1. An image capturing module, comprising:
an image sensing unit including a carrier substrate, an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, a microlens array substrate disposed on the image sensing chip, and a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability; and
an optical auxiliary unit including a housing frame and a movable lens assembly, wherein the housing frame is disposed on the carrier substrate to cover the image sensing chip, the microlens array substrate and the nonconductive photosensitive film layer, and the movable lens assembly is movably disposed in the housing frame.
2. The image capturing module of claim 1, wherein the microlens array substrate includes a light-transmitting substrate and a microlens array disposed on the bottom surface of the light-transmitting substrate, the microlens array is composed of a plurality of micro lenses separated from each other by a predetermined distance, and the nonconductive photosensitive film layer is disposed on the top surface of the light-transmitting substrate.
3. The image capturing module of claim 2, wherein the light-transmitting substrate of the microlens array substrate is adhesively disposed on the image sensing chip through a plurality of adhesive units, and each adhesive unit is formed by mixing adhesive glue and a plurality of micro spacers, wherein the image sensing chip has an image sensing area and a non-image sensing area disposed on the top side thereof, the adhesive units are disposed between the bottom surface of the light-transmitting substrate and the non-image sensing area of the image sensing chip, the microlens array substrate is separated from the image sensing area of the image sensing chip through the adhesive units, and the microlens array of the microlens array substrate correspondingly faces the image sensing area of the image sensing chip.
4. The image capturing module of claim 1, wherein the housing frame includes a first holder disposed on the carrier substrate and a second holder disposed on the first holder, the image sensing chip is disposed on the first holder of the housing frame, and the movable lens assembly is movably disposed in the second holder of the housing frame.
5. An image capturing module, comprising:
an image sensing unit including a carrier substrate, an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, a microlens array substrate disposed on the image sensing chip, a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability, a plurality of conductive lines disposed on the microlens array substrate, and at least one electronic component disposed on the microlens array substrate and electrically connected to the conductive lines; and
an optical auxiliary unit including a housing frame and a movable lens assembly, wherein the housing frame is disposed on the carrier substrate to cover the image sensing chip, the microlens array substrate and the nonconductive photosensitive film layer, and the movable lens assembly is movably disposed in the housing frame.
6. The image capturing module of claim 5, wherein the microlens array substrate includes a light-transmitting substrate and a microlens array disposed on the bottom surface of the light-transmitting substrate, the microlens array is composed of a plurality of micro lenses separated from each other by a predetermined distance, and the nonconductive photosensitive film layer is disposed on the top surface of the light-transmitting substrate.
7. The image capturing module of claim 6, wherein the light-transmitting substrate of the microlens array substrate is adhesively disposed on the image sensing chip through a plurality of adhesive units, and each adhesive unit is formed by mixing adhesive glue and a plurality of micro spacers, wherein the image sensing chip has an image sensing area and a non-image sensing area disposed on the top side thereof, the adhesive units are disposed between the bottom surface of the light-transmitting substrate and the non-image sensing area of the image sensing chip, the microlens array substrate is separated from the image sensing area of the image sensing chip through the adhesive units, and the microlens array of the microlens array substrate correspondingly faces the image sensing area of the image sensing chip.
8. The image capturing module of claim 5, wherein the at least one electronic component is electrically connected to the image sensing chip through the corresponding conductive line and one of an anisotropic conductive film and an anisotropic conductive adhesive in sequence.
9. The image capturing module of claim 5, wherein the housing frame includes a first holder disposed on the carrier substrate and a second holder disposed on the first holder, the image sensing chip is disposed on the first holder of the housing frame, and the movable lens assembly is movably disposed in the second holder of the housing frame.
10. An image sensing unit, comprising:
a carrier substrate;
an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate;
a microlens array substrate disposed on the image sensing chip; and
a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability.
11. The image sensing unit of claim 10, further comprising:
a plurality of conductive lines disposed on the microlens array substrate; and
at least one electronic component disposed on the microlens array substrate and electrically connected to the conductive lines;
wherein the at least one electronic component is electrically connected to the image sensing chip through the corresponding conductive line and one of an anisotropic conductive film and an anisotropic conductive adhesive in sequence.
12. The image sensing unit of claim 10, further comprising: a package resin encapsulation disposed on the carrier substrate to cover one part of the image sensing chip and disposed around the image sensing chip and the microlens array substrate.
13. The image sensing unit of claim 10, wherein the microlens array substrate includes a light-transmitting substrate and a microlens array disposed on the bottom surface of the light-transmitting substrate, the microlens array is composed of a plurality of micro lenses separated from each other by a predetermined distance, and the nonconductive photosensitive film layer is disposed on the top surface of the light-transmitting substrate.
14. The image sensing unit of claim 13, wherein the light-transmitting substrate of the microlens array substrate is adhesively disposed on the image sensing chip through a plurality of adhesive units, and each adhesive unit is formed by mixing adhesive glue and a plurality of micro spacers, wherein the image sensing chip has an image sensing area and a non-image sensing area disposed on the top side thereof, the adhesive units are disposed between the bottom surface of the light-transmitting substrate and the non-image sensing area of the image sensing chip, the microlens array substrate is separated from the image sensing area of the image sensing chip through the adhesive units, and the microlens array of the microlens array substrate correspondingly faces the image sensing area of the image sensing chip.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A card connector, comprising:
an insulating housing defining a card receiving space with a card inserting opening along a card inserting direction;
at least a first set of contacts and a second set of contacts retained in the housing, the sets of contacts comprising corresponding contacting portions exposed into the card receiving space and corresponding soldering portions exposed outside the housing; and
at least a first holding plate with the first contacts arranged thereon and a second holding plate with the second contacts arranged thereon assembled to the housing, and the soldering portions of the second set of contacts arranged alternately with the soldering portions of the first set of contacts respectively.
2. The card connector as described in claim 1, further including a third set of contacts with corresponding contacting portions and soldering portions thereof, wherein the soldering portions of the first set of contacts are alternately arranged with those of the second set of contacts and those of the third set of contacts, respectively.
3. The card connector as described in claim 2, wherein the soldering portions of the first, second and third sets of contacts are arranged alignedly.
4. The card connector as described in claim 3, wherein the soldering portions of first set of contacts are divided into two groups to leave a space therebetween, and wherein the contacting portions of the third contacts are arranged in the space.
5. The card connector as described in claim 2, wherein the housing comprises a top wall, and wherein the top wall defines an opening communicating with the card receiving space, the first and second holding plates are disposed on the housing to cover the opening.
6. The card connector as described in claim 2, wherein the first holding plate assembles together with the second holding plate to insulate the first and second sets of contacts.
7. The card connector as described in claim 6, wherein free ends of the contacting portions of the first set of contacts abut against the second holding plate to locate behind the contacting portions of the second contacts.
8. The card connector as described in claim 7, wherein the second holding plate comprises a plurality of protrusions aligned at front end thereof to shield the free ends of the of the contacting portions of the first set of contacts.
9. The card connector as described in claim 2, wherein the first holding plate is formed with a protruding portion at rear end thereof to prevent a card from mismating.
10. The card connector as described in claim 2, further comprising a shell covering the insulating housing.
11. The card connector as described in claim 2, further comprising a holding member assembled to the housing to hold the soldering portions of the corresponding different sets of contacts.
12. The card connector as described in claim 2, further comprising a sensor contact and a grounding contact.
13. A card connector comprising:
an insulative housing defining a card receiving space therein and a rear portion thereof;
a first set of contacts disposed in the housing and including first contacting portions extending into the card receiving space and first soldering portions located around the rear portion, the first soldering portions being essentially aligned, respectively, with the corresponding first contacting portions in a front-to-back direction; and
a second set of contacts retained in a first holding plate which is attached to the housing, said first set of contacts including second contacting portions extending into the card receiving space and located in a different position with regard to the first contacting portions in said front-to-back direction, and second soldering portions located around the rear portion and essentially aligned with the first soldering portions in a transverse direction perpendicular to said front-to-back direction; wherein
the second contacting portions are not respectively aligned with the corresponding second soldering portions along said front-to-back direction but in an offset manner.
14. The card connector as claimed in claim 13, wherein said second soldering portions are alternately arranged with the first soldering portions.
15. The card connector as claimed in claim 13, wherein said second soldering portions are commonly located in first region and said first soldering portions are commonly located in second region beside said region, said first region being aligned with said second region in said transverse direction.
16. A card connector comprising:
an insulative housing defining a card receiving space therein and a rear portion thereof;
a first set of contacts disposed in a first insulative structure and including first contacting portions extending into the card receiving space and first soldering portions located around the rear portion; and
a second set of contacts retained in a second insulative structure immoveable relative to said first insulative structure, said first set of contacts including second contacting portions extending into the card receiving space and located in a different position with regard to the first contacting portions in said front-to-back direction, and second soldering portions located around the rear portion and essentially aligned with the first soldering portions in a transverse direction perpendicular to said front-to-back direction;
a third set of contacts retained in a third insulative structure immoveable to both first and second insulative structure, said third set of contacts including third contacting portions extending into the card receiving space and located in another different position from the first contacting portions and the second contacting portions in said front-to-back direction, and third soldering portions located around the rear portion and essentially aligned with both the first soldering portions and the second soldering portions in the transverse direction.
17. The card connector as claimed in claim 16, wherein the second soldering portions and the third soldering portions are located in different regions spaced from each other in the transverse direction.
18. The card connector as claimed in claim 17, wherein the first soldering portions are interwoven with both said second soldering portions and said third soldering portions.
19. The card connector as claimed in claim 18, wherein at least one of said first, second and third insulative structures are an integral part of the housing.
20. The card connector as claimed in claim 19, wherein said one of the first, second and third insulative structures is one of said second and third insulative structures.