1. A component arrangement comprising:
a semiconductor chip having a first load terminal, a second load terminal and a control terminal, the first load terminal and the second load terminal being arranged on mutually opposite sides of the semiconductor chip;
a chip carrier on which the semiconductor chip is arranged and which is electrically and thermally conductively connected to the first load terminal of the semiconductor chip;
a contact piece arranged on the second load terminal and electrically and thermally conductively connected to the second load terminal; and
a dielectric compound surrounding the semiconductor chip, the chip carrier and the contact piece thereby forming a package with the chip carrier being exposed on a first side of the package, the contact piece being exposed on a second side of the package opposite the first side and the control terminal being electrically conductively connected to a connecting leg which is passed out of the package.
2. The component arrangement of claim 1, wherein the contact piece has a front area that is larger than the area of the second load terminal, on its side facing away from the semiconductor chip.
3. The component arrangement of claim 1, wherein the contact piece has a first section and has a second section that is arranged between the first section and the semiconductor chip.
4. The component arrangement of claim 3, wherein the first section and the second section are arranged in steps on one another.
5. The component arrangement of claim 3, wherein the control terminal is arranged underneath the first section.
6. The component arrangement of claim 3, wherein the second section is in the form of metallization on the second load terminal.
7. The component arrangement of claim 3, wherein the second section is formed from copper or a copper alloy.
8. The component arrangement of claim 1, wherein the chip carrier is recessed with respect to the first side.
9. The component arrangement of claim 1, wherein the chip carrier projects beyond the first side.
10. The component arrangement of claim 1, wherein the contact piece is recessed with respect to the second side.
11. The component arrangement of claim 1, wherein the contact piece projects beyond the second side.
12. The component arrangement of claim 2, wherein depressions or grooves are arranged on the front area.
13. The component arrangement of claim 1, wherein the contact piece has projections that engage in the package.
14. The component arrangement of claim 2, wherein the chip carrier has a rear area on its side facing away from the semiconductor chip whose area is identical to the front area, or differs from it by less than 10%.
15. The component arrangement of claim 1, wherein the package is formed from a molding compound or an encapsulation compound.
16. The component arrangement of claim 1, wherein the contact piece comprises a spring element.
17. A component cascade comprising:
a first component arrangement; and
a second component arrangement stacked on the first component arrangement;
wherein each of the first and second component arrangements each comprise:
a semiconductor chip having a first load terminal, a second load terminal and a control terminal, the first load terminal and the second load terminal being arranged on mutually opposite sides of the semiconductor chip;
a chip carrier on which the semiconductor chip is arranged and which is electrically and thermally conductively connected to the first load terminal of the semiconductor chip;
a contact piece arranged on the second load terminal and electrically and thermally conductively connected to the second load terminal; and
a dielectric compound surrounding the semiconductor chip, the chip carrier and the contact piece thereby forming a package with the chip carrier being exposed on a first side of the package, the contact piece being exposed on a second side of the package opposite the first side and the control terminal being electrically conductively connected to a connecting leg which is passed out of the package; and
wherein the chip carrier of the second component arrangement is electrically conductively connected over an area of the contact piece of the second component arrangement.
18. A component arrangement comprising:
a semiconductor chip having a first and second load terminals and a control terminal;
a chip carrier on which the semiconductor chip is arranged and which is electrically and thermally conductively connected to the first load terminal of the semiconductor chip;
a contact piece arranged on the second load terminal and electrically and thermally conductively connected to the second load terminal; and
a package surrounding the semiconductor chip, the chip carrier and the contact piece, the package formed of a dielectric compound;
means for exposing the chip carrier on a first side of the package and for exposing the contact piece on a second side of the package opposite the first side; and
means for electrically conductively connecting to the control terminal from outside the package.
19. The component arrangement of claim 18, wherein the first load terminal and the second load terminal are arranged on mutually opposite sides of the semiconductor chip.
20. The component arrangement of claim 18, wherein the control terminal is electrically conductively connected to a connecting leg that is passed out of the package.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A visual voicemail system, comprising:
a personal media storage system configured to store visual voicemail content;
a visual voicemail server communicatively connected to the personal media storage system; the visual voicemail server configured to:
receive the visual voicemail content;
store the visual voicemail content on the personal media storage system;
receive a request for the visual voicemail content; and
retrieve the visual voicemail content from the personal media storage system.
2. The visual voicemail system of claim 1, wherein the request for the visual voicemail content is received from a visual voicemail client.
3. The visual voicemail system of claim 1, wherein the visual voicemail server configured to receive the visual voicemail content comprises the visual voicemail server configured to obtain the visual voicemail content from a remote device.
4. The visual voicemail system of claim 1, wherein the visual voicemail server configured to retrieve the visual voicemail content from the personal media storage system comprises the visual voicemail server configured to:
retrieve visual voicemail content location data from the personal media storage system; and
obtain the visual voicemail content from a remote device based on the visual voicemail content location data.
5. The visual voicemail system of claim 1, wherein the personal media storage system configured to store the visual voicemail content comprises the personal media storage system configured to associate the visual voicemail content with a visual voicemail.
6. The visual voicemail system of claim 1, wherein the visual voicemail server is further configured to: transmit a notification of the visual voicemail content to a visual voicemail client.
7. The visual voicemail system of claim 1, wherein the visual voicemail content comprises at least one of audio content, text content, and video content.
8. The visual voicemail system of claim 1, wherein the visual voicemail server is further configured to:
receive a request from a first user device to transmit the visual voicemail content to a second user device;
retrieve the visual voicemail content from the personal media storage system; and
transmit the visual voicemail content to the second user device.
9. A method of storing and retrieving visual voicemail content, the method comprising:
receiving the visual voicemail content at a visual voicemail server communicatively connected to a personal media storage system;
storing the visual voicemail content at the personal media storage system;
receiving a request for the visual voicemail content; and
retrieving the visual voicemail content from the personal media storage system.
10. The method of claim 9, wherein the request for the visual voicemail content is received from a visual voicemail client.
11. The method of claim 9, receiving the visual voicemail content comprises obtaining the visual voicemail content from a remote device.
12. The method of claim 9, retrieving the visual voicemail content from the personal media storage system comprises:
retrieving visual voicemail content location data from the personal media storage system; and
obtaining the visual voicemail content from a remote device based on the visual voicemail content location data.
13. The method of claim 9, wherein storing the visual voicemail content at the personal media storage system comprises associating the visual voicemail content with a visual voicemail.
14. The method of claim 9, further comprising transmitting a notification of the visual voicemail content to a visual voicemail client.
15. The method of claim 9, wherein the visual voicemail content comprises at least one of audio content, text content, and video content.
16. The method of claim 9, further comprising:
receiving a request from a first user device to transmit the visual voicemail content to a second user device;
retrieving the visual voicemail content from the personal media storage system; and
transmitting the visual voicemail content to the second user device.
17. A wireless communications device configured to:
receive a notification of visual voicemail content;
display the notification;
detect the selection of the visual voicemail content;
establish a communications link with a visual voicemail server;
request the visual voicemail content via the communications link;
receive the visual voicemail content via the communications link; and
present the visual voicemail content.
18. The wireless communication device of claim 17, wherein the visual voicemail content comprises video content, and wherein the wireless communications device configured to present the visual voicemail content comprises the wireless communications device configured to render the video content.
19. The wireless communication device of claim 17, wherein the wireless communications device is configured to present the visual voicemail content within a visual voicemail client.
20. The wireless communication device of claim 17, wherein the selection of the visual voicemail content generates an instruction to obtain the visual voicemail content from a remote device.