1. A microelectronic package, comprising:
a first substrate having a first external contact at a first surface and a first wire bond contact at a second surface opposite the first surface;
a first microelectronic die proximate to the first substrate;
a second substrate having a second external contact and a second wire bond contact at a third surface facing away from the first substrate;
a second microelectronic die proximate to the second substrate;
wherein the first and second microelectronic dies each have an active side including a plurality of active terminals, and a back side, and wherein the back side of the first microelectronic die is attached to the back side of the second microelectronic die;
a first wire connecting the first surface of the first substrate to the first microelectronic die; and
a molding compound at least partially encapsulating the first and second substrates and the first and second dies without covering the first external contact or the second external contact.
2. The microelectronic package of claim 1, further comprising a second wire connecting the first wire bond contact and the second wire bond contact.
3. The microelectronic package of claim 1, further comprising a mold compound encapsulating the first and second wires.
4. The microelectronic package of claim 1 wherein the first substrate is larger than the second substrate.
5. The microelectronic package of claim 1 wherein the first microelectronic die comprises a board-on-chip package construction.
6. The microelectronic package of claim 1 wherein the second microelectronic die comprises a flip-chip package construction.
7. The microelectronic package of claim 1, further comprising:
a first solder ball attached to the first external contact; and
a second solder ball attached to the second external contact.
8. A microelectronic package, comprising:
a first substrate having a first external contact at a first surface and a first wire bond contact at a second surface opposite the first surface, wherein the first substrate has a through opening;
a first microelectronic die electrically connecting with the first substrate;
a second substrate having a second external contact and a second wire bond contact at a third surface facing away from the first substrate and a fourth surface opposite the third surface;
a second microelectronic die between the first and second substrates, the second microelectronic die being attached to the first microelectronic die and adjoining the fourth surface;
a wire connecting the first wire bond contact and the second wire bond contact;
wires extending from a plurality of contacts on the first die to the first surface of the first substrate via the through opening; and
a molding compound at least partially encapsulating the first and second substrates, the first and second microelectronic dies and the wire without covering the first external contact or the second external contact.
9. The microelectronic package of claim 8 with the second substrate having an exposed grid array of electrical contacts to allow for a stacking assembly of two or more package assemblies.
10. The microelectronic package of claim 8 with the first and second microelectronic dies each having an active side including a plurality of active terminals, and a back side, and with the back side of the first microelectronic die attached to the back side of the second microelectronic die.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A backlight module, comprising:
a light source;
a light guide plate comprising a light incidence surface, a light-emitting surface opposite to the light incidence surface, and a pair of side surfaces connected to the light incidence surface and the light-emitting surface respectively, the light-emitting surface comprising a groove;
a reflector placed between the light source and the light incidence surface of the light guide plate, located corresponding to the groove of the light-emitting surface of the light guide plate, and comprising a light-receiving surface located facing the light source, a concavity is defined in the reflector and concaved from the light-receiving surface toward the light guide plate, and the light source is received in the concavity.
2. The backlight module as claimed in claim 1, wherein the reflector further comprises a first bottom surface and a first side surface connecting the first bottom surface to the light-receiving surface thereof.
3. The backlight module as claimed in claim 2, wherein the first bottom surface of the reflector is arranged facing the light incidence surface of the light guide plate at a certain distance.
4. The backlight module as claimed in claim 2, wherein the first bottom surface of the reflector is combined with the light incidence surface of the light guide plate.
5. The backlight module as claimed in claim 2, wherein the first side surface of the reflector is spherical, cylindrical or conical.
6. The backlight module as claimed in claim 2, wherein the first bottom surface of the reflector is planar.
7. The backlight module as claimed in claim 1, wherein the light-receiving surface of the reflector comprises a second bottom surface and a second side surface, the second bottom surface is planar, and the second side surface is curved.
8. The backlight module as claimed in claim 7, wherein the second side surface is spherical, cylindrical or conical.
9. The backlight module as claimed in claim 1, wherein the light-receiving surface of the reflector is spherical.
10. The backlight module as claimed in claim 1, wherein a surface of the groove of the light-emitting surface has a reflective material arranged thereon.
11. The backlight module as claimed in claim 1, wherein the outlying region of the light incidence surface of the light guide plate has diffusion structures arranged thereon.
12. The backlight module as claimed in claim 1, further comprises a scattering plate arranged on the side of the light-emitting surface of the light guide plate, facing the light-emitting surface.
13. The backlight module as claimed in claim 12, further comprising a micro-prism system located between the scattering plate and the light-emitting surface of the light guide plate, and the micro-prism system is a light enhancing film or a reflective light enhancing film.
14. The backlight module as claimed in claim 1, wherein a surface of the groove of the light-emitting surface is hemispherical, conical, cylindrical, or frustum.
15. The backlight module as claimed in claim 1, wherein the groove of the light-emitting surface of the light guide plate has a peak pointing to and distant from the light incidence surface.
16. The backlight module as claimed in claim 1, wherein the light source is a light-emitting diode.
17. A backlight module, comprising:
a light source;
a light guide plate comprising a light incidence surface, a light-emitting surface opposite to the light incidence surface and a groove recessed in the light-emitting surface, the groove having a peak pointing to and distant from the light incidence surface;
a reflector placed between the light source and the light incidence surface of the light guide plate, located corresponding to the groove of the light guide plate, and comprising a light-receiving surface located facing the light source.
18. The backlight module as claimed in claim 17, wherein the light guide plate further comprises a plurality of dots distributed in the light incidence surface except an area covered by the reflector.
19. The backlight module as claimed in claim 17, wherein the reflector comprises a first surface optically coupled to the light incidence surface, a second surface opposite to the first surface and a concavity sunken from the second surface towards the first surface, and the light source located within the concavity of the reflector.
20. The backlight module as claimed in claim 17, wherein there is only one peak connecting the inner surface of the groove.