1. Arrangement for illuminating objects with light of different wavelengths in microscopes, automatic microscopes, and equipment for fluorescent microscopy applications comprising LED light sources for object illumination that are arranged in the illumination radiation path of the microscope or equipment, further comprising:
a receiving apparatus that is rotatable about an axis of rotation and that is provided with mounts for each of at least one LED, whereby said receiving apparatus is arranged in a housing that can be attached to an equipment housing or that is positioned in said equipment housing; and
a drive device for defined adjustment of said receiving apparatus such that said at least one LED can be selectively positioned upstream of a light emission aperture of said housing with the effective wavelength that is required for measurements andor observations.
2. Arrangement in accordance with claim 1, wherein said mounts are embodied and attached to said receiving apparatus such that the main emission direction of said at least one LED arranged thereon runs parallel to said axis of rotation.
3. Arrangement in accordance with claim 1, wherein said mounts of said receiving apparatus are embodied such that the main emission direction of said at least one LED arranged thereon runs radial to said axis of rotation.
4. Arrangement in accordance with claim 1 wherein collimator optics and a radiation homogenizer are provided in said equipment housing in the light direction downstream of said light emission aperture of said housing.
5. Arrangement in accordance with claim 1 wherein at least one of said LEDs is a white light LED emitting a white light.
6. Arrangement in accordance with claim 1 wherein a Peltier cooling element for cooling said LED is provided arranged between said mount of said receiving apparatus and said LED arranged thereon.
7. Arrangement in accordance with claim 1 wherein a halogen light source or another light source is arranged on at least one mount of said receiving apparatus.
8. Arrangement in accordance with claim 1, characterized in that said housing is arranged on said equipment housing using a rapid change ring in the form of a dovetail.
9. Arrangement in accordance with claim 1 wherein said at least one LED is arranged exchangeably in said mount without an associated Peltier cooling element.
10. Arrangement in accordance with claim 1 wherein said at least one LED is securely joined to said associated Peltier cooling element and can be arranged exchangeably in said mount together therewith.
11. Arrangement in accordance with claim 1, in combination with a microscope.
12. A light source for microscopes having an illumination ray path, the light source comprising:
a housing with a light emission aperture alignable with the illumination ray path;
an LED receiving apparatus rotatably mounted within the housing, the receiving apparatus having an axis of rotation; and
a plurality of LEDs, the LEDs each having light emission of different spectral characteristics, the LEDs mounted to the receiving apparatus whereby one of the LEDs of the plurality of LEDs can be selectively rotationally positioned upstream of the light emission aperture.
13. The light source of claim 12 wherein each of the LEDs has a main emission direction and wherein said main emission direction of each of the LEDs is aligned with the axis of rotation of the receiving apparatus.
14. The light source of claim 12 further comprising at least one of collimator optics and a radiation homogenizer attached to the housing and placeable in the light emission of the LEDs.
15. The light source of claim 12 further comprising a Peltier cooling element attached to an LED.
16. The light source of claim 12 in combination with a microscope, the light source attached to the microscope.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An assembly method for a semiconductor device assembly using a wire bonding device having an upper clamp member arid a lower clamp member, said method comprising:
providing at least a portion of a strip of leadframes, said strip having opposed rails, having dam bars between said opposed rails, having at least two inner leads located at a first level, having at least two outer leads located at a second level, having a die mount paddle located at a third level and having at least one integral clamping tab, said at least one integral clamping tab located at a fourth level extending outwardly for contact by said upper clamp member;
attaching a semiconductor device to said die mount paddle, said semiconductor device having a plurality of bond pads;
locating said strip of leadframes on said lower clamp member of said wire bonding device having said upper clamp member overlying portions of said at least two inner leads and portions of said at least one integral clamping tab; and
attaching at least one bond wire to said plurality of bond pads of said semiconductor device and said portions of said at least two inner leads.
2. The method of claim 1, further comprising:
forming said die mount paddle having an upper surface thereof at a third level located below an upper first level of said at least two inner leads; and
deforming said at least one integral clamping tab to clamp portions thereof.
3. The method of claim 1, further comprising:
removing said strip of leadframes and said semiconductor device from said lower clamp member; and
encapsulating a portion of said strip of leadframes, said semiconductor device, and at least two bond wires extending between said strip of leadframes and said semiconductor device in a material.
4. A method for assembling a semiconductor device assembly having a semiconductor device and portions of a leadframe using a wire bonding device having an upper clamp member and a lower clamp member, said method comprising:
supplying at least a portion of a strip of leadframes, said strip having opposed rails, having dam bars between said opposed rails, having at least two inner leads located at a first vertical level, having at least two outer leads located at a second vertical level, having a die mount paddle located at a third vertical level and having at least one integral clamping tab, said at least one integral clamping tab located at a fourth vertical level extending outwardly for contact by said upper clamp member;
attaching a semiconductor device to said die mount paddle, said semiconductor device having a plurality of bond pads;
locating at least a portion said strip of leadframes on said lower clamp member of said wire bonding device having said upper clamp member overlying portions of said at least two inner leads and portions of said at least one integral clamping tab; and
attaching at least one bond wire to said plurality of bond pads of said semiconductor device and said portions of said at least two inner leads.
5. The method of claim 4, further comprising:
forming said die mount paddle having an upper surface thereof at a third vertical level located below an upper first vertical level of said at least two inner leads; and
deforming said at least one integral clamping tab to clamp portions thereof.
6. The method of claim 4, further comprising:
removing said strip of leadframes and said semiconductor device from said lower clamp member; and
encapsulating a portion of said strip of leadframes, said semiconductor device, and at least two bond wires extending between said strip of leadframes and said semiconductor device in a material.
7. A method for assembling a semiconductor device assembly having a semiconductor device and portions of a leadframe using a wire bonding device having an upper clamp member and a lower clamp member, said method comprising:
providing at least a portion of a strip of leadframes, said strip having opposed rails, having dam bars between said opposed rails, having at least two inner leads located at a first vertical level, having at least two outer leads located at a second vertical level, having a die mount paddle located at a third vertical level and having at least one integral clamping tab, said at least one integral clamping tab located at a fourth vertical level extending outwardly for contact by said upper clamp member, said die mount paddle having a semiconductor device attached thereto, said semiconductor device having a plurality of bond pads;
locating at least a portion of said strip of leadframes on said lower clamp member of said wire bonding device having said upper clamp member overlying portions of said at least two inner leads and portions of said at least one integral clamping tab;
clamping portions of said leadframe using said upper clamp contacting portions of said leadframe while portions of said lower clamp contact portions of said leadframe; and
attaching at least one bond wire to said plurality of bond pads of said semiconductor device and said portions of said at least two inner leads.
8. The method of claim 7, further comprising:
forming said die mount paddle having an upper surface thereof at a third vertical level located below an upper first vertical level of said at least two inner leads; and
deforming said at least one integral clamping tab to clamp portions thereof.
9. The method of claim 7, further comprising:
removing said strip of leadframes and said semiconductor device from said lower clamp member; and
encapsulating a portion of said strip of leadframes, said semiconductor device, and at least two bond wires extending between said strip of leadframes and said semiconductor device in a material.
10. A method for assembling a semiconductor device assembly having a semiconductor device and portions of a leadframe using a wire bonding device having an upper clamp member and a lower clamp member, said method comprising:
supplying a portion of a strip of leadframes, said strip having opposed rails, having dam bars between said opposed rails, having at least two inner leads located at a first vertical level, having at least two outer leads located at a second vertical level, having a die mount paddle located at a third vertical level and having at least one integral clamping tab, said at least one integral clamping tab located at a fourth vertical level extending outwardly for contact by said upper clamp member, said die mount paddle having a semiconductor device attached thereto, said semiconductor device having a plurality bond pads;
locating at least a portion of said strip of leadframes on said lower clamp member of said wire bonding device having said upper clamp member overlying portions of said at least two inner leads and portions of said at least one integral clamping tab; and
attaching at least one bond wire to said plurality of bond pads of said semiconductor device and said portions of said at least two inner leads.
11. The method of claim 10, further comprising:
forming said die mount paddle having an upper surface thereof at a third vertical level located below an upper first vertical level of said at least two inner leads; and
deforming said at least one integral clamping tab to clamp portions thereof.
12. The method of claim 10, further comprising:
removing said strip of leadframes and said semiconductor device from said lower clamp member; and
encapsulating a portion of said strip of leadframes, said semiconductor device, and at least two bond wires extending between said strip of leadframes and said semiconductor device in a material.
13. A method for assembling a semiconductor device assembly having a semiconductor device arid portions of a leadframe using a wire bonding device having an upper clamp member and a lower clamp member, said method comprising:
supplying a portion of a strip of leadframes, said strip having opposed rails, having dam bars between said opposed rails, having at least two inner leads located at a first level, having at least two outer leads located at a second level, having a die mount paddle located at a third level and having at least one integral clamping tab, said at least one integral clamping tab located at a fourth level extending outwardly for contact by said upper clamp member, said die mount paddle having a semiconductor device attached thereto, said semiconductor device having a plurality of bond pads;
locating at least a portion of said strip of leadframes on said lower clamp member of said wire bonding device having said upper clamp member overlying portions of said at least two inner leads and portions of said at least one integral clamping tab;
preventing substantial movement of said die mount paddle by clamping a portion thereof; and
attaching at least one bond wire to said plurality of bond pads of said semiconductor device and said portions of said at least two inner leads.
14. The method of claim 13, further comprising:
forming said die mount paddle having an upper surface thereof at a third vertical level located below an upper first vertical level of said at least two inner leads; and
deforming said at least one integral clamping tab to clamp portions thereof.
15. The method of claim 13, further comprising:
removing said strip of leadframes and said semiconductor device from said lower clamp member; and
encapsulating a portion of said strip of leadframes, said semiconductor device, and at least two bond wires extending between said strip of leadframes and said semiconductor device in a material.
16. A method for assembling a semiconductor device assembly having a semiconductor device and portions of a leadframe using a wire bonding device having an upper clamp member and a lower clamp member, said method comprising:
supplying at least a portion of a strip of leadframes, said strip having opposed rails, having dam bars between said opposed rails, having at least two inner leads located at a first level, having at least two outer leads located at a second level, having a die mount paddle located at a third level and having at least one integral clamping tab, said at least one integral clamping tab located at a fourth level extending outwardly for contact by said upper clamp member, said die mount paddle having a semiconductor device attached thereto, said semiconductor device having a plurality of bond pads;
locating at least a portion of said strip of leadframes on said lower clamp member of said wire bonding device having said upper clamp member overlying portions of said at least two inner leads and portions of said at least one integral clamping tab;
forcing portions of said die mount paddle into contact with portions of said lower clamp; and
attaching at least one bond wire to said plurality of bond pads of said semiconductor device and said portions of said at least two inner leads.
17. The method of claim 16, further comprising:
forming said die mount paddle having an upper surface thereof at a third vertical level located below an upper first vertical level of said at least two inner leads; and
deforming said at least one integral clamping tab to clamp portions thereof.
18. The method of claim 16, further comprising:
removing said strip of leadframes and said semiconductor device from said lower clamp member; and
encapsulating a portion of said strip of leadframes, said semiconductor device, and at least two bond wires extending between said strip of leadframes and said semiconductor device in a material.
19. A method for assembling a semiconductor device assembly having a semiconductor device and portions of a leadframe using a wire bonding device having an upper clamp member and a lower clamp member, said method comprising:
supplying at least one leadframe from a strip of leadframes having opposed rails, having dam bars between said opposed rails, having at least two inner leads located at a first level, having at least two outer leads located at a second level, having a die mount paddle located at a third level and having at least one integral clamping tab, said at least one integral clamping tab located at a fourth level extending outwardly for contact by said upper clamp member, said die mount paddle having a semiconductor device attached thereto, said semiconductor device having a plurality of bond pads;
locating at least a portion of said at least one leadframe on said lower clamp member of said wire bonding device having said upper clamp member overlying portions of said at least two inner leads and portions of said at least one integral clamping tab;
forcing portions of said die mount paddle into contact with portions of said lower clamp; and
attaching at least one bond wire to said plurality of bond pads of said semiconductor device and said portions of said at least two inner leads.
20. The method of claim 19, further comprising:
forming said die mount paddle having an upper surface thereof at a third vertical level located below an upper first vertical level of said at least two inner leads; and
deforming said at least one integral clamping tab to clamp portions thereof.
21. The method of claim 19, further comprising:
removing said at least one leadframe and said semiconductor device from said lower clamp member; and
encapsulating a portion of said at least one leadframe, said semiconductor device, and at least two bond wires extending between said strip of leadframes and said semiconductor device in a material.
22. A method for assembling a semiconductor device assembly having a semiconductor device and portions of a leadframe using a wire bonding device having an upper clamp member and a lower clamp member, said method comprising:
supplying at least one leadframe from a strip of leadframes having opposed rails, having dam bars between said opposed rails, having at least two inner leads located at a first level, having at least two outer leads located at a second level, having a die mount paddle located at a third level and having at least one integral clamping tab, said at least one integral clamping tab located at a fourth level extending outwardly for contact by said upper clamp member, said die mount paddle having a semiconductor device attached thereto, said semiconductor device having a plurality of bond pads;
locating at least a portion of said at least one leadframe on said lower clamp member of said wire bonding device having said upper clamp member overlying portions of said at least two inner leads and portions of said at least one integral clamping tab;
preventing substantial movement of portions of said die mount paddle by contacting portions of said die mount paddle with said upper clamp and said lower clamp; and
attaching at least one bond wire to said plurality of bond pads of said semiconductor device and said portions of said at least two inner leads.
23. The method of claim 22, further comprising:
forming said die mount paddle having an upper surface thereof at a third vertical level located below an upper first vertical level of said at least two inner leads; and
deforming said at least one integral clamping tab to clamp portions thereof.
24. The method of claim 22, further comprising:
removing said strip of leadframes and said semiconductor device from said lower clamp member; and
encapsulating a portion of said at least one leadframe from a strip of leadframes, said semiconductor device, and at least two bond wires extending between at least one leadframe from a strip of leadframes and said semiconductor device in a material.
25. A method for assembling a semiconductor device assembly having a semiconductor device and portions of a leadframe using a wire bonding device having an upper clamp member and a lower clamp member, said method comprising:
supplying at least one leadframe from a strip of leadframes, said strip having opposed rails, having dam bars between said opposed rails, having at least two inner leads, having at least two outer leads, having a die mount paddle located and having at least one integral clamping tab, said at least one integral clamping tab extending outwardly for contact by said upper clamp member, said die mount paddle having a semiconductor device attached thereto, said semiconductor device having a plurality of bond pads;
locating at least a portion of said strip of leadframes on said lower clamp member of said wire bonding device having said upper clamp member overlying portions of said at least two inner leads and portions of said at least one integral clamping tab;
forcing portions of said die mount paddle into contact with portions of said lower clamp; and
attaching at least one bond wire to said plurality of bond pads of said semiconductor device and said portions of said at least two inner leads.
26. The method of claim 25, further comprising:
forming said die mount paddle having an upper surface thereof at a third vertical level located below an upper first vertical level of said at least two inner leads; and
deforming said at least one integral clamping tab to clamp portions thereof.
27. The method of claim 25, further comprising:
removing said at least one leadframe from a strip of leadframes and said semiconductor device from said lower clamp member; and
encapsulating a portion of said leadframe from a strip of leadframes, said semiconductor device, and at least two bond wires extending between said at least one leadframe from said strip of leadframes and said semiconductor device in a material.
28. A method of bonding a portion of a wire to a portion of a lead of a leadframe having a semiconductor device having a plurality of bond pads attached to a portion of a die mount paddle of a leadframe, said method comprising:
locating said strip of leadframes on a lower clamp member of a wire bonding device having an upper clamp member overlying a portion of at least one lead and a portion of at least one integral clamping tab of said strip of leadframes; and
attaching at least one bond wire to said plurality of bond pads of said semiconductor device and said portions of said at least two inner leads.