1. An electrical apparatus comprising:
a board which includes a first main surface and a second main surface and in which an electrical component is attached to the first main surface;
a heat dissipator; and
a fixing member which fixes the second main surface of the board and the heat dissipator together in such a manner as to be in contact with each other, by passing through the board from the first main surface to the second main surface to be inserted in the heat dissipator, wherein
in an opposing part facing the board, the opposing part being on a surface of the heat dissipator, a contact part which is brought into contact with a first region of the second main surface corresponding to the electrical component and a surrounding region of the electrical component and which is brought into contact with a second region of the second main surface corresponding to the fixing member and a surrounding region of the fixing member protrudes relative to a portion of the opposing part other than the contact part, and
the degree of flatness of a contact surface, in the contact part, that is brought into contact with the first region and the second region is higher than the degree of flatness of a surface of the opposing part other than the contact surface.
2. An electrical apparatus comprising:
a board which includes a first main surface and a second main surface and to which an electrical component is attached;
a heat dissipator, and
a fixing member which fixes the board and the heat dissipator together by passing through the board from the first main surface to the second main surface to be inserted in the heat dissipator, wherein
the electrical component projects from the second main surface of the board, and is in contact with the heat dissipator at a tip of a projecting portion of the electrical component or in contact with the heat dissipator via a first heat dissipation member provided between the electrical component and the heat dissipator, and
on the surface of the heat dissipator, the degree of flatness of a contact surface that is brought into contact with the electrical component or the first heat dissipation member is higher than the degree of flatness of a surface of an opposing part other than the contact surface, the opposing part facing the board.
3. The electrical apparatus according to claim 2, wherein
the fixing member reaches the heat dissipator by being inserted through a second heat dissipation member which is in close contact with the board and the heat dissipator between the board and the heat dissipator, and
on the surface of the heat dissipator, the degree of flatness of the contact surface that is brought into contact with the electrical component or the first heat dissipation member and the degree of flatness of a contact surface that is brought into contact with the second heat dissipation member are higher than the degree of flatness of a surface of the opposing part other than these contact surfaces.
4. The electrical apparatus according to claim 2, wherein
in the opposing part, a contact part which is brought into contact with a member region of the second main surface corresponding to the fixing member and a surrounding region of the fixing member protrudes relative to a portion of the opposing part other than the contact part, and
the degree of flatness of the contact surface, on the surface of the heat dissipator, that is brought into contact with the electrical component or the first heat dissipation member, and the degree of flatness of a contact surface, in the contact part, that is brought into contact with the member region are higher than the degree of flatness of a surface of the opposing part other than these contact surfaces.
5. An electrical apparatus comprising:
a board which includes a first main surface and a second main surface and in which an electrical component is attached to the first main surface;
a heat dissipator; and
a fixing member which fixes the second main surface of the board and the heat dissipator together in such a manner as to be in contact with each other, by passing through the board from the first main surface to the second main surface to be inserted in the heat dissipator, wherein
in an opposing part facing the board, the opposing part being on a surface of the heat dissipator, a contact part which is brought into contact with a component region of the second main surface corresponding to the electrical component and a surrounding region of the electrical component protrudes relative to a portion of the opposing part other than the contact part, and
the fixing member reaches the heat dissipator by being inserted through a heat dissipation member which is in close contact with the board and the heat dissipator between the board and the heat dissipator, and
the degree of flatness of a contact surface, in the contact part, that is brought into contact with the component region, and the degree of flatness of a contact surface, in the heat dissipator, that is brought into contact with the heat dissipation member are higher than the degree of flatness of a surface of the opposing part other than these contact surfaces.
6. The electrical apparatus according to any one of claims 1, wherein
the electrical component is attached to a vicinity of the fixing member.
7. The electrical apparatus according to claim 1, wherein
the electrical apparatus is a radio communication device which includes an amplifier for amplifying a radio signal, as the electrical component.
8. A method for producing an electrical apparatus, the method comprising:
a step of preparing a board which includes a first main surface and a second main surface and in which an electrical component is attached to the first main surface, and a fixing member to be passed through the board from the first main surface to the second main surface;
a step of casting a heat dissipator in which, in an opposing part facing the board, the opposing part being on a surface of the heat dissipator, a contact part which is brought into contact with a first region of the second main surface corresponding to the electrical component and a surrounding region of the electrical component and which is brought into contact with a second region of the second main surface corresponding to the fixing member and a surrounding region of the fixing member protrudes relative to a portion of the opposing part other than the contact part;
a step of working the heat dissipator such that the degree of flatness of a contact surface, in the contact part, that is brought into contact with the first region and the second region is higher than the degree of flatness of a surface of the opposing part other than the contact surface; and
a step of fixing the second main surface of the board and the heat dissipator together in such a manner as to be in contact with each other, by passing the fixing member through the board from the first main surface to the second main surface to be inserted in the heat dissipator.
9. A method for producing an electrical apparatus, the method comprising:
a step of preparing a board which includes a first main surface and a second main surface and to which an electrical component is attached, and a fixing member to be passed through the board from the first main surface to the second main surface;
a step of causing the electrical component to project from the second main surface of the board to be brought into contact with a heat dissipator at a tip of a projecting portion of the electrical component, or bringing the electrical component into contact with the heat dissipator via a heat dissipation member provided between the electrical component and the heat dissipator;
a step of fixing the second main surface of the board and the electrical component, and the heat dissipator together, by passing the fixing member through the board from the first main surface to the second main surface to be inserted in the heat dissipator; and
a step of working, before the step of bringing the electrical component into contact and the step of fixing the electrical component using the fixing member, the heat dissipator such that, in an opposing part facing the board, the opposing part being on a surface of the heat dissipator, the degree of flatness of a contact surface that is brought into contact with the electrical component or the heat dissipation member is higher than the degree of flatness of a surface of the opposing part other than the contact surface.
10. The electrical apparatus according to any one of claims 2, wherein the electrical component is attached to a vicinity of the fixing member.
11. The electrical apparatus according to any one of claims 5, wherein
the electrical component is attached to a vicinity of the fixing member.
12. The electrical apparatus according to claim 2, wherein
the electrical apparatus is a radio communication device which includes an amplifier for amplifying a radio signal, as the electrical component.
13. The electrical apparatus according to claim 5, wherein
the electrical apparatus is a radio communication device which includes an amplifier for amplifying a radio signal, as the electrical component.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor structure, comprising:
a conductive pad, said conductive pad including a plurality of laterally spaced apart gaps disposed at least partially through said conductive pad.
2. The structure of claim 1, wherein said gaps are disposed substantially fully through said conductive pad.
3. The structure of claim 1, wherein at least a lower portion of each of said gaps is filled with a dielectric material.
4. The structure of claim 2, wherein said dielectric material is an oxide.
5. The structure of claim 1, wherein an upper portion of each of said gaps is a cavity.
6. The structure of claim 1, wherein substantially all of each of said gaps is a cavity.
7. The structure of claim 2, wherein substantially all of each of said gaps is filled with said dielectric material.
8. The structure of claim 1, wherein said plurality of gaps are arranged in a first direction and in a second direction.
9. The structure of claim 1, wherein said first direction is substantially perpendicular to said second direction.
10. The structure of claim 1, wherein gaps have a rectangular lateral cross-section.
11. The structure of claim 1, wherein said conductive pad is part of a final metallization level of said semiconductor structure.
12. The structure of claim 8, wherein said gaps are staggered in said first direction and staggered in said second direction.
13. The structure of claim 1, further comprising an electronic device underlying an effective pad area of said conductive pad.
14. A semiconductor structure, comprising:
a final metallization level including a conductive line, said conductive line including a plurality of laterally spaced apart gaps diposed at least partially through said conductive line.
15. The structure of claim 14, wherein said gaps are disposed substantially fully through said conductive line.
16. The structure of claim 14, wherein at least a lower portion of each of said gaps is filled with a dielectric material.
17. The structure of claim 16, wherein said dielectric material is an oxide.
18. The structure of claim 14, wherein an upper portion of each of said gaps is a cavity.
19. The structure of claim 14, wherein substantially all of each of said gaps is a cavity.
20. The structure of claim 14, wherein substantially all of each of said gaps is filled with said dielectric material.
21. The structure of claim 14, wherein said plurality of gaps are arranged in a first direction and in a second direction.
22. The structure of claim 21, wherein said first direction is substantially perpendicular to said second direction.
23. The structure of claim 14, wherein gaps have a rectangular lateral cross-section.
24. The structure of claim 14, wherein at least a portion of said conductive line is a conductive pad.
25. The structure of claim 14, wherein said semiconductor structure includes an electronic device underlying an effective pad area of said conductive pad.
26. A method of making a semiconductor structure, comprising:
forming a dielectric layer;
patterning said dielectric layer so as to form a plurality of laterally spaced apart dielectric regions, said dielectric regions defining an opening therebetween;
forming a conductive layer within said opening; and
removing a least a portion of each of said dielectric regions to form a cavity in at least an upper portion of each of said dielectric regions.
27. The method of claim 26, wherein said removing removes only an upper portion of each of said dielectric regions.
28. The method of claim 26, wherein said conductive layer is part of a final metallization level.
29. The method of claim 26, wherein said patterning includes etching said dielectric layer.
30. The method of claim 26, wherein said forming said conductive layer includes an electrodeposition process.
31. The method of claim 26, wherein said forming said conductive layer is a dual-damascene process.
32. The method of claim 26, wherein said opening is part of a dual-tier opening.
33. The method of claim 26, wherein said conductive layer comprises Cu (copper).
34. The method of claim 33, wherein said Cu is in the form of pure copper andor copper alloy.