lid.
5. The animal food server of claim 2, wherein the container further includes a projection extending outwardly from the top edge of the one or more side walls.
6. The animal food server of claim 2, wherein the one or more side walls forms a circular side wall.
7. The animal food server of claim 1, wherein the support component includes one or more side members and a top surface, wherein the top surface includes an opening configured to removably receive the feeding component therein.
8. The animal food server of claim 7, wherein the one or more side members forms a circular side member.
9. The animal food server of claim 8, wherein the circular side member extends downwardly and outwardly from the top surface.
10. The animal food server of claim 7, wherein the support component further includes an indented area on its top surface for receiving a portion of the feeding component.
11. The animal food server of claim 1, wherein the feeding component has a bottom component generally in the shape of a plate and a cover that is generally dome shaped.
12. The animal food service of claim 11, wherein the cover includes a peelable seal over its opening.
13. The animal food server of claim 1, wherein the support component is generally rectangular in shape, includes an indentation configured to hold the food component and a leg at each corner of the support component
14. The animal food server of claim 13, wherein the support component further includes a pair of clip members positioned along two opposing and parallel sides of support
15. The animal food server of claim 1, wherein the support component is further configured to engage the feeding component.
16. A method for feeding a animal, the method comprising:
providing a feeding component containing a unitary pre-packaged serving of animal food in a feeding chamber with a removable cover;
providing a support component configured so that the feeding component can be removably placed therein; and
placing the feeding component in the support component for consumption by a animal.
17. The method of claim 16, wherein the feeding component is opened either prior to or after placing the feeding component into the support component.
18. The method of claim 16, wherein the support component includes a support base having one or more side members and a top surface and the top surface includes an opening configured to removably receive the feeding component therein.
19. The method of claim 16, wherein the cover is selected from a group consisting of a peelable film, peelable top portion, removable lid, and a removable, reclosable lid.