1. A mold comprising:
a lower mold including a first runner arranged on an upper surface thereof, the first runner having a predetermined depth and extending linearly a predetermined length, the first runner arranged to have a resin injected therein and to pass therethrough;
at least one first gate having a predetermined depth and connected to the first runner, the at least one first gate arranged to guide the resin along a direction, the first gate having a first cavity formed on a side of the first runner and having a predetermined depth, the cavity arranged to accommodate a can and a protective circuit board therein, the can and the protective circuit board arranged to have a predetermined gap defined therebetween while being electrically connected to each other; and
an upper mold having a second runner, a second gate, and a second cavity arranged on a lower surface thereof, the second runner having the same shape and arranged at a location corresponding to that of the first runner, the second gate having the same shape and arranged at a location corresponding to that of the first gate, and the second cavity having the same shape and arranged at a location corresponding to that of the first cavity.
2. The mold as recited in claim 1, wherein the first and second cavities are each of a rectangular shape having short and long sides, and wherein the first and second gates are arranged to be in communication with the gap with an angle of between 10\xb0 to 80\xb0 at a location of the long side of their respective cavity corresponding to the gap.
3. The mold as recited in claim 2, wherein the first and second runners are arranged parallel to the long side of their respective cavity.
4. The mold as recited in claim 1, wherein the first and second gates have slant surfaces arranged such that the closer to the gap between the can and the protective circuit board, the smaller the cross-sectional area through which the resin passes after passing through the first and second gates becomes.
5. A method comprising:
arranging a can to have a positive terminal on a front surface thereof, a negative terminal next to a side of the positive terminal, and a safety vent next to a side of the negative terminal;
electrically connecting the positive and negative terminals of the can to a protective circuit board;
arranging a mold to have a cavity of a predetermined depth, to have a gate next to a side of the cavity and to have a runner to be in communication with the gate to guide the flow of resin;
seating the can and the protective circuit board on the cavity of the mold to position the gate of the mold at a lateral portion of the gap between the can and the protective circuit board; and
injecting a resin into the runner such that the resin passes through the gate and is injected into the gap between the can and the protective circuit board seated inside the cavity.
6. The method as recited in claim 5, further comprising positioning the safety vent of the can between the negative terminal and the gate.
7. The method as recited in claim 5, further comprising arranging a distance between the safety vent of the can and the gate to be smaller than a distance between the negative terminal and the gate.
8. The method as recited in claim 5, further comprising positioning the safety vent of the can adjacent to the gate.
9. The method as recited in claim 5, further comprising injecting the resin to pass through the safety vent of the can, the negative and positive terminals successively, the resin adhering to the safety vent of the can, the negative and positive terminals and filling the gap.
10. The method as recited in claim 5, wherein a resin injection trace remains on a portion of the resin adjacent to the gate after injecting the resin.
11. The method as recited in claim 5, wherein a resin injection trace remains on the lateral portion of the resin adjacent to the safety vent after injecting the resin.
12. The method as recited in claim 5, further comprising interposing an insulating sheet between the safety vent of the can and the protective circuit board.
13. A mold comprising:
a lower mold including a first runner arranged on an upper surface thereof, the first runner having a predetermined depth and extending linearly a predetermined length, the first runner arranged to have a molding substance injected therein and to pass therethrough;
at least one first gate having a predetermined depth and connected to the first runner, the at least one first gate arranged to guide the molding substance along a direction, the first gate having a first cavity formed on a side of the first runner and having a predetermined depth, the cavity arranged to accommodate a can and a board therein, the can and the board arranged to have a predetermined gap defined therebetween while being electrically connected to each other; and
an upper mold having a second runner, a second gate, and a second cavity arranged on a lower surface thereof, the second runner having the same shape and arranged at a location corresponding to that of the first runner, the second gate having the same shape and arranged at a location corresponding to that of the first gate, and the second cavity having the same shape and arranged at a location corresponding to that of the first cavity.
14. The mold as recited in claim 13, wherein the first and second cavities are each of a rectangular shape having short and long sides, and wherein the first and second gates are arranged to be in communication with the gap with an angle of between 10\xb0 to 80\xb0 at a location of the long side of their respective cavity corresponding to the gap.
15. The mold as recited in claim 14, wherein the first and second runners are arranged parallel to the long side of their respective cavity.
16. The mold as recited in claim 13, wherein the first and second gates have slant surfaces arranged such that the closer to the gap between the can and the protective circuit board, the smaller the cross-sectional area through which the molding substance passes after passing through the first and second gates becomes.
17. A method comprising:
arranging a can to have a first terminal on a front surface thereof, a second terminal next to a side of the first terminal, and a safety vent next to a side of the second terminal;
electrically connecting the first and second terminals of the can to a board;
arranging a mold to have a cavity of a predetermined depth, the cavity being arranged to integrally seat the can and the board thereon;
arranging a gate next to a side of the cavity to guide a flow of a molding substance through a gap between the can and the board and arranging a runner to be in communication with the gate to guide the flow of a molding substance;
seating the can and the board on the cavity of the mold to position the gate of the mold at a lateral portion of the gap between the can and the board; and
injecting a molding substance into the runner such that the molding substance passes through the gate and is injected into the gap between the can and the board seated inside the cavity.
18. The method as recited in claim 17, wherein a molding substance injection trace remains on a portion of the molding substance adjacent to the gate after injecting the molding substance.
19. The method as recited in claim 17, wherein a molding substance injection trace remains on the lateral portion of the molding substance adjacent to the safety vent after injecting the molding substance.
20. The method as recited in claim 17, further comprising interposing an insulating paper between the safety vent of the can and the board.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A field emission device, comprising:
a glass substrate;
an insulating layer arranged on the glass substrate and having a concave portion;
a cathode electrode arranged on the insulating layer, the cathode electrode having a concave portion;
a plurality of electron emitters arranged on the concave portion of the cathode electrode;
a gate insulating layer arranged on the cathode electrode and having a cavity communicating with the concave portion of the cathode electrode; and
a gate electrode arranged on the gate insulating layer and having a gate aperture aligned with the cavity.
2. The field emission device of claim 1, the cavity being of a hemispherical shape.
3. The field emission device of claim 1, further comprising an amorphous silicon layer arranged between the cathode electrode and the gate insulating layer, the amorphous silicon layer being perforated by a aperture that is aligned with the concave portion of the cathode electrode.
4. The field emission device of claim 1, the plurality of electron emitters comprises carbon nanotube (CNT) emitters.
5. A field emission device, comprising:
a glass substrate;
an insulating layer arranged on the glass substrate and having a concave portion;
a cathode electrode arranged on the insulating layer, the cathode electrode having a concave portion;
a plurality of electron emitters arranged on the concave portion of the cathode electrode;
a lower gate insulating layer arranged on the cathode electrode and having a cavity communicating with the concave portion of the cathode electrode;
a lower gate electrode arranged on the lower gate insulating layer and having a lower gate aperture aligned with the cavity;
a focusing gate insulating layer arranged on the lower gate electrode and having an aperture communicating with the cavity; and
a focusing gate electrode arranged on the focusing gate insulating layer and having a focusing gate aperture aligned with the cavity.
6. The field emission device of claim 5, the cavity having a shape of a hemisphere.
7. The field emission device of claim 5, further comprising an amorphous silicon layer arranged between the cathode electrode and the lower gate insulating layer and having an aperture aligned with the concave portion of the cathode electrode.
8. The field emission device of claim 5, the plurality of electron emitters comprises carbon nanotube (CNT) emitters.
9. A field emission display (FED), comprising:
a rear substrate;
an insulating layer arranged on the rear substrate and having a concave portion;
a cathode electrode arranged on the insulating layer, the cathode electrode having a concave portion;
a plurality of electron emitters arranged on the concave portion of the cathode electrode;
a gate insulating layer arranged on the cathode electrode and having a cavity communicating with the concave portion of the cathode electrode;
a gate electrode arranged on the gate insulating layer and having a gate aperture aligned with the cavity;
a front substrate spaced apart from the substrate by predetermined distance;
an anode electrode arranged on a side of the front substrate facing a plurality of electron emitters; and
a fluorescent layer arranged on the anode electrode.
10. The FED of claim 9, the cavity having a shape of a hemisphere.
11. The FED of claim 9, further comprising an amorphous silicon layer arranged between the cathode electrode and the gate insulating layer, the amorphous silicon layer having an aperture corresponding to the concave portion of the cathode electrode.
12. The FED of claim 9, the plurality of electron emitters comprises carbon nanotube (CNT) emitters.
13. A field emission display (FED), comprising:
a rear substrate;
an insulating layer arranged on the rear substrate and having a concave portion;
a cathode electrode arranged on the insulating layer, the cathode electrode having a concave portion;
a plurality of electron emitters arranged on the concave portion of the cathode electrode;
a lower gate insulating layer arranged on the cathode electrode and having a cavity communicating with the concave portion of the cathode electrode;
a lower gate electrode arranged on the lower gate insulating layer and having a lower gate aperture aligned with the cavity;
a focusing gate insulating layer arranged on the lower gate electrode and having an aperture communicating with the cavity;
a focusing gate electrode arranged on the focusing gate insulating layer and having a focusing gate aperture aligned with the cavity;
a front substrate spaced apart from the rear substrate by predetermined distance;
an anode electrode arranged on a side of the front substrate facing the plurality of electron emitters; and
a fluorescent layer arranged on the anode electrode and facing the plurality of electron emitters.
14. The FED of claim 13, the cavity having a shape of a hemisphere.
15. The FED of claim 13, further comprising an amorphous silicon layer arranged between the cathode electrode and the lower gate insulating layer, the amorphous silicon layer having an aperture corresponding to the concave portion of the cathode electrode.
16. The FED of claim 13, the plurality of electron emitters comprises carbon nanotube (CNT) emitters.