1. A superposition coded packet structure, comprising:
at least one preamble, wherein said at least one preamble comprises superposition coded packet parameters and non-superposition coded packet parameters; and
a payload having a plurality of data packets.
2. The superposition coded packet structure according to claim 1, wherein said superposition coded packet parameters include:
a number of users in the superposition coded packet;
a length of the superposition coded packet;
a fractional power allocation for each said superposition coded packet user;
a payload size for each said superposition coded packet user;
a physical address of each said superposition coded user; and
an indicator of whether the packet is a single-user data packet, a multi-user data packet, or a multi-user, superposition coded packet.
3. The superposition coded packet structure according to claim 1, wherein said superposition coded packet comprises at least one higher layer and at least one lower layer, wherein said at least one lower layer comprises at least one broadcast service and said at least one higher layer comprises unicast traffic directed to an individual user, whereby both broadcast and unicast traffic may be transmitted together.
4. The superposition coded packet structure according to claim 3, wherein said at least one broadcast service is a control channel in 1\xd7EV-DO.
5. The superposition coded packet structure according to claim 3, wherein said at least one broadcast service comprises platinum broadcast, wherein information intended for a particular region may be transmitted.
6. The superposition coded packet structure according to claim 3, wherein said at least one lower layer of said superposition packet comprises a control channel in 1\xd7EV-DO and said at least one higher layer of said superposition packet comprises OFDM tones.
7. The superposition coded packet structure according to claim 3, wherein said at least one higher layer of said superposition packet comprises OFDMA packets.
8. The superposition coded packet structure according to claim 3, wherein said at least one lower layer of said superposition packet comprises GSM and said at least one higher layer of said superposition packet comprises OFDMA packets.
9. An apparatus to compile a superposition coded packet, the comprising
a transmitter, having
a plurality of encoders having at least one input and at least one output;
a plurality of modulators having at least one input and at least one output, wherein said at least one input is operably connected to a corresponding at least one output of said plurality of encoders;
a plurality of multipliers having a first input, a second input and at least one output, wherein said at least one input is operably connected to a corresponding at least one output of said plurality of modulators and said second input is operably connected to a scaled transmission power, wherein said encoded and modulated data packets are multiplied by said scaled transmission power; and
at least one adder having a plurality of inputs and at least one output, wherein said plurality of inputs are operably connected to said at least one output of said of said plurality of multipliers.
10. The apparatus to compile a superposition coded packet according to claim 9, wherein the plurality of encoders comprise:
a first encoder having at least one input and at least one output, whereby OFDM pilot tones and frequency domain symbols are produced; and
a second encoder having at least one input and at least one output, whereby 1\xd7EV-DO data and MIMO pilot tones are produced;
wherein the plurality of digital signal processors comprise:
a first digital signal processor having at least one input and at least one output, wherein said at least one input is operably connected to a corresponding at least one output of said first encoder, whereby an inverse Fourier transform is applied to said OFDM pilot tones and to said frequency domain symbols produced by said first encoder, whereby digital time-domain OFDM symbols are produced; and
a second digital signal processor having at least one input and at least one output, wherein said at least one input is operably connected to a corresponding at least one output of said second encoder, whereby an inverse Fourier transform is applied to MIMO pilot tones, whereby processed MIMO pilot tones are produced;
wherein the plurality of multipliers comprise:
a first multiplier having a first input, a second input and at least one output, wherein said at least one input is operably connected to said at least one output of said second digital signal processor and said second input is operably connected to a first scaled transmission power, wherein said processed MIMO pilot tones are multiplied by said first scaled transmission power; and
a second multiplier having a first input, a second input and at least one output, wherein said at least one input is operably connected to said at least one output of said encoder and said second input is operably connected to a second scaled transmission power, wherein said 1\xd7EV-DO data is multiplied by said second scaled transmission power;
wherein the plurality of adders comprise:
a first adder having a plurality of inputs and at least one output, wherein said plurality of inputs are operably connected to said at least one output of said first multiplier and said at least one output of said second multiplier; and
said second adder having a plurality of inputs and at least one output, wherein said plurality of inputs are operably connected to said at least one output of said first and said second multipliers and said at least one output of said first adder; and
a third multiplier having at least one input and at least one output, wherein said at least one input is operably connected to a 1\xd7EV-DO pilot signal, a 1\xd7EV-DO MAC signal, a preamble and said at least one output of said least one output of said second adder.
11. The superposition coded packet according to claim 9, wherein said superposition coded packet comprises at least one higher layer and at least one lower layer, wherein said at least one lower layer comprises at least one broadcast service and said at least one higher layer comprises unicast traffic directed to an individual user, whereby both broadcast and unicast traffic may be transmitted together.
12. The superposition coded packet according to claim 11, wherein said at least one broadcast service is a control channel in 1\xd7EV-DO.
13. The superposition coded packet according to claim 11, wherein said at least one broadcast service comprises platinum broadcast, wherein information intended for a particular region may be transmitted.
14. The superposition coded packet according to claim 11, wherein said at least one lower layer of said superposition packet comprises a control channel in 1\xd7EV-DO and said at least one higher layer of said superposition packet comprises OFDM tones.
15. The superposition coded packet according to claim 11, wherein said at least one higher layer of said superposition packet comprises OFDMA packets.
16. The superposition coded packet according to claim 11, wherein said at least one lower layer of said superposition packet comprises GSM and said at least one higher layer of said superposition packet comprises OFDMA packets.
17. A method to compile a superposition coded packet, comprising:
compiling user candidates for superposition coding;
ranking said user candidates based on a result of an evaluation function;
selecting a deserving user candidate from among said user candidates; and
adding other user data packets to a packet of said deserving user.
18. The method according to claim 17, wherein the evaluation function utilizes at least one data rate request.
19. The method according to claim 17, wherein said evaluation function comprises:
F
i
\ue8a0
(
n
)
=
max
i
\ue89e
(
DRC
i
\ue8a0
(
n
)
R
i
\ue8a0
(
n
)
)
where,
Fi(n) is the evaluation function for user \u201ci\u201d at a time slot \u201cn,\u201d where i=1, . . . , N;
DRCi(n) is the instantaneous data rate requested by said user \u201ci\u201d in the time slot \u201cn\u201d;
Ri(n) is the average data rate successfully received by said user \u201ci\u201d over a time window of appropriate size; and
maxi(\u2022) returns a maximum value for determined parenthetical numeric values of user \u201ci.\u201d
20. The method according to claim 17, wherein said evaluation function comprises:
F
i
\ue8a0
(
n
)
=
max
i
\ue89e
(
DRC
i
\ue8a0
(
n
)
R
i
\ue8a0
(
n
)
\xd7
1
\u3008
DRC
i
\ue8a0
(
n
)
\u3009
)
where,
DRCi(n) represents the average data rate requested by user \u201ci\u201d in a given time slot \u201cn\u201d over a time window of appropriate size.
21. The method according to claim 17, further comprising determining if there are any pre-superposition coding criteria.
22. The method according to claim 17, wherein said step of adding other user data packets to a packet of said deserving user data packet, comprises:
compiling a list of user candidates for superposition coding; and
selecting at least one of said user candidates based on maximizing a throughput transmission rate.
23. The method according to claim 17, wherein said data packets for said user candidates may conform to different wireless communication standards.
24. The method according to claim 22, wherein said step of adding other user data packets to a packet of said deserving user data packet, further comprises:
eliminating said user candidate having a requested data rate control less than the data rate control of said most deserving user.
25. The method according to claim 22, wherein said step of adding other user data packets to a packet of said deserving user data packet, further comprises:
retaining said user candidate with a highest average data rate control if more than one of said candidate users has a same said data rate control.
26. The method according to claim 22, wherein said step of adding other user data packets to a packet of said deserving user data packet, further comprises:
computing power allocations between said user candidates;
determining a maximum transmission rate for at least one combination of said user candidates;
selecting said combination that maximizes said transmission rate; and
compiling said superposition coded packet from said selected combination.
27. The method according to claim 23, wherein at least one of said wireless communication standards uses orthogonal frequency division multiple access.
28. The method according to claim 23, wherein at least one of said wireless communication standards uses code division multiple access.
29. The method according to claim 23, wherein at least one of said wireless communication standards uses global system for mobile communications.
30. The method according to claim 23, wherein said superposition coded packet comprises at least one higher layer and at least one lower layer, wherein said at least one lower layer comprises at least one broadcast service and said at least one higher layer comprises unicast traffic directed to an individual user, whereby both broadcast and unicast traffic may be transmitted together.
31. The method according to claim 26, wherein said step of determining said maximum transmission rate for at least one combination of said user candidates uses the following equation:
R
i
=
log
2
(
1
+
\u03b1
i
\ue89e
P
T
N
i
+
\u2211
j
>
i
\ue89e
\u03b1
j
\ue89e
P
T
)
where
Ri represents a maximum transmission rate for each user combination;
PT represents a total power used to transmit the superposition coded packet;
\u03b1 (\u201calpha\u201d) represents a scalar applied to the total transmitted power PT; and
Ni represents a noise spectral power density of internal noise that may be contributed by a base station to an incoming signal.
32. The method according to claim 26, wherein said step of computing power allocations between said user candidates comprises computing at least one alpha scalar.
33. The method according to claim 26, further comprising
transmitting said superposition coded packet; and
reallocating a power transmission of at least one successful decoding user to an unsuccessful said decoding user having a next higher signal to information and noise ratio.
34. The method according to claim 30, wherein said at least one broadcast service is a control channel in 1\xd7EV-DO.
35. The method according to claim 30, wherein said at least one broadcast service comprises platinum broadcast, wherein information intended for a particular region may be transmitted.
36. The method according to claim 30, wherein said at least one lower layer of said superposition packet comprises a control channel in 1\xd7EV-DO and said at least one higher layer of said superposition packet comprises OFDM tones.
37. The method according to claim 30, wherein said at least one higher layer of said superposition packet comprises OFDMA packets.
38. The method according to claim 30, wherein said at least one lower layer of said superposition packet comprises GSM and said at least one higher layer of said superposition packet comprises OFDMA packets.
39. An apparatus to compile a superposition coded packet, the comprising
at least one processor;
at least one input device operably connected to said processor;
at least one output device operably connected to said processor; and
at least one memory comprising instructions to compile a superposition coded packet operably connected to said processor, wherein said apparatus is adapted to execute said instructions and wherein said instructions to compile a superposition coded packet further comprises instructions to:
compile user candidates for superposition coding;
rank said user candidates based on a result of an evaluation function;
select a deserving user candidate from among said user candidates; and
add other user data packets to a packet of said deserving user.
40. The apparatus according to claim 39, wherein the evaluation function utilizes at least one data rate request.
41. The apparatus according to claim 39, wherein said evaluation function comprises:
F
i
\ue8a0
(
n
)
=
max
i
\ue89e
(
DRC
i
\ue8a0
(
n
)
R
i
\ue8a0
(
n
)
)
where,
Fi(n) is the evaluation function for user \u201ci\u201d at a time slot \u201cn,\u201d where i=1, . . . , N;
DRCi(n) is the instantaneous data rate requested by said user \u201ci\u201d in the time slot \u201cn\u201d;
Ri(n) is the average data rate successfully received by said user \u201ci\u201d over a time window of appropriate size; and
maxi(\u2022) returns a maximum value for determined parenthetical numeric values of user \u201ci.\u201d
42. The apparatus according to claim 39, wherein said evaluation function comprises:
F
i
\ue8a0
(
n
)
=
max
i
\ue89e
(
DRC
i
\ue8a0
(
n
)
R
i
\ue8a0
(
n
)
\xd7
1
\u3008
DRC
i
\ue8a0
(
n
)
\u3009
)
where,
DRCi(n) represents the average data rate requested by user \u201ci\u201d in a given time slot \u201cn\u201d over a time window of appropriate size.
43. The apparatus according to claim 39, further comprising at least one instruction to determine if there are any pre-superposition coding criteria.
44. The apparatus according to claim 39, wherein said instruction to add other user data packets to a packet of said deserving user data packet, further comprises at least one instruction to:
compile a list of user candidates for superposition coding; and
select at least one of said user candidates based on maximizing a throughput transmission rate.
45. The apparatus according to claim 39, wherein said data packets for said user candidates may conform to different wireless communication standards.
46. The apparatus according to claim 44, wherein said instruction to add other user data packets to a packet of said deserving user data packet, further comprises at least one instruction to:
eliminate said user candidate having a requested data rate control less than the data rate control of said most deserving user.
47. The apparatus according to claim 44, wherein said instruction to add other user data packets to a packet of said deserving user data packet, further comprises at least one instruction to:
retain said user candidate with a highest average data rate control if more than one of said candidate users has a same said data rate control.
48. The apparatus according to claim 44, wherein said instruction to add other user data packets to a packet of said deserving user data packet, further comprises at least one instruction to:
compute power allocations between said user candidates;
determine a maximum transmission rate for at least one combination of said user candidates;
select said combination that maximizes said transmission rate; and
compile said superposition coded packet from said selected combination.
49. The apparatus according to claim 45, wherein at least one of said wireless communication standards uses orthogonal frequency division multiple access.
50. The apparatus according to claim 45, wherein at least one of said wireless communication standards uses code division multiple access.
51. The apparatus according to claim 45, wherein at least one of said wireless communication standards uses global system for mobile communications.
52. The apparatus according to claim 45, wherein said superposition coded packet comprises at least one higher layer and at least one lower layer, wherein said at least one lower layer comprises at least one broadcast service and said at least one higher layer comprises unicast traffic directed to an individual user, whereby both broadcast and unicast traffic may be transmitted together.
53. The apparatus according to claim 48, wherein said instruction to determine said maximum transmission rate for at least one combination of said user candidates uses the following equation:
R
i
=
log
2
(
1
+
\u03b1
i
\ue89e
P
T
N
i
+
\u2211
j
>
i
\ue89e
\u03b1
j
\ue89e
P
T
)
where
Ri represents a maximum transmission rate for each user combination;
PT represents a total power used to transmit the superposition coded packet;
\u03b1 (\u201calpha\u201d) represents a scalar applied to the total transmitted power PT; and
Ni represents a noise spectral power density of internal noise that may be contributed by a base station to an incoming signal.
54. The apparatus according to claim 48, wherein said instruction to compute power allocations between said user candidates comprises at least one instruction to compute at least one alpha scalar.
55. The apparatus according to claim 48, further comprising at least one instruction to:
transmit said superposition coded packet; and
reallocate a power transmission of at least one successful decoding user to an unsuccessful said decoding user having a next higher signal to information and noise ratio.
56. The apparatus according to claim 52, wherein said at least one broadcast service is a control channel in 1\xd7EV-DO.
57. The apparatus according to claim 52, wherein said at least one broadcast service comprises platinum broadcast, wherein information intended for a particular region may be transmitted.
58. The apparatus according to claim 52, wherein said at least one lower layer of said superposition packet comprises a control channel in 1\xd7EV-DO and said at least one higher layer of said superposition packet comprises OFDM tones.
59. The apparatus according to claim 52, wherein said at least one higher layer of said superposition packet comprises OFDMA packets.
60. The apparatus according to claim 52, wherein said at least one lower layer of said superposition packet comprises GSM and said at least one higher layer of said superposition packet comprises OFDMA packets.
61. A method to process a superposition coded packet, comprising:
receiving at least one data packet;
reading a preamble;
determining if a user is a most deserving user; and
processing said received packet.
62. The method according to claim 61, wherein said step of processing said received packet comprises:
processing said received at least one data packet by assuming that from 60 to 100% of a total transmitted power was allocated if said user is a most deserving user.
63. The method according to claim 61, wherein said step of processing said received packet comprises:
treating said at least one data packet for stronger users as interference and canceling such data packets; and
decoding and subtracting out said at least one data packet meant for weaker users.
64. The method according to claim 61, wherein said at least one data packet may conform to different wireless communication standards.
65. The method according to claim 61, further comprising:
sending an acknowledgement concerning said processed at least one data packet.
66. The method according to claim 63, wherein said step of treating said at least one data packet for stronger users as interference and canceling such data packets comprises using successive interference cancellation.
67. The method according to claim 64, wherein said superposition coded packet comprises at least one higher layer and at least one lower layer, wherein said at least one lower layer comprises at least one broadcast service and said at least one higher layer comprises unicast traffic directed to an individual user, whereby both broadcast and unicast traffic may be transmitted together.
68. The method according to claim 65, further comprising:
re-allocating power from sending of at least one successful decoding user to at least one unsuccessful decoding user.
69. The method according to claim 65, further comprising:
terminating transmission for a layer early if all of said layer’s users acknowledge receipt of their packet.
70. The method according to claim 67, wherein said at least one broadcast service is a control channel in 1\xd7EV-DO.
71. The method according to claim 67, wherein said at least one broadcast service comprises platinum broadcast, wherein information intended for a particular region may be transmitted.
72. The method according to claim 67, wherein said at least one lower layer of said superposition packet comprises a control channel in 1\xd7EV-DO and said at least one higher layer of said superposition packet comprises OFDM tones.
73. The method according to claim 67, wherein said at least one lower layer of said superposition packet comprises at least one higher layer of said superposition packet comprises OFDMA packets.
74. The method according to claim 67, wherein said at least one lower layer of said superposition packet comprises GSM and said at least one higher layer of said superposition packet comprises OFDMA packets.
75. An apparatus to compile a superposition coded packet, the comprising
at least one processor;
at least one input device operably connected to said processor;
at least one output device operably connected to said processor; and
at least one memory comprising instructions to process a superposition coded packet operably connected to said processor, wherein said apparatus is adapted to execute said instructions and wherein said instructions to process a superposition coded packet further comprises instructions to:
receive a packet;
read a preamble;
determine if a user is a most deserving user; and
process said received packet.
76. The apparatus according to claim 75, wherein said instruction to process said receive said packet comprises at least one instruction to:
process said received packet by assuming that from 60 to 100% of a total transmitted power was allocated if said user is a most deserving user.
77. The apparatus according to claim 75, wherein said instruction to process said receive said packet comprises at least one instruction to:
treat data packets for stronger users as interference and cancel such data packets; and
decode and subtract out data packets meant for weaker users.
78. The apparatus according to claim 75, wherein said at least one data packet may conform to different wireless communication standards:
79. The apparatus according to claim 75, further comprising at least one instruction to:
send an acknowledgement concerning said processed packet.
80. The apparatus according to claim 77, wherein said instruction to treat data packets for stronger users as interference and cancel such data packets comprises at least one instruction to use successive interference cancellation.
81. The apparatus according to claim 78, wherein said superposition coded packet comprises at least one higher layer and at least one lower layer, wherein said at least one lower layer comprises at least one broadcast service and said at least one higher layer comprises unicast traffic directed to an individual user, whereby both broadcast and unicast traffic may be transmitted together.
82. The apparatus according to claim 79, further comprising at least one instruction to:
re-allocate sending of at least one successful decoding user to at least one unsuccessful decoding user.
83. The apparatus according to claim 79, further comprising at least one instruction to:
terminate transmission for a layer early if all of said layer’s users acknowledge receipt of their packet.
84. The apparatus according to claim 81, wherein said at least one broadcast service is a control channel in 1\xd7EV-DO.
85. The apparatus according to claim 81, wherein said at least one broadcast service comprises platinum broadcast, wherein information intended for a particular region may be transmitted.
86. The apparatus according to claim 81, wherein said at least one lower layer of said superposition packet comprises a control channel in 1\xd7EV-DO and said at least one higher layer of said superposition packet comprises OFDM tones.
87. The apparatus according to claim 81, wherein said at least one higher layer of said superposition packet comprises OFDMA packets.
88. The apparatus according to claim 81, wherein said at least one lower layer of said superposition packet comprises GSM and said at least one higher layer of said superposition packet comprises OFDMA packets.
89. A means for compiling a superposition coded packet, comprising:
means for compiling user candidates for superposition coding;
means for ranking said user candidates based on a result of an evaluation function; Paragraph 00071,
means for selecting a deserving user candidate from among said user candidates; Paragraph 0075, and
means for adding other user data packets to a packet of said deserving user.
90. The means for compiling a superposition coded packet according to claim 89, wherein the evaluation function utilizes at least one data rate request.
91. The means for compiling a superposition coded packet according to claim 89, wherein said evaluation function comprises:
F
i
\ue8a0
(
n
)
=
max
i
\ue89e
(
DRC
i
\ue8a0
(
n
)
R
i
\ue8a0
(
n
)
)
where,
Fi(n) is the evaluation function for user \u201ci\u201d at a time slot \u201cn,\u201d where i=1, . . . , N;
DRCi(n) is the instantaneous data rate requested by said user \u201ci\u201d in the time slot \u201cn\u201d;
Ri(n) is the average data rate successfully received by said user \u201ci\u201d over a time window of appropriate size; and
maxi(\u2022) returns a maximum value for determined parenthetical numeric values of user \u201ci.\u201d
92. The means for compiling a superposition coded packet according to claim 89, wherein said evaluation function comprises:
F
i
\ue8a0
(
n
)
=
max
i
\ue89e
(
DRC
i
\ue8a0
(
n
)
R
i
\ue8a0
(
n
)
\xd7
1
\u3008
DRC
i
\ue8a0
(
n
)
\u3009
)
where,
DRCi(n) represents the average data rate requested by user \u201ci\u201d in a given time slot \u201cn\u201d over a time window of appropriate size.
93. The means for compiling a superposition coded packet according to claim 89, further comprising means for determining if there are any pre-superposition coding criteria.
94. The means for compiling a superposition coded packet according to claim 89, wherein said means for adding other user data packets to a packet of said deserving user data packet, comprises:
means for compiling a list of user candidates for superposition coding; and
means for selecting at least one of said user candidates based on maximizing a throughput transmission rate.
95. The means for compiling a superposition coded packet according to claim 89, wherein said data packets for said user candidates may conform to different wireless communication standards.
96. The means for compiling a superposition coded packet according to claim 94, wherein said means for adding other user data packets to a packet of said deserving user data packet, further comprises:
means for eliminating said user candidate having a requested data rate control less than the data rate control of said most deserving user.
97. The means for compiling a superposition coded packet according to claim 94, wherein said means for adding other user data packets to a packet of said deserving user data packet, further comprises:
means for retaining said user candidate with a highest average data rate control if more than one of said candidate users has a same said data rate control.
98. The means for compiling a superposition coded packet according to claim 94, wherein said means for adding other user data packets to a packet of said deserving user data packet, further comprises:
means for computing power allocations between said user candidates;
means for determining a maximum transmission rate for at least one combination of said user candidates;
means for selecting said combination that maximizes said transmission rate; and
means for compiling said superposition coded packet from said selected combination.
99. The means for compiling a superposition coded packet according to claim 95, wherein at least one of said wireless communication standards uses orthogonal frequency division multiple access.
100. The means for compiling a superposition coded packet according to claim 95, wherein at least one of said wireless communication standards uses code division multiple access.
101. The means for compiling a superposition coded packet according to claim 95, wherein at least one of said wireless communication standards uses global system for mobile communications.
102. The means for compiling a superposition coded packet according to claim 95, wherein said superposition coded packet comprises at least one higher layer and at least one lower layer, wherein said at least one lower layer comprises at least one broadcast service and said at least one higher layer comprises unicast traffic directed to an individual user, whereby both broadcast and unicast traffic may be transmitted together.
103. The means for compiling a superposition coded packet according to claim 26, wherein said means for determining said maximum transmission rate for at least one combination of said user candidates uses the following equation:
R
i
=
log
2
(
1
+
\u03b1
i
\ue89e
P
T
N
i
+
\u2211
j
>
i
\ue89e
\u03b1
j
\ue89e
P
T
)
where
Ri represents a maximum transmission rate for each user combination;
PT represents a total power used to transmit the superposition coded packet;
\u03b1 (\u201calpha\u201d) represents a scalar applied to the total transmitted power PT; and
Ni represents a noise spectral power density of internal noise that may be contributed by a base station to an incoming signal.
104. The means for compiling a superposition coded packet according to claim 98, wherein said means for computing power allocations between said user candidates comprises means for computing at least one alpha scalar.
105. The means for compiling a superposition coded packet according to claim 98, further comprising
means for transmitting said superposition coded packet; and
means for reallocating a power transmission of at least one successful decoding user to an unsuccessful said decoding user having a next higher signal to information and noise ratio.
106. The means for compiling a superposition coded packet according to claim 102, wherein said at least one broadcast service is a control channel in 1\xd7EV-DO.
107. The means for compiling a superposition coded packet according to claim 102, wherein said at least one broadcast service comprises platinum broadcast, wherein information intended for a particular region may be transmitted.
108. The means for compiling a superposition coded packet according to claim 102, wherein said at least one lower layer of said superposition packet comprises a control channel in 1\xd7EV-DO and said at least one higher layer of said superposition packet comprises OFDM tones.
109. The means for compiling a superposition coded packet according to claim 102, wherein said at least one higher layer of said superposition packet comprises OFDMA packets.
110. The means for compiling a superposition coded packet according to claim 102, wherein said at least one lower layer of said superposition packet comprises GSM and said at least one higher layer of said superposition packet comprises OFDMA packets.
111. A means for processing a superposition coded packet, comprising:
means for receiving at least one data packet;
means for reading a preamble;
means for determining if a user is a most deserving user; and
means for processing said received packet.
112. The means for processing a superposition coded packet according to claim 111, wherein said step of processing said received packet comprises:
means for processing said received at least one data packet by assuming that from 60 to 100% of a total transmitted power was allocated if said user is a most deserving user.
113. The means for processing a superposition coded packet according to claim 111, wherein said means for processing said received packet comprises:
means for treating said at least one data packet for stronger users as interference and canceling such data packets; and
means for decoding and subtracting out said at least one data packet meant for weaker users.
114. The means for processing a superposition coded packet according to claim 111, wherein said at least one data packet may conform to different wireless communication standards.
115. The means for processing a superposition coded packet according to claim 111, further comprising:
means for sending an acknowledgement concerning said processed at least one data packet.
116. The means for processing a superposition coded packet according to claim 113, wherein said means for treating said at least one data packet for stronger users as interference and canceling such data packets comprises using successive interference cancellation.
117. The means for processing a superposition coded packet according to claim 114, wherein said superposition coded packet comprises at least one higher layer and at least one lower layer, wherein said at least one lower layer comprises at least one broadcast service and said at least one higher layer comprises unicast traffic directed to an individual user, whereby both broadcast and unicast traffic may be transmitted together.
118. The means for processing a superposition coded packet according to claim 115, further comprising:
means for re-allocating power from sending of at least one successful decoding user to at least one unsuccessful decoding user.
119. The means for processing a superposition coded packet according to claim 115, further comprising:
means for terminating transmission for a layer early if all of said layer’s users acknowledge receipt of their packet.
120. The means for processing a superposition coded packet according to claim 117, wherein said at least one broadcast service is a control channel in 1\xd7EV-DO.
121. The means for processing a superposition coded packet according to claim 117, wherein said at least one broadcast service comprises platinum broadcast, wherein information intended for a particular region may be transmitted.
122. The means for processing a superposition coded packet according to claim 117, wherein said at least one lower layer of said superposition packet comprises a control channel in 1\xd7EV-DO and said at least one higher layer of said superposition packet comprises OFDM tones.
123. The means for processing a superposition coded packet according to claim 117, wherein said at least one lower layer of said superposition packet comprises at least one higher layer of said superposition packet comprises OFDMA packets.
124. The means for processing a superposition coded packet according to claim 117, wherein said at least one lower layer of said superposition packet comprises GSM and said at least one higher layer of said superposition packet comprises OFDMA packets.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A bonded semiconductor wafer composite for fabricating semiconductor devices, the bonded semiconductor wafer comprising:
a metal support substrate having a first diameter, the metal support substrate including an upper surface, the upper surface being substantially planar, the metal support structure being characterized by a first coefficient of thermal expansion parameter;
a plurality of trapezoidal shaped tiles comprising a compound semiconductor material, the plurality of trapezoidal shaped tiles being bonded onto the upper surface of the metal support substrate, each of the trapezoidal shaped tiles including at least one edge, the one edge being aligned with an edge of a different trapezoidal shaped tile, each of the plurality of trapezoidal shaped tiles being characterized by a second coefficient of thermal expansion parameter;
a eutectic bonding material coupled between each of the trapezoidal shaped tiles and a portion of the upper surface of the metal support substrate, the eutectic bonding material providing a continuous mechanical and electrical contact between the portion of the upper surface and the trapezoidal shaped tile;
wherein the first coefficient of thermal expansion parameter is within a predetermined amount of the second coefficient of thermal expansion parameter, the predetermined amount being selected to reduce a possibility of breakage of any portion of any trapezoidal shaped tile bonded to the portion of the upper surface of the metal substrate from a thermal influence; and
wherein each of the trapezoidal shaped tiles being derived from a compound semiconductor substrate of a second diameter, the second diameter being less than the first diameter associated with the metal substrate; each of the trapezoidal shaped tiles comprising a predetermined thickness.
2. A semiconductor wafer composite for fabricating a semiconductor device, the semiconductor wafer composite comprising:
a metallic substrate; and
at least one semiconductor tile bonded to the metallic substrate.
3. The semiconductor wafer composite as claimed in claim 2, wherein the at least one semiconductor tile is sequentially (i) cut to a predetermined shape, (ii) thinned, and (iii) bonded to the metallic substrate.
4. The semiconductor wafer composite as claimed in claim 2, wherein the at least one semiconductor tile is sequentially (i) thinned, (ii) cut to a predetermined shape, and (iii) bonded to the metallic substrate.
5. The semiconductor wafer composite as claimed in claim 2, wherein the at least one semiconductor tile is sequentially (i) cut to a predetermined shape, (ii) bonded to the metallic substrate, and (iii) thinned.
6. The semiconductor wafer composite as claimed in claim 2, wherein connections are formed between semiconductor devices on a front-side surface of the at least one semiconductor tile and the metallic substrate by etching apertures in semiconductor material from a front-side of the at least one semiconductor tile and patterning a metal layer across the resulting front-side surface and aperture walls.
7. The semiconductor wafer composite as claimed in claim 6, wherein semiconductor material is removed from the at least one semiconductor tile to form elongated trenches arranged to form perimeters around portions of a surface of the at least one semiconductor tile.
8. The semiconductor wafer composite as claimed in claim 2, wherein the semiconductor wafer composite is diced to form individual integrated circuits having metallic substrates.
9. The semiconductor wafer composite as claimed in claim 2, wherein the metallic substrate comprises a metallic base layer, and a bonding layer to which the at least one semiconductor tile is bonded.
10. The semiconductor wafer composite as claimed in claim 2, wherein the metallic substrate further comprises an inert coating layer that substantially covers at least part of the metallic base layer andor the bonding layer.
11. The semiconductor wafer composite as claimed in claim 2, wherein the at least one semiconductor tile comprises a compound semiconductor.
12. The semiconductor wafer composite as claimed in claim 11, wherein the at least one semiconductor tile further comprises a complementary bonding layer suitable for adhering to the metallic substrate.
13. The semiconductor wafer composite as claimed in claim 12, wherein the complementary bonding layer is predominantly formed of one or more metals, one of which is a noble metal.
14. The semiconductor wafer composite as claimed in claim 9, wherein the bonding layer is predominantly formed of two or more metals that form a eutectic alloy when heated.
15. The semiconductor wafer composite as claimed in claim 10, wherein the inert coating layer is predominantly formed of a noble metal.
16. The semiconductor wafer composite as claimed in claim 2, wherein the metallic substrate and the at least one semiconductor tile have respective coefficients of thermal expansion that are substantially similar values.
17. The semiconductor wafer composite as claimed in claim 2, wherein the at least one semiconductor tile has a substantially rectangular or square shape.
18. A method of manufacturing a semiconductor wafer composite for fabricating a semiconductor device, the method comprising:
providing a metallic substrate; and
bonding at least one semiconductor tile to the metallic substrate.
19. The method as claimed in claim 18, further comprising sequentially (i) cutting the at least one semiconductor tile to a predetermined shape, (ii) thinning the at least one semiconductor tile, and (iii) bonding the at least one semiconductor tile to the metallic substrate.
20. The method as claimed in claim 18, further comprising sequentially (i) thinning the at least one semiconductor tile, (ii) cutting the at least one semiconductor tile to a predetermined shape, and (iii) bonding the at least one semiconductor tile to the metallic substrate.
21. The method as claimed in claim 18, further comprising sequentially (i) cutting the at least one semiconductor tile to a predetermined shape, (ii) bonding the at least one semiconductor tile to the metallic substrate, and (iii) thinning the at least one semiconductor tile.
22. The method as claimed in claim 18, further comprising the steps of:
forming connections between semiconductor devices on a front-side surface of the at least one semiconductor tile and the metallic substrate by etching apertures in semiconductor material from a front-side of the at least one semiconductor tile; and
patterning a metal layer across the resulting front-side surface and aperture walls.
23. The method as claimed in claim 22, further comprising removing semiconductor material from the at least one semiconductor tile to form elongated trenches arranged to form perimeters around portions of the surface of the at least one semiconductor tile.
24. The method as claimed in claim 18, further comprising dicing the semiconductor wafer composite to form individual integrated circuits having metallic substrates.
25. The method as claimed in claim 18, further comprising forming the metallic substrate from a metallic base layer, and a bonding layer to which the at least one semiconductor tile is bonded.
26. The method as claimed in claim 18, further comprising substantially covering at least part of the metallic base layer andor the bonding layer with an inert coating layer.
27. The method as claimed in claim 18, further comprising forming the at least one semiconductor tile with a working layer predominantly of a compound semiconductor.
28. The method as claimed in claim 18, further comprising forming the at least one semiconductor tile with a complementary bonding layer suitable for adhering the at least one semiconductor tile to the metallic substrate.
29. The method as claimed in claim 28, further comprising forming the complementary bonding layer predominantly of one or more metals, one of which is a noble metal.
30. The method as claimed in claim 25, further comprising forming the bonding layer predominantly of two or more metals that form a eutectic alloy when heated.
31. The method as claimed in claim 28, further comprising forming the inert coating layer predominantly of a noble metal.
32. The method as claimed in claim 18, further comprising matching respective coefficients of thermal expansion of the at least one semiconductor tile and the metallic substrate to substantially similar values.
33. The method as claimed in claims 18, further comprising of cutting a semiconductor wafer to a substantially rectangular or square shape to form the at least one semiconductor tile.
34. A semiconductor wafer composite for fabricating a semiconductor device, the semiconductor wafer composite manufactured by a process comprising the steps of:
providing a metallic substrate; and
bonding at least one semiconductor tile to the metallic substrate.
35. The semiconductor wafer composite as claimed in claim 34, wherein the process further comprises sequentially (i) cutting the at least one semiconductor tile to a predetermined shape, (ii) thinning the at least one semiconductor tile, and (iii) bonding the at least one semiconductor tile to the metallic substrate.
36. The semiconductor wafer composite as claimed in claim 34, wherein the process further comprises sequentially (i) thinning the at least one semiconductor tile, (ii) cutting the at least one semiconductor tile to a predetermined shape, and (iii) bonding the at least one semiconductor tile to the metallic substrate.
37. The semiconductor wafer composite as claimed in claim 34, wherein the process further comprises sequentially (i) cutting the at least one semiconductor tile to a predetermined shape, (ii) bonding the at least one semiconductor tile to the metallic substrate, and (iii) thinning the at least one semiconductor tile.
38. The semiconductor wafer composite as claimed in claim 34, wherein the process further comprises:
forming connections between semiconductor devices on a front-side surface of the at least one semiconductor tile and the metallic substrate by etching apertures in semiconductor material from a front-side of the at least one semiconductor tile; and
patterning a metal layer across the resulting front-side surface and aperture walls.
39. The semiconductor wafer composite as claimed in claim 38, wherein the process further comprises removing semiconductor material from the at least one semiconductor tile to form elongated trenches arranged to form perimeters around portions of the surface of the at least one semiconductor tile.
40. The semiconductor wafer composite as claimed in claim 34, wherein the process further comprises dicing the semiconductor wafer composite to form individual integrated circuits having metallic substrates.
41. The semiconductor wafer composite as claimed in claim 34, wherein the process further comprises forming the metallic substrate from a metallic base layer, and a bonding layer to which the at least one semiconductor tile is bonded.
42. The semiconductor wafer composite as claimed in claim 34, wherein the process further comprises substantially covering at least part of the metallic base layer andor the bonding layer with an inert coating layer.
43. The semiconductor wafer composite as claimed in claim 34, wherein the process further comprises forming the at least one semiconductor tile with a working layer predominantly of a compound semiconductor.
44. The semiconductor wafer composite as claimed in claim 34, wherein the process further comprises forming the at least one semiconductor tile with a complementary bonding layer suitable for adhering the at least one semiconductor tile to the metallic substrate.
45. The semiconductor wafer composite as claimed in claim 44, wherein the process further comprises forming the complementary bonding layer predominantly of one or more metals, one of which is a noble metal.
46. The semiconductor wafer composite as claimed in claim 41, wherein the process further comprises forming the bonding layer predominantly of two or more metals that form a eutectic alloy when heated.
47. The semiconductor wafer composite as claimed in claim 42, wherein the process further comprises forming the inert coating layer predominantly of a noble metal.
48. The semiconductor wafer composite as claimed in claim 34, wherein the process further comprises matching respective coefficients of thermal expansion of the at least one semiconductor tile and the metallic substrate to substantially similar values.
49. The method as claimed in claim 34, wherein the process further comprises cutting a semiconductor wafer to a substantially rectangular or square shape to form the at least one semiconductor tile.
50. A semiconductor wafer composite suitable for fabricating a semiconductor device, the semiconductor wafer composite comprising:
a metallic substrate comprising (i) a base metallic layer, (ii) a metallic bonding layer predominantly formed of two or metals that form a euctectic alloy when heated, and (iii) an inert coating layer predominantly formed of a noble metal; and
multiple semiconductor tiles bonded to the metallic substrate by heating the semiconductor tiles and the metallic substrate when the semiconductor tiles and the metallic substrate are in physical contact, so that the semiconductor tiles bond to the metallic bonding layer via the inert coating layer.
51. A packaged compound semiconductor integrated circuit device comprising:
a compound semiconductor substrate comprising a backside surface;
a metal substrate bonded to the backside surface, the metal substrate providing mechanical support for the compound semiconductor substrate before being packaged; and
a support substrate coupled to the metal substrate for packaging.