1. Apparatus for supporting elongate sticks, comprising a main body member having a base defining a base footprint of a first defined footprint area and which body member supporting and restraining a plurality of at least three arms extending therefrom in a direction away from said base and each arm inclined relative to a vertical axis extending through said body.
2. Apparatus as claimed in claim 1 wherein ends of each arm remote from said body define an outer arm area, whereby said outer arm area is equal to or greater than said footprint area.
3. Apparatus as claimed in claim 1 wherein said footprint area is adjustable.
4. Apparatus as claimed in either claim 2 wherein said outer arm area is adjustable.
5. Apparatus as claimed in claim 1 wherein said base is formed by a plurality of at least three legs extending downwardly from said body in a direction away from said arms, and wherein each leg is inclined relative to said vertical axis extending through said body.
6. Apparatus as claimed in claim 5 wherein the or at least three arms extend completely through said body so that said legs are formed integrally with said arms.
7. Apparatus as claimed in claim 1 wherein each arm is adjustable into and out of said body.
8. Apparatus as claimed in claim 1 wherein said arms are straight and inclined at an angle of between 30 and 80 degrees relative to said vertical axis.
9. Apparatus as claimed in claim 1 wherein at least two arms are inclined at different angles relative to said vertical axis.
10. Apparatus as claimed in claim 1 wherein said body comprises a plurality of holes formed therein for receiving a body engaging end of each arm opposed to said remote end.
11. Apparatus as claimed in claim 10 wherein the number of said plurality of holes is greater than said number of arms, said plurality of holes having varying angles of inclination relative to said vertical axis to allow the arms to be selectively mounted on said body at various angles of inclination relative to said vertical axis.
12. Apparatus as claimed in claim 1 in which at said footprint area is asymmetrically disposed about said vertical axis.
13. Apparatus as claimed in claim 2 wherein said outer arm area is asymmetrically disposed about said vertical axis.
14. Apparatus as claimed in claim 1 wherein each of said arms are disposed about said vertical axis so as to have a constant angle between each adjacent arm.
15. Apparatus as claimed in claim 1 wherein said arms are removeably restrained in said body.
16. Apparatus as claimed in claim 1 wherein said base is removeably engaged with said body.
17. A system for playing a game comprising the apparatus of claim 1 and a plurality of elongate sticks.
18. A system as claimed in claim 17 in which said plurality are elongate sticks comprises a variety of sticks of different lengths, cross sectional shapes, weight, longitudinal profile and or surface texture.
19. A method of testing human dexterity comprising setting up an apparatus as claimed in claim 1, selecting a plurality of elongate sticks and attempting to balance said plurality of sticks on and between said arms of said apparatus and any other sticks previously balanced between such arms without causing such sticks being balanced thereon or any sticks previously balanced thereon to be displaced from said apparatus.
20. A method as claimed in claim 19 wherein said sticks are to be balanced on said apparatus so as alleviate said apparatus overbalancing.
21. A method as claimed in claim 19 further comprising the step of selectively adjusting the size of one or both the base footprint area andor the outer arm area.
22. A method as claimed in claim 19 comprising the step of selectively adjusting the symmetry of one or both the base footprint area andor the outer arm area about the vertical axis of said apparatus.
23. A method as claimed in claim 19 wherein said plurality of sticks include a variety of sticks of one or more of different lengths, cross sectional shapes, weight, longitudinal profile andor surface texture.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of uniform transient cooling in a thermal compression
bonding process comprising;
cooling the solder joint of a die during thermal compression bonding by a die backside surface by coupling a cooling solution to the die backside surface, wherein the cooling solution comprises:
an vertical array of micro channel jets coupled to a heater surface, wherein an outlet micro channel jet is coupled with two adjacent inlet micro channel jets; and
circulating air through the array of micro channel jets , wherein the air impinges onto the heater surface that is coupled to the die and exits through a manifold coupled to the micro channel jets, wherein the heater surface and the array of micro channel jets are fabricated in the same block material.
2. The method of claim 1, further comprising wherein an exit and an inlet manifold is coupled to the array of micro channel jets.
3. The method of claim 2 further comprising wherein a supply of compressed air is coupled to the inlet manifold.
4. The method of claim 1 further comprising wherein two inlet jets feed air to one outlet jet to transfer heat away from the heater surface to the cooling fluid.
5. The method of claim 1 wherein the cooling solution comprises a portion of a TCB tool, and wherein a heat transfer coefficient of the cooling solution is above about 3000 Wm2K cooling rate of the die.
6. The method of claim 1 further comprising wherein a TEC is disposed between the heater surface and a cooling block of the cooling solution.
7. The method of claim 1 further comprising wherein the micro channel jets comprise vertical individual inlet and outlet nozzles attached to the heater surface.
8. A method of comprising;
cooling a solder joint of a die by coupling a cooling solution to the die backside surface, wherein the cooling solution comprises:
a vertical array of micro channel jets coupled to a heater surface, wherein an outlet micro channel jet is coupled with an adjacent inlet micro channel jet; and
circulating a fluid through the vertical array of micro channel jets , wherein the fluid impinges onto the heater surface that is thermally coupled to the die and exits through a manifold coupled to the vertical array of micro channel jets, wherein the heater surface and the array of micro channel jets are fabricated in the same block material.
9. The method of claim 8 further comprising wherein the vertical array of micro channel jets comprise a plurality of vertical individual inlet and outlet nozzles attached to the heat spreader.
10. The method of claim 8 further comprising wherein the heater surface comprises micro fins.
11. The method of claim 8 further comprising wherein a TEC pad is disposed between the heater surface and a cooling block of the assembly.
12. The method of claim 10 further comprising wherein a tip of the micro fin is aligned in a center position between adjacent inlet and outlet micro channel jets.
13. The method of claim 8 further comprising wherein the micro channels are disposed inside the heater block, and wherein a cooling block of the assembly is fabricated in the same material piece in which the heater loops are embedded.
14. The method of claim 8 further comprising wherein inlet and outlet micro channels are disposed in a staggered configuration, and wherein a bottom portion of the cooling block is chamfered.
15. The method of claim 8 further comprising wherein the cooling solution further comprises a nozzle coupled to the heater, and a die coupled to the nozzle, wherein the die is on a substrate disposed on a pedestal.
16. The method of claim 8 further comprising wherein the cooling solution comprises a portion of a TCB bonding system that provides uniform transient cooling in a TCB process.
17. The method of claim 8 further comprising wherein the micro channels comprise a height of less than about 200 microns.
18. The method of claim 8 further comprising wherein an air gap between the nozzle and the heater is less than about 100 microns.
19. The method of claim 8 further comprising wherein the fluid comprises at least one of liquid air, liquid helium, liquid carbon dioxide and compressed air, compressed helium, and compresses carbon dioxide.
20. An assembly comprising:
an array of vertical micro channels coupled to a heater surface, wherein an outlet micro channel of the array is adjacent inlet micro channel of the array; and
an inlet and outlet manifold coupled to the array of vertical micro channels, wherein the heater surface and the array of vertical micro channels are coupled in the same block.
21. The assembly of claim 20 wherein the heater surface comprises micro fins.
22. The assembly of claim 20 wherein a TEC pad is disposed between the heater surface and a cooling block of the assembly.
23. The assembly of claim 21 wherein a tip of the micro fin is aligned in a center position between adjacent inlet and outlet micro channel jets.
24. The assembly of claim 20 wherein the vertical array of micro channels are disposed inside the heater block, and wherein a cooling block of the assembly is fabricated in the same material piece in which the heater loops are embedded.
25. The assembly of claim 24 further comprising wherein inlet and outlet micro channels are disposed in a staggered configuration, and wherein a bottom portion of the cooling block is chamfered.
26. The assembly of claim 20 wherein the assembly further comprises a nozzle coupled to the heater, and a die coupled to the nozzle, wherein the die is on a substrate disposed on a pedestal.
27. The assembly of claim 26 wherein the assembly comprises a portion of a TCB bonding system.
28. The assembly of claim 20 wherein the individual micro channels comprise a height of less than about 200 microns.
29. The assembly of claim 26 wherein an air gap between the nozzle and the heater is less than about 100 microns.
30. The assembly of claim 20 wherein every outlet micro channel comprises two adjacent inlet micro channels.