1. A semiconductor device package comprising:
a containment body defining an interior cavity and an exterior with a plurality of electrical contacts each extending from the interior cavity to the exterior; and
a semiconductor die housed within the interior cavity with a plurality of wire bonds flexibly connecting the semiconductor die to the electrical contacts, wherein the semiconductor is free to move within the interior cavity of the containment body accommodated by flexure of the wire bonds to mitigate packaging stress and strain between the containment body and the semiconductor.
2. A semiconductor device package as recited in claim 1, wherein the interior cavity includes a plurality of interior surfaces and the semiconductor die includes a plurality of die surfaces, each opposed to a respective one of the interior surfaces of the interior cavity, wherein the respective interior surfaces of the interior cavity and the die surfaces are configured and adapted to move relative to one another even when in contact with one another.
3. A semiconductor device package as recited in claim 1, wherein the interior cavity includes a plurality of interior surfaces and a clearance space is defined between the semiconductor die and the interior surfaces, and wherein the clearance space is at least partially filled with a lubricious fluid to facilitate any contacting surfaces between the semiconductor die and the surfaces of the interior cavity moving freely relative to one another.
4. A semiconductor device package as recited in claim 1, wherein there is a clearance between the interior cavity and the semiconductor die sufficient to allow for at least three axes of translational movement of the semiconductor die relative to the interior cavity.
5. A semiconductor device package as recited in claim 4, wherein the clearance is dimensioned to limit movement of the semiconductor die in all three axes relative to the interior cavity so as to maintain positional and spatial alignment and orientation of the semiconductor die relative to external contaiment features to a predetermined degree to protect the wire bonds from damage due to over flexure.
6. A semiconductor device package as recited in claim 1, wherein the containment body includes a base mounted to a cap, wherein the base includes the electrical contacts and at least one surface of the interior cavity, and wherein the cap includes at least one surface of the interior cavity.
7. A semiconductor device package as recited in claim 6, wherein the semiconductor die includes a MEMS pressure sensor, and wherein at least one of the base and cap of the containment body includes an aperture therethrough from the interior cavity to the exterior, the aperture being covered by a diaphragm for communication of ambient pressure to the MEMS pressure sensor.
8. A semiconductor device package comprising:
a containment body defining an interior cavity and an exterior with a plurality of electrical contacts each extending from the interior cavity to the exterior; and
a semiconductor die in electrical communication with the electrical contacts of the containment body by way of a plurality of flexible wire bonds, wherein the wire bonds are the only fixed connection between the containment body and the semiconductor die, wherein the semiconductor die is free to move within the interior cavity of the containment body accommodated by flexure of the wire bonds to mitigate packaging stress and strain between the containment body and the semiconductor die.
9. A semiconductor device package as recited in claim 8, wherein the interior cavity includes a plurality of interior surfaces and the semiconductor die includes a plurality of die surfaces, each opposed to a respective one of the interior surfaces of the interior cavity, wherein the respective interior surfaces of the interior cavity and die surfaces are configured and adapted to move relative to one another even when in contact with one another.
10. A semiconductor device package as recited in claim 8, wherein the interior cavity includes a plurality of interior surfaces and a clearance space is defined between the semiconductor die and the interior surfaces, and wherein the clearance space is at least partially filled with a lubricious fluid to facilitate any contacting surfaces between the semiconductor die and the surfaces of the interior cavity moving freely relative to one another.
11. A semiconductor device package as recited in claim 8, wherein there is a clearance between the interior cavity and the semiconductor die sufficient to allow for at least three axes of translational movement of the semiconductor die relative to the interior cavity.
12. A semiconductor device package as recited in claim 11, wherein the clearance is dimensioned to limit movement of the semiconductor die in all three axes relative to the interior cavity so as to maintain positional and spatial alignment and orientation of the semiconductor die relative to external contaiment features to a predetermined degree to protect the wire bonds from damage due to over flexure
13. A semiconductor device package as recited in claim 8, wherein the containment body includes a base mounted to a cap, wherein the base includes the electrical contacts and at least one surface of the interior cavity, and wherein the cap includes at least one surface of the interior cavity.
14. A semiconductor device package as recited in claim 13, wherein the semiconductor die includes a MEMS pressure sensor, and wherein at least one of the base and cap of the containment body includes an aperture therethrough from the interior cavity to the exterior, the aperture being covered by a diaphragm for communication of ambient pressure to the MEMS pressure sensor.
15. A semiconductor device package comprising:
a containment body defining an interior cavity and an exterior with a plurality of electrical contacts each extending from the interior cavity to the exterior; and
a semiconductor die housed within the interior cavity wherein the semiconductor die is detached from the interior cavity and is free of adherence thereto to mitigate packaging stress and strain between the containment body and the semiconductor die.
16. A semiconductor device package as recited in claim 15, wherein the interior cavity includes a plurality of interior surfaces and the semiconductor die includes a plurality of die surfaces, each opposed to a respective one of the interior surfaces of the interior cavity, wherein the interior surfaces of the interior cavity and the respective die surfaces are configured and adapted to move relative to one another even when in contact with one another.
17. A semiconductor device package as recited in claim 15, wherein the interior cavity includes a plurality of interior surfaces and a clearance space is defined between the semiconductor die and the interior surfaces, and wherein the clearance space is at least partially filled with a lubricious fluid to facilitate any contacting surfaces between the semiconductor die and the surfaces of the interior cavity moving freely relative to one another.
18. A semiconductor device package as recited in claim 15, wherein there is a clearance between the interior cavity and the semiconductor die sufficient to allow for at least three axes of translational movement of the semiconductor die relative to the interior cavity, and wherein the clearance is dimensioned to limit movement of the semiconductor die in all three axes relative to the interior cavity so as to maintain positional and spatial alignment and orientation of the semiconductor die relative to external containment features.
19. A semiconductor device package as recited in claim 15, wherein the containment body includes a base mounted to a cap, wherein the base includes at least one surface of the interior cavity, and wherein the cap includes at least one surface of the interior cavity.
20. A semiconductor device package as recited in claim 15, wherein the semiconductor die includes a MEMS pressure sensor, and wherein at least one of the base and cap of the containment body includes an aperture therethrough from the interior cavity to the exterior, the aperture being covered by a diaphragm for communication of ambient pressure to the MEMS pressure sensor.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A media over packet networking appliance comprising:
A. a network interface;
B. an audio transducer; and
C. at least one integrated circuit assembly coupling the audio transducer to the network interface, the at least one integrated circuit assembly providing media over packet transmissions and including a processor circuit and a packet network path diversity software stack, the packet network path diversity software stack including instructions implementing a process of sending real-time information including:
i. generating in the integrated circuit assembly first packets containing the real-time information, and also containing a first particular address of the destination, and further containing a second particular address of a first proxy computer;
ii. generating dependent packets containing information dependent on the real-time information, and also containing the first particular address of the destination, and further containing a third particular address of a second proxy computer; and
iii. sending the first packets and the dependent packets.
2. The media over packet networking appliance of claim 1 further including a speech encoder coupled to the processor circuit.
3. The media over packet networking appliance of claim 1 further including a speech encoder and wherein the packet network path diversity software stack includes an interface block and a networking block establishing two or more software objects respectively representing diverse network connections, the interface block coupling the speech encoder concurrently to the processor circuit.
4. The media over packet networking appliance of claim 1 further including a voice over packet control coupled to the processor circuit.
5. The media over packet networking appliance of claim 1 further including a feeder software block coupled to the networking block wherein the feeder software block couples to two or more software objects when the software objects are established.
6. The media over packet networking appliance of claim 5 further including a decoder coupled to the feeder software block to receive packets of real time information and dependent packets dependent on the real time information.
7. The media over packet networking appliance of claim 1 wherein the integrated circuit assembly comprises a digital signal processor and the packet network path diversity software stack comprises a block of software instructions executable at least in part by the digital signal processor.
8. The media over packet networking appliance of claim 1 wherein the integrated circuit assembly comprises processor circuitry and a non-volatile memory storing instructions establishing the packet network path diversity software stack for execution by the processor circuitry.
9. The media over packet networking appliance of claim 1 further including a television set enclosure holding a television electronics and display assembly and a user interface both coupled to the integrated circuit assembly.
10. The media over packet networking appliance of claim 1 wherein the network interface includes a wireless interface unit coupled to the integrated circuit assembly.
11. The media over packet networking appliance of claim 1 further including a set top box enclosure and wherein the network interface includes a cable modem coupled to the integrated circuit assembly.
12. The media over packet networking appliance of claim 1 further including a wearable mobile enclosure holding a user interface coupled to the integrated circuit assembly.
13. The media over packet networking appliance of claim 1 further including a home appliance enclosure holding a tactile user interface coupled to the integrated circuit assembly.
14. The media over packet networking appliance of claim 1 further including an automotive accessory enclosure holding a user interface coupled to the integrated circuit assembly.
15. The media over packet networking appliance of claim 1 further including a compressed-image packet interface coupled to the integrated circuit assembly and an image display coupled to the integrated circuit assembly.