1. A method for fabricating a sublithographic contact structure in a memory cell in a semiconductor component comprising:
forming a trench structure having first spacers on walls of the trench structure, a first sublithographic dimension (SL) being formed in a region between the first spacers situated on mutually opposite walls in at least one direction (x) parallel to a wafer surface;
etching the insulator layer in a region between the first spacers situated on mutually opposite walls for forming a first passage hole, the first spacers being used as an etching mask;
depositing a layer made of an electrically conductive material at least over the first passage hole and partially etching back the layer made of the electrically conductive material in the first passage hole forming a first contact electrode; and
depositing a layer made of a resistance change material over the first passage hole and partially etching back the resistance change material in the first passage hole forming a resistance change material zone.
2. The method of claim 1, comprising:
depositing a layer made of an electrically conductive material on the resistance change material zone for forming a second contact electrode.
3. The method of claim 1, wherein forming the trench structure comprises:
depositing an etching stop layer on a first insulator layer;
patterning the etching stop forming an etching mask; and
partially etching the first insulator layer with the aid of the etching mask for forming a trench structure.
4. The method as claimed in claim 1, wherein forming the trench structure comprises:
depositing an etching stop layer on a first insulator layer;
patterning the etching stop layer for forming an etching mask;
etching the first insulator layer as far as a connecting contact with the aid of the etching mask for forming a first passage hole; and
depositing a second insulator layer made of a second dielectric material, which is different from the first dielectric material of the first insulator layer, and partially etching back the second insulator layer in the first passage hole for the purpose of forming the trench structure.
5. The method as claimed in claim 4, the thermal conductivity of the second dielectric material being lower than the thermal conductivity of the first dielectric material.
6. A method for fabricating a sublithographic contact structure in a memory cell in a semiconductor component comprising:
providing a front-end-of-line (FEOL) finished processed semiconductor wafer with at least one electrical connecting contact connected to an active structure on one of its two opposite surfaces;
depositing a first insulator layer made of a first dielectric material on the semiconductor wafer at least over the electrical connecting contact;
forming a trench structure with a bottom and walls essentially perpendicular to the wafer surface in the first insulator layer at least partly over the electrical connecting contact;
depositing a first layer made of a dielectric spacer material at least over the trench structure and anisotropically etching back the spacer material layer in a direction essentially perpendicular to the wafer surface as far as the bottom of the trench structure in such a way that first spacers remain on the walls of the trench structure, a first sublithographic dimension (SL) being formed in the region between the first spacers situated on mutually opposite walls in at least one direction (x) parallel to the wafer surface;
etching the insulator layer in the region between the first spacers situated on mutually opposite walls as far as the connecting contact for the purpose of forming a first passage hole, the first spacers being used as an etching mask;
depositing a layer made of an electrically conductive material at least over the first passage hole and partially etching back the layer made of the electrically conductive material in the first passage hole for the purpose of forming a first contact electrode;
depositing a layer made of a resistance change material over the first passage hole and partially etching back the resistance change material in the first passage hole for the purpose of forming a resistance change material zone; and
depositing a layer made of an electrically conductive material on the resistance change material zone for the purpose of forming a second contact electrode.
7. The method as claimed in claim 6, wherein forming the trench structure comprises:
depositing an etching stop layer on the first insulator layer;
patterning the etching stop layer for the purpose of forming an etching mask;
partially etching the first insulator layer with the aid of the etching mask for the purpose of forming a trench structure.
8. The method as claimed in claim 6, wherein forming the trench structure comprises:
depositing an etching stop layer on the first insulator layer;
patterning the etching stop layer for the purpose of forming an etching mask;
etching the first insulator layer as far as the connecting contact with the aid of the etching mask for the purpose of forming a first passage hole; and
depositing a second insulator layer made of a second dielectric material, which is different from the first dielectric material of the first insulator layer, and partially etching back the second insulator layer in the first passage hole for the purpose of forming a trench structure.
9. The method as claimed in claim 8, wherein the thermal conductivity of the second dielectric material being lower than the thermal conductivity of the first dielectric material.
10. A method for fabricating a sublithographic contact structure in a memory cell in a semiconductor component, comprising:
providing a front-end-of-line (FEOL) finished processed semiconductor wafer with at least one electrical connecting contact connected to an active structure on one of its two opposite surfaces;
depositing a first insulator layer made of a first dielectric material on the semiconductor wafer at least over the electrical connecting contact;
forming a trench structure with a bottom and walls essentially perpendicular to the wafer surface in the first insulator layer at least partly over the electrical connecting contact;
depositing a first layer made of a dielectric spacer material at least over the trench structure and anisotropically etching back the spacer material layer in a direction essentially perpendicular to the wafer surface as far as the bottom of the trench structure in such a way that first spacers remain on the walls of the trench structure, a first sublithographic dimension (SL) being formed in the region between the first spacers situated on mutually opposite walls in at least one direction (x) parallel to the wafer surface;
etching the insulator layer in the region between the first spacers situated on mutually opposite walls as far as the connecting contact for the purpose of forming a first passage hole, the first spacers being used as an etching mask;
depositing a layer made of an electrically conductive material at least over the first passage hole and partially etching back the layer made of the electrically conductive material in the first passage hole for the purpose of forming a first contact electrode;
depositing a layer made of a resistance change material over the first passage hole and partially etching back the resistance change material in the first passage hole for the purpose of forming a resistance change material zone;
depositing a layer made of an electrically conductive material on the resistance change material for the purpose of forming a second contact electrode, partially etching back the second contact electrode in the region between the first spacers;
partially isotropically etching back the first spacers on the walls of the trench structure in a direction (x) essentially parallel to the wafer surface for the purpose of increasing the distance between the first spacers situated on opposite walls;
selectively isotropically etching the second dielectric material in a direction (y) essentially perpendicular to the wafer surface;
conformally depositing a third insulator layer made of a third dielectric material at least in the region of the trench structure; and
forming an electrically conductive connection to the second contact electrode in the third insulator layer.
11. The method as claimed in claim 10, wherein forming the trench structure comprises:
depositing an etching stop layer on the first insulator layer;
patterning the etching stop layer for the purpose of forming an etching mask; and
partially etching the first insulator layer with the aid of the etching mask for the purpose of forming a trench structure.
12. The method as claimed in claim 10, the trench structure being formed by the following steps of:
depositing an etching stop layer on the first insulator layer;
patterning the etching stop layer for the purpose of forming an etching mask;
etching the first insulator layer as far as the connecting contact with the aid of the etching mask for the purpose of forming a first passage hole;
depositing a second insulator layer made of a second dielectric material, which is different from the first dielectric material of the first insulator layer, and partially etching back the second insulator layer in the first passage hole for the purpose of forming a trench structure.
13. The method as claimed in claim 12, the thermal conductivity of the second dielectric material being lower than the thermal conductivity of the first dielectric material.
14. A method for fabricating a sublithographic contact structure in a memory cell in a semiconductor component, comprising:
providing a front-end-of-line (FEOL) finished processed semiconductor wafer with at least one electrical connecting contact connected to an active structure on one of its two opposite surfaces;
depositing a first insulator layer made of a first dielectric material on the semiconductor wafer at least over the electrical connecting contact;
forming a trench structure with a bottom and walls essentially perpendicular to the wafer surface in the first insulator layer at least partly over the electrical connecting contact;
depositing a first layer made of a dielectric spacer material at least over the trench structure and anisotropically etching back the spacer material layer in a direction essentially perpendicular to the wafer surface as far as the bottom of the trench structure in such a way that first spacers remain on the walls of the trench structure, a first sublithographic dimension (SL) being formed in the region between the first spacers situated on mutually opposite walls in at least one direction (x) parallel to the wafer surface;
etching the insulator layer in the region between the first spacers situated on mutually opposite walls as far as the connecting contact for the purpose of forming a first passage hole, the first spacers being used as an etching mask;
depositing a layer made of an electrically conductive material at least over the first passage hole and partially etching back the layer made of the electrically conductive material in the first passage hole for the purpose of forming a first contact electrode;
depositing a layer made of a resistance change material over the first passage hole and partially etching back the resistance change material for the purpose of forming a resistance change material zone and removing the first spacers and the resistance change material situated between the latter;
depositing a second layer made of a spacer material at least over the trench structure and anisotropically etching back the spacer material layer in a direction essentially perpendicular to the wafer surface until the resistance change material is uncovered, in such a way that second spacers remain on the walls of the trench structure, a second sublithographic dimension, which is different from the first sublithographic dimension, being formed in the region between the second spacers situated on mutually opposite walls in at least one direction (x) parallel to the wafer surface; and
depositing a layer made of an electrically conductive material on the resistance change material for the purpose of forming a second contact electrode.
15. The method as claimed in claim 14, the second sublithographic dimension being smaller than the first sublithographic dimension.
16. The method as claimed in claim 14, wherein forming the trench structure comprises:
depositing an etching stop layer on the first insulator layer;
patterning the etching stop layer for the purpose of forming an etching mask; and
partially etching the first insulator layer with the aid of the etching mask for the purpose of forming a trench structure.
17. The method as claimed in claim 14, wherein forming the trench structure comprises:
depositing an etching stop layer on the first insulator layer;
patterning the etching stop layer for the purpose of forming an etching mask;
etching the first insulator layer as far as the connecting contact with the aid of the etching mask for the purpose of forming a first passage hole; and
depositing a second insulator layer made of a second dielectric material, which is different from the first dielectric material of the first insulator layer, and partially etching back the second insulator layer in the first passage hole for the purpose of forming a trench structure.
18. The method as claimed in claim 9, the thermal conductivity of the second dielectric material being lower than the thermal conductivity of the first dielectric material.
19. A method for fabricating a sublithographic contact structure in a memory cell in a semiconductor component, which comprises the following steps of:
providing a front-end-of-line (FEOL) finished processed semiconductor wafer with at least one electrical connecting contact connected to an active structure on one of its two opposite surfaces;
depositing a first insulator layer made of a first dielectric material on the semiconductor wafer at least over the electrical connecting contact;
forming a trench structure with a bottom and walls essentially perpendicular to the wafer surface in the first insulator layer at least partly over the electrical connecting contact;
depositing a first layer made of a dielectric spacer material at least over the trench structure and anisotropically etching back the spacer material layer in a direction essentially perpendicular to the wafer surface as far as the bottom of the trench structure in such a way that first spacers remain on the walls of the trench structure, a first sublithographic dimension (SL) being formed in the region between the first spacers situated on mutually opposite walls in at least one direction (x) parallel to the wafer surface;
etching the insulator layer in the region between the first spacers situated on mutually opposite walls as far as the connecting contact for the purpose of forming a first passage hole, the first spacers being used as an etching mask;
depositing a layer made of an electrically conductive material at least over the first passage hole and partially etching back the layer made of the electrically conductive material in the first passage hole for the purpose of forming a first contact electrode;
depositing a layer made of a resistance change material over the first passage hole and partially etching back the resistance change material for the purpose of forming a resistance change material zone and removing the first spacers and the resistance change material situated between the latter;
depositing a second layer made of a spacer material at least over the trench structure and anisotropically etching back the spacer material layer in a direction essentially perpendicular to the wafer surface until the resistance change material is uncovered, in such a way that second spacers remain on the walls of the trench structure, a second sublithographic dimension, which is different from the first sublithographic dimension, being formed in the region between the second spacers situated on mutually opposite walls in at least one direction (x) parallel to the wafer surface;
depositing a layer made of an electrically conductive material on the resistance change material for the purpose of forming a second contact electrode;
partially etching back the contact electrode in the region between the second spacers;
partially isotropically etching back the spacer material on the walls of the trench structure in a direction (x) essentially parallel to the wafer surface for the purpose of increasing the distance between the second spacers situated on opposite walls in a direction (x) parallel to the wafer surface;
selectively isotropically etching the second dielectric material in a direction (y) essentially perpendicular to the wafer surface;
conformally depositing a third insulator layer made of a third dielectric material at least in the region of the trench structure; and
forming an electrically conductive connection to the second contact electrode in the third insulator layer.
20. The method as claimed in claim 19, wherein forming the trench structure comprises:
depositing an etching stop layer on the first insulator layer;
patterning the etching stop layer for the purpose of forming an etching mask; and
partially etching the first insulator layer with the aid of the etching mask for the purpose of forming a trench structure.
21. The method as claimed in claim 19, wherein forming the trench structure comprises:
depositing an etching stop layer on the first insulator layer;
patterning the etching stop layer for the purpose of forming an etching mask;
etching the first insulator layer as far as the connecting contact with the aid of the etching mask for the purpose of forming a first passage hole; and
depositing a second insulator layer made of a second dielectric material, which is different from the first dielectric material of the first insulator layer, and partially etching back the second insulator layer in the first passage hole for the purpose of forming a trench structure.
22. The method as claimed in claim 16, the thermal conductivity of the second dielectric material being lower than the thermal conductivity of the first dielectric material.
23. The method as claimed in claim 1, the trench structure having at least one minimum dimension that can be achieved photolithographically in at least one direction.
24. The method as claimed in claim 1, the sublithographic dimension being less than 50 nm.
25. A method for fabricating sublithographic contact structures in memory cells in a semiconductor component, comprising:
providing a front-end-of-line (FEOL) finished processed semiconductor wafer with at least two electrical connecting contacts each connected to an active structure on one of its two opposite surfaces;
depositing an insulator layer made of a dielectric material on the semiconductor wafer at least partially over the two connecting contacts;
forming an etching mask on the insulator layer;
etching the dielectric as far as the connecting contacts for the purpose of forming a first passage hole;
depositing a layer made of an electrically conductive material and partially etching back the layer made of an electrically conductive material for the purpose of forming a first contact electrode;
depositing a layer made of a resistance change material and partially etching back the resistance change material in the first passage hole for the purpose of forming a resistance change material zone;
depositing a layer made of an electrically conductive material. and partially etching back the electrically conductive material in the first passage hole for the purpose of forming a second contact electrode;
depositing a layer made of a spacer material and anisotropically etching back the spacer material layer in a direction (y) essentially perpendicular to the wafer surface in the first passage hole until the second contact electrode is uncovered, in such a way that first spacers remain on the walls of the first passage hole and the first spacers have a sublithographic dimension (SL) in at least one direction (x) parallel to the wafer surface;
etching the second contact electrode, the resistance change material zone and the first contact electrode as far as the connecting contacts, the first spacers being used as an etching mask, whereby a sublithographic contact structure is formed; and
forming an etching mask at least over the sublithographic contact structure and etching the sublithographic contact structure for the purpose of producing two sublithographic contact structure sections.
26. The method as claimed in claim 25, the first passage hole having at least one minimum dimension that can be achieved photolithographically in at least one direction.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A wing of an aircraft or spacecraft, the wing comprising:
at least a movable flow body, wherein:
the wing comprises a movable support member, which is connected to the flow body, for rotating the flow body on the wing, wherein the support member is connected to the flow body and the wing,
the wing comprising a flow body control element, wherein the flow body control element is connected to the flow body and the wing,
the flow body control element being connected to the wing in a first point and the support member being connected to the wing in a second point, which is a bearing point defined on both the support member and the wing,
the two points of the flow body control element and of the support member forming an axis,
the flow body control element being formed at a predetermined angle to the axis and
wherein the flow body control element guides the flow body in a predetermined plane about the axis, wherein at least one point of the flow body control element at which said flow body control element is connected to the flow body and a point of the support member at which said support member is connected to the flow body each form a separate connected point or a common connection on the flow body.
2. The wing according to claim 1, wherein the support member is fixed to the flow body in at least one point.
3. The wing according to claim 1, wherein the support member is fixed to the flow body in at least two points.
4. The wing according to claim 1, wherein the flow body control element is fixed to the flow body in at least one point.
5. The wing according to claim 1, wherein the flow body control element is positioned relative to the support member in such a way that said flow body control element absorbs forces of the support member in a predetermined direction, the flow body control element absorbing lateral and axial forces of the support member.
6. The wing according to claim 1, wherein the support member is formed as a frame element.
7. The wing according to claim 1, wherein the support member is formed as a plate.
8. The wing according to claim 1, wherein the support member is formed as one or more rod elements.
9. The wing according to claim 1, wherein the support member has a bow shape.
10. The wing according to claim 1, wherein the support member has a triangular shape.
11. The wing according to claim 1, wherein the wing comprises at least two fixing portions, each fixing portion comprising a support member and a fixing portion additionally being provided with the flow body control element.
12. The wing according to claim 2, wherein at least one of the points of the support member fixed to the flow body and the wing is formed as a spherical bearing.
13. The wing according to claim 3, wherein a plurality of the points of the support member fixed to the flow body and the wing are formed as a spherical bearing.
14. The wing according to claim 3, wherein all of the points of the support member fixed to the flow body and the wing are formed as a spherical bearing.
15. The wing according to claim 4, wherein one of the points of the control element fixed to the flow body and the wing is formed as a spherical bearing.
16. The wing according to claim 4, wherein a plurality of the points of the control element fixed to the flow body and the wing are formed as a spherical bearing.
17. The wing according to claim 4, wherein all of the points of the control element fixed to the flow body and the wing are formed as a spherical bearing.
18. The wing according to claim 1, wherein the flow body control element comprises at least a control rod element.
19. The wing according to claim 1, wherein the flow body is one of a landing flap or a wing element.
20. An aircraft comprising at least a wing comprising:
at least a movable flow body, wherein:
the wing comprises a movable support member, which is connected to the flow body, for rotating the flow body on the wing, wherein the support member is connected to the flow body and the wing,
the wing comprising a flow body control element, wherein the flow body control element is connected to the flow body and the wing,
the flow body control element being connected to the wing in a first point and the support member being connected to the wing in a second point, which is a bearing point defined on both the support member and the wing,
the two points of the flow body control element and of the support member forming an axis,
the flow body control element being formed at a predetermined angle to the axis and
wherein the flow body control element guides the flow body in a predetermined plane about the axis, wherein at least one point of the flow body control element at which said flow body control element is connected to the flow body and a point of the support member at which said support member is connected to the flow body each form a separate connected point or a common connection on the flow body.