What is claimed is:
1. A fixing apparatus, comprising
a first rotating member;
first heating means for heating said first rotating member;
a second rotating member for forming a nip together with said first rotating member;
wherein a recording material bearing an unfixed image thereon is nipped and conveyed at said nip in such a manner that the unfixed image is in contact with said first rotating member, and the unfixed image is fixed by heating on the recording material,
voltage applying means for applying voltage to create potential difference between said first rotating member and said second rotating member; and
wherein said second rotating member has a conductive parting layer on a surface threreof,
second heating means for heating said second rotating member.
2. A fixing apparatus according to claim 1, wherein said voltage applying means applies a voltage to the surface of said second rotating member.
3. A fixing apparatus according to claim 1, wherein said conductive parting layer of said second rotating member is a fluororesin layer containing a conductive agent.
4. A fixing apparatus according to claim 1, wherein said conductive parting layer of said second rotating member has a surface resistance of 106 or less.
5. A fixing apparatus according to claim 1, wherein said second rotating member has an elastic layer inside said conductive parting layer.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A circuit structure, comprising:
a first circuit board, comprising:
a first ground plane layout, comprising at least one ground plane; and
a second ground plane layout, comprising at least one ground plane, wherein the first ground plane layout is not electrically connected to the second ground plane layout within the first circuit board.
2. The circuit structure of claim 1, wherein the first ground plane layout and the second ground plane layout have no direct contact within the first circuit board.
3. The circuit structure of claim 1, further comprising:
a first circuit component, mounted on the first circuit board and electrically connected to the first ground plane layout; and
a second circuit component, mounted on the first circuit board and electrically connected to the second ground plane layout.
4. The circuit structure of claim 3, wherein the first circuit component is an oscillator.
5. The circuit structure of claim 4, wherein the second circuit component is a signal processor of a global navigation satellite system (GNSS), and the oscillator is for providing an oscillating signal associated with operations of the signal processor.
6. The circuit structure of claim 3, wherein the first ground plane layout comprises a ground plane with a hollow region covered by the first circuit component in a thickness direction of the first circuit board.
7. The circuit structure of claim 3, wherein the first circuit board has at least one layer on which no ground plane overlapped with the first ground plane layout in a thickness direction of the first circuit board is disposed.
8. The circuit structure of claim 7, wherein the first circuit board has no ground plane overlapped with the first ground plane layout in the thickness direction of the first circuit board.
9. The circuit structure of claim 3, wherein within the first circuit board, the first ground plane layout is electrically connected to the first circuit component only.
10. The circuit structure of claim 1, further comprising:
a second circuit board, on which the first circuit board is mounted, the second circuit board comprising:
a third ground plane layout, electrically connected to the first ground plane layout, comprising at least one ground plane; and
a fourth ground plane layout, electrically connected to the second ground plane layout, comprising at least one ground layer, wherein the fourth ground plane layout is not electrically connected to the third ground plane layout within the second circuit board.
11. The circuit structure of claim 10, wherein the first ground plane layout is not overlapped with the fourth ground plane layout in a thickness direction of the first circuit board, and the second ground plane layout is not overlapped with third ground plane layout in the thickness direction of the first circuit board.
12. The circuit structure of claim 10, further comprising:
a first circuit component, mounted on the first circuit board and electrically connected to the first ground plane layout; and
a second circuit component, mounted on the first circuit board and electrically connected to the second ground plane layout.
13. The circuit structure of claim 12, wherein the first circuit component is an oscillator.
14. The circuit structure of claim 13, wherein the second circuit component is a signal processor of a global navigation satellite system (GNSS), and the oscillator is for providing an oscillating signal associated with operations of the signal processor.
15. The circuit structure of claim 10, further comprising:
at least one passive component, mounted on the second circuit board, for electrically connecting the third ground plane layout and the fourth ground plane layout.
16. The circuit structure of claim 15, wherein the third ground plane layout is electrically connected to the fourth ground plane layout through passive component(s) mounted on the second circuit board only.
17. The circuit structure of claim 15, wherein the passive component is a resistor or a low AC impedance inductor.
18. A circuit structure, comprising:
a circuit board, comprising:
a first ground plane layout, comprising at least one ground layer; and
a second ground plane layout, comprising at least one ground layer, wherein the first ground plane layout is not electrically connected to the second ground plane within the circuit board; and
at least a passive component, mounted on the circuit board, for electrically connecting the first ground plane layout to the second ground plane layout.
19. The circuit structure of claim 18, wherein the first ground plane layout is electrically connected to the second ground plane layout through passive component(s) mounted on the circuit board only
20. The circuit structure of claim 18, wherein the passive component is a resistor or a low AC impedance inductor.
21. The circuit structure of claim 18, further comprising:
a first circuit component, mounted on the circuit board and electrically connected to the first ground plane layout; and
a second circuit component, mounted on the circuit board and electrically connected to the second ground plane layout.
22. The circuit structure of claim 21, wherein the first circuit component is an oscillator.
23. The circuit structure of claim 22, wherein the second circuit component is a signal processor of a global navigation satellite system (GNSS), and the oscillator is for providing an oscillating signal associated with operations of the signal processor.
24. The circuit structure of claim 23, wherein the signal processor and the oscillator are mounted at different sides of the circuit board.
25. The circuit structure of claim 21, wherein the first ground plane layout has an inner hollow region covered by the first circuit component in a thickness direction of the circuit board.
26. The circuit structure of claim 21, wherein the circuit board has at least one layer on which no ground plane overlapped with the first ground plane layout in a thickness direction of the circuit board is disposed.
27. The circuit structure of claim 26, wherein the circuit board has no ground plane overlapped with the first ground plane layout in the thickness direction of the circuit board is disposed.