1. A method for manufacturing a composite separator for a polymer electrolyte membrane fuel cell, the method comprising:
preparing a prepreg as a continuous carbon fiber-reinforced composite and a graphite foil prepared by compressing expanded graphite, the prepreg being a semi-cured sheet-like prepreg, the continuous carbon fiber-reinforced composite including continuous carbon fibers each of which is surrounded by a thermosetting polymer binder, the continuous carbon fibers having a length of several meters to several tens of meters;
allowing the prepreg and the graphite foil to pass through a cutting roller with a cutter to be cut in the longitudinal direction of the composite separator;
allowing the cut prepreg and graphite foil to pass through a stackingcompression roller to be compressed;
allowing the prepreg in which the graphite foil is integrally stacked to be heated and pressed by a hot press such that hydrogen, air, and coolant flow fields are formed on the prepreg on both surfaces of which the graphite foil is stacked and at the same time on the graphite foil, or to pass through a hot roller to be formed into a separator;
removing unnecessary portions from the heated and pressed separator using a trim cutter; and
post-curing the thus formed separator,
wherein the graphite foil is stacked on the prepreg as the continuous carbon fiber-reinforced composite such that a graphite layer is integrally formed with the prepreg.
2. A separator for a fuel cell prepared by the method of claim 1, wherein the graphite layer is integrally formed on the outer surface of the prepreg.
3. The separator of claim 2, wherein at least a portion of surplus resin of the prepreg is impregnated into the graphite layer formed by the graphite foil stacked on the outermost end of the prepreg to be mechanically bonded thereto.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor device comprising:
a housing formed of a first synthetic resin that is a thermoplastic resin; and
a semiconductor package formed of a second synthetic resin that is a thermosetting resin, wherein the package is sealed in the housing, wherein the package has a modified face that has adhesive properties to the first synthetic resin, wherein the modified face is formed on a surface of the package by UV-irradiating the surface before the sealing of the package in the housing.
2. A semiconductor device according to claim 1, wherein the package is sealed in the housing by insert molding.
3. A semiconductor device according to claim 1, wherein the first synthetic resin comprises polyamide or a thermoplastic resin including polyamide.
4. A semiconductor device according to claim 3, wherein the second synthetic resin comprises a thermosetting epoxy resin.
5. A semiconductor device according to claim 3, wherein the thermoplastic resin is a polymer alloy of polyamide and polyphenylene sulfide.
6. A semiconductor device according to claim 3, wherein the thermoplastic resin is a polymer alloy of polyamide and polybutylene telephthalate.
7. A semiconductor device comprising:
a housing formed of polyamide or a thermoplastic resin including polyamide; and
a semiconductor package formed of a thermosetting epoxy resin, wherein the package is sealed in the housing, wherein the semiconductor package has a modified face that has adhesive properties to the polyamide or the thermoplastic resin including polyamide, wherein the modified face is formed on a surface of the package by UV-irradiating the surface before the sealing of the package in the housing.
8. A semiconductor device according to claim 7, wherein the thermoplastic resin is a polymer alloy of polyamide and polyphenylene sulfide.
9. A semiconductor device according to claim 7, wherein the thermoplastic resin is a polymer alloy of polyamide and polybutylene telephthalate.
10. A method of making a semiconductor device comprising:
UV-irradiating a semiconductor package formed of thermosetting epoxy resin to modify its surface to be adhesive to polyamide;
placing the package in a die; and
filling a space in the die with melted polyamide or a melted thermoplastic resin including polyamide to seal the package by insert molding.
11. A method according to claim 10, wherein the thermoplastic resin is a polymer alloy of polyamide and polyphenylene sulfide.
12. A method according to claim 10, wherein the thermoplastic resin is a polymer alloy of polyamide and polybutylene telephthalate.