1. A filter circuit for an active implantable medical device, comprising:
an active implantable medical device (AIMD) comprising an electrically or thermally conductive housing and a hermetic feedthrough terminal;
an AIMD electronic circuit disposed within the conductive housing;
a conductor electrically coupling through the hermetic feedthrough terminal in nonconductive relation to the conductive housing and electrically coupled to the AIMD electronic circuit, the conductor defined as comprising a first node and a second node disposed in series along the conductor, the first node disposed closer to the hermetic feedthrough terminal and the second node disposed closer to the AIMD electronic circuit, the conductor further defined as comprising a first length between the hermetic feedthrough terminal and the first node, a second length between the first node and second node, a third length between the second node and the AIMD electronic circuit;
a first frequency selective energy diversion circuit for diverting high-frequency MRI energy away from the conductor to the conductive housing for dissipation of high-frequency MRI energy, the first diversion circuit electrically connected between the first node and the conductive housing;
an impeding circuit for raising the high-frequency impedance of the conductor, the impeding circuit electrically connected in series along the second length of the conductor disposed between the first and second nodes; and
a second frequency selective energy diversion circuit electrically connected between the second node and the conductive housing.
2. The filter circuit of claim 1, wherein the first diversion circuit comprises a capacitor.
3. The filter circuit of claim 2, wherein the impeding circuit comprises a bandstop filter.
4. The filter circuit of claim 3, wherein the second diversion circuit comprises an LC trap filter.
5. The filter circuit of claim 4, wherein the first diversion circuit, impeder circuit and second diversion circuit are disposed within the conductive housing protecting the circuits from direct contact with patient body fluid.
6. The filter circuit of claim 4, wherein a capacitance and an inductance of the bandstop filter are selected to be resonant at or near an MRI RF pulsed frequency or an MRI RF range of pulsed frequencies.
7. The filter circuit of claim 4, wherein a capacitance and an inductance of the LC trap filter are selected to be resonant at or near an MRI RF pulsed frequency or an MRI RF range of pulsed frequencies.
8. A filter circuit for an active implantable medical device, comprising:
an active implantable medical device (AIMD) comprising an electrically or thermally conductive housing and a hermetic feedthrough terminal;
an AIMD electronic circuit disposed within the conductive housing;
a conductor electrically coupling through the hermetic feedthrough terminal in nonconductive relation to the conductive housing and electrically coupled to the AIMD electronic circuit, the conductor defined as comprising a first node and a second node disposed in series along the conductor, the first node disposed closer to the hermetic feedthrough terminal and the second node disposed closer to the AIMD electronic circuit, the conductor further defined as comprising a first length between the hermetic feedthrough terminal and the first node, a second length between the first node and second node, a third length between the second node and the AIMD electronic circuit;
a capacitor for diverting high-frequency MRI energy away from the conductor to the conductive housing for dissipation of high-frequency MRI energy, the capacitor electrically connected between the first node and the conductive housing;
a bandstop filter for raising the high-frequency impedance of the conductor, the bandstop filter electrically connected in series along the second length of the conductor disposed between the first and second nodes; and
an LC trap filter electrically connected between the second node and the conductive housing.
9. The filter circuit of claim 8, wherein the capacitor, bandstop filter and LC trap filter are disposed within the conductive housing protected from direct contact with patient body fluid.
10. The filter circuit of claim 8, wherein a capacitance and an inductance of the bandstop filter are selected to be resonant at or near an MRI RF pulsed frequency or an MRI RF range of pulsed frequencies.
11. The filter circuit of claim 8, wherein a capacitance and an inductance of the LC trap filter are selected to be resonant at or near an MRI RF pulsed frequency or an MRI RF range of pulsed frequencies.
12. An energy dissipating filter for an implantable medical device, comprising:
an implantable medical device (IMD) comprising an electrically or thermally conductive energy dissipating surface and a hermetic feedthrough terminal;
an IMD electronic circuit disposed within the energy dissipating surface;
a conductor electrically coupling through the hermetic feedthrough terminal in nonconductive relation to the energy dissipating surface and electrically coupled to the IMD electronic circuit, the conductor defined as comprising a first node and a second node disposed in series along the conductor, the first node disposed closer to the hermetic feedthrough terminal and the second node disposed closer to the IMD electronic circuit, the conductor further defined as comprising a first length between the hermetic feedthrough terminal and the first node, a second length between the first node and second node, a third length between the second node and the IMD electronic circuit;
a capacitor for diverting high-frequency MRI energy away from the conductor to the energy dissipating surface for dissipation of high-frequency MRI energy, the capacitor electrically connected between the first node and the energy dissipating surface;
a bandstop filter for raising the high-frequency impedance of the conductor, the bandstop filter electrically connected in series along the second length of the conductor disposed between the first and second nodes; and
an LC trap filter electrically connected between the second node and the energy dissipating surface.
13. The energy dissipating filter of claim 12, wherein the capacitor, bandstop filter and LC trap filter are disposed within the energy dissipating surface protected from direct contact with patient body fluid.
14. The energy dissipating filter of claim 12, wherein a capacitance and an inductance of the bandstop filter are selected to be resonant at or near an MRI RF pulsed frequency or an MRI RF range of pulsed frequencies.
15. The energy dissipating filter of claim 12, wherein a capacitance and an inductance of the LC trap filter are selected to be resonant at or near an MRI RF pulsed frequency or an MRI RF range of pulsed frequencies.
16. A filter circuit for an active implantable medical device, comprising:
an active implantable medical device (AIMD) comprising an electrically or thermally conductive housing and a hermetic feedthrough terminal;
an AIMD electronic circuit disposed within the conductive housing;
a conductor electrically coupling through the hermetic feedthrough terminal in nonconductive relation to the conductive housing and electrically coupled to the AIMD electronic circuit;
a first frequency selective energy diversion circuit for diverting high-frequency MRI energy away from the conductor to the conductive housing for dissipation of high-frequency MRI energy, the first diversion circuit electrically connected between the conductor and the conductive housing;
an impeding circuit for raising the high-frequency impedance of the conductor, the impeding circuit electrically connected in series along the conductor disposed between the first energy diversion circuit and the AIMD electronic circuit; and
a second frequency selective energy diversion circuit electrically connected between the conductor and the conductive housing, wherein the second diversion circuit is disposed between the impeding circuit and the AIMD electronic circuit.
17. The filter circuit of claim 16, wherein the first diversion circuit comprises a capacitor.
18. The filter circuit of claim 17, wherein the impeding circuit comprises a bandstop filter.
19. The filter circuit of claim 18, wherein the second diversion circuit comprises an LC trap filter.
20. The filter circuit of claim 19, wherein the first diversion circuit, impeder circuit and second diversion circuit are disposed within the conductive housing protecting the circuits from direct contact with patient body fluid.
21. The filter circuit of claim 20, wherein a capacitance and an inductance of the bandstop filter are selected to be resonant at or near an MRI RF pulsed frequency or an MRI RF range of pulsed frequencies.
22. The filter circuit of claim 21, wherein a capacitance and an inductance of the LC trap filter are selected to be resonant at or near a second MRI RF pulsed frequency or a second MRI RF range of pulsed frequencies.
23. An energy dissipating filter for an implantable medical device, comprising:
an implantable lead defined as comprising a length between a proximal end and a distal end;
at least one conductor disposed along the length of the lead;
at least one electrode disposed at the distal end of the lead and electrically coupled to the at least one conductor;
an energy dissipating surface disposed along a portion of the lead;
a capacitor for diverting a high-frequency MRI energy away from the lead to the energy dissipating surface for dissipation of high-frequency MRI energy, the capacitor electrically connected between the at least one electrode and the energy dissipating surface;
a bandstop filter for raising the high-frequency impedance of the lead or at least one conductor, the bandstop filter electrically connected in series along the at least one conductor disposed between the capacitor and proximal end; and
an LC trap filter electrically connected between the at least one conductor and the energy dissipating surface, wherein the LC trap filter is disposed between the bandstop filter and the proximal end.
24. The energy dissipating filter of claim 23, wherein a capacitance and an inductance of the bandstop filter are selected to be resonant at or near an MRI RF pulsed frequency or an MRI RF range of pulsed frequencies.
25. The energy dissipating filter of claim 23, wherein a capacitance and an inductance of the LC trap filter are selected to be resonant at or near an MRI RF pulsed frequency or an MRI RF range of pulsed frequencies.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A multi-surfaced foil laminate having printed indicia visible on both sides through a clear plastic over-laminating film, said indicia printed in at least one color on the outer visible surfaces of said laminate, said printed indicia by lithography offset 133 to 300 line screen halftone printing wherein spray powder coated on the printed surfaces helps dry the printing inks, provides space for drying, wherein said multi surfaced foil laminate comprises two printed surfaces exteriorly visible through an exterior transparent plastic film, one printed surface comprising a printed plastic film sheet substrate and a second printed surface comprising metal foil adhering to a plastic film sheet substrate, said metal foil printed on the non-adherent side and serving an outside printed surface, said surfaces providing identifying indicia through said exterior transparent plastic film, said plastic film sheet substrate and said exterior transparent plastic film comprising PVC, said metal foil selected from the group consisting of aluminum, gold, silver and bronze, said multi-surfaced foil laminate severed into predetermined segments.
2. The multi-surfaced foil laminate of claim 1 wherein said two printed surfaces comprise two layers of said laminate, a first layer comprising a printed plastic film sheet film providing identifying indicia through an exterior transparent plastic film, said printed plastic film sheet substrate comprising PVC, a second layer comprising a printed metal foil adhering to a plastic film sheet substrate providing identifying indicia through said transparent plastic film.
3. The multi-surfaced foil laminate of claim 1 wherein said two printed surfaces individually comprise two layers of said laminate, said two layers individually comprising a printed metal foil adhering to a plastic film substrate providing identifying indicia through said transparent plastic film.
4. The multi-surfaced foil laminate of claim 1 wherein said two printed surfaces comprise a laminate comprising a printed metal foil adhering to a first side of a plastic film substrate, said plastic film substrate printed with identifying indicia on a second side of said plastic film substrate, providing said identifying indicia through said transparent plastic film.
5. The multi-surfaced foil laminate of claim 1 wherein said metal foil is aluminum.
6. The multi-surfaced foil laminate of claim 1 wherein said identifying indicia further comprises identifying information means located on said laminate.
7. The multi-surfaced foil laminate as claimed in claim 5 wherein said identifying information means is a magnetic tape which is attached to said laminate on a surface providing identifying indicia through an exterior transparent plastic film.
8. The multi-surfaced foil laminate of claim 1 wherein said multi-surfaced foil laminate is severed into predetermined segments to serve as credit cards, gift cards, and identification cards, each segment having printing located on each outer side.
9. The multi-surfaced foil laminate of claim 1 wherein said metal foil is of an overall thickness of about 0.05 to 1.50 mm.
10. The multi-surfaced foil laminate of claim 1 wherein said plastic film sheets substrates are of a thickness within the range of from 8 to 28 mil.
11. The multi-surfaced foil laminate of claim 1 wherein said exterior transparent plastic film is clear PVC film of a thickness within the range of from 1.5 to 2.5 mil.
12. The multi-surfaced foil laminate of claim 1 wherein said printed indicia is by lithography offset 175 line screen halftone printing.
13. The multi-surfaced foil laminate of claim 1 wherein laminating step has a dwell time of from 6 to 8 minutes under pressure of 800 to 1500 p.s.i.
14. A multi-layered foil laminate comprising a foil laminate having two printed surfaces visible on both sides through a clear plastic over laminating film, said printed surfaces in at least one color on the outer visible surfaces of said laminate, said printed surfaces comprising a first plastic surface comprising a plastic film material, said printed surfaces comprising a metal foil as a second surface, said printed surfaces by lithography offset halftone printing, said clear plastic over-laminating film and said plastic film material comprising PVC and said metal foil comprising aluminum, said multi-layered foil laminate severed into predetermined segments, said metal foil adhered to said first plastic film by an adhesive.