We claim:
1. A method for checking a functionality of an integrated semiconductor memory, which comprises the steps of:
testing a first group of memory cells resulting in test results;
buffer storing the test results, separately for each tested memory cell, in at least triple copies in a second group of the memory cells;
performing a comparison between the copies of each of the test results;
determining information about a functional capability of the memory cells of the first group in a manner dependent on the comparison of the copies; and
accessing the memory cells by use of addresses, the addresses of the memory cells contain a first address part through which one of the first group and the second group of the memory cells is accessed, and a second address part through which the memory cells within one of the first group and the second group are accessed, the addresses of each the memory cells contain a number of address bits, and the second address part of a memory cell of the second group is generated, proceeding from a corresponding second address part of a respectively tested memory cell of the first group by an address transformation by alteration of at least one of the address bits.
2. The method according to claim 1, which comprises combining the address bits with one another by performing the address transformation in order to obtain a random sequence of transformed addresses from a sequence of the addresses.
3. The method according to claim 1, wherein the integrated semiconductor memory has column lines and row lines, the memory cells are each connected to a respective one of the row lines and a respective one of the column lines and the addresses are decoded in a column address decoder and a row address decoder, the method which further comprises the steps of:
determining an address of the memory cell of the second group storing a copy of a test result using a spacing value being added to the second address part of the respectively tested memory cell of the first group, so that the column addresses and row addresses of the memory cells of the second group with the copies of one of the test results differ.
4. The method according to claim 3, which comprises disposing the memory cells of the second group in which the copies of one of the test results are stored, at mutually identical address spacings.
5. The method according to claim 3, which comprises setting the spacing value in a variable manner at a beginning of the functional checking.
6. The method according to claim 3, which comprises setting the second address part of the address of the memory cell of the second group which contains a first copy of the test result to be identical to a corresponding second address part of the address of the respectively tested memory cell of the first group and, proceeding from the second address part of the address of the memory cell, the addresses of the memory cells which contain the other copies of the test result are determined.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of fabricating a device having multiple organic layers, comprising:
providing a first organic layer having a first phase transition temperature;
contact printing a second organic layer on the first organic layer wherein the first organic layer is maintained at a temperature below the first phase transition temperature during said contact printing; and
contact printing a third layer on the second organic layer wherein the temperature of the first and second organic layers are maintained at a temperature below the lower of their phase transition temperatures during said contact printing of the third layer.
2. The method of claim 1, wherein the phase transition temperature is the average transition temperature of a blend of polymers, each having distinct phase transition temperatures.
3. The method of claim 1, wherein at least one of the organic layers is swollen by contact with a plasticizing solvent and the phase transition temperature of the swollen layer is determined according to the Hoy modification to the Fox-Flory equation.
4. The method of claim 1, wherein the phase transition temperature is a glass transition temperature.
5. The method of claim 1, wherein the contact printing comprises screen printing, flexographic printing, gravure printing, lithographic printing, rubber stamping, laminating, or decal transferring, or a combination thereof.
6. The method of claim 1, wherein at least one of the organic layers comprises a charge transport layer or a photoactive layer.
7. The method of claim 1, wherein at least one of the organic layers comprises a hole transport polymer selected from polyvinylcarbazole, (phenylmethyl)polysilane, poly(dioxythiophenes), polyanilines, or polypyrroles, or copolymers or mixtures thereof.
8. The method of claim 1, wherein at least one of the organic layers comprises an electron transport polymer selected from poly(oxadiazoles), polytriazoles, polypyridines, or polypyrimidines, or copolymers or mixtures thereof.
9. The method of claim 1, wherein at least one of the organic layers comprises polyethylene terephthalate, polyethylene naphthalate, polyimide, polycarbonate, polyamide, polyarylate, and polyethersulfone films.
10. The method of claim 1, wherein the method further comprises contact printing a getter material over the layers.
11. The method of claim 1, wherein the first organic layer is applied by contact printing.
12. The method of claim 11, wherein the first and second organic layers are only printed where light will emit from said device.