1. An electrical connector adapted for electrically connecting a chip module to a printed circuit board, comprising:
an insulative housing having an upper mounting surface, opposite lower connecting surface, and defining a plurality of contact-receiving passageways penetrating through said mounting and connecting surfaces thereof;
a plurality of contacts received in the contact-receiving passageways of the insulative housing adapted for electrically connecting with said chip module and the printed circuit board which respectively assembled to the mounting surface and the connecting surface of the insulative housing; and
a metal stiffener partially surrounding the insulative housing and comprising a flat board essentially downwardly directly and communicatively confronting the printed circuit board; and wherein
the insulative housing has a portion located below the metal stiffener and compressed by the metal stiffener to prevent the deformation of the insulative housing.
2. The electrical connector as claimed in claim 1, wherein the insulative housing comprises a body portion, a continuous surrounding wall upwardly extending from the body portion, and an extension portion horizontally and outwardly extending from the surrounding wall, and wherein the extension portion of the insulative housing is located below the metal stiffener and compressed by the metal stiffener.
3. The electrical connector as claimed in claim 2, wherein the metal stiffener defines a window in the center thereof, and wherein the main portion and the surrounding wall protrude through the window with the extension portion blocked by the portions round the window of the metal stiffener.
4. The electrical connector as claimed in claim 1, further comprising a metal clip and a lever respectively pivotally mourned to opposite ends of the metal stiffener.
5. The electrical connector as claimed in claim 4, wherein the metal clip partially covers the insulative housing and has an engaging portion compressed by the lever when the lever in a closed position.
6. The electrical connector as claimed in claim 1, wherein the metal stiffener defines at least a pair of positioning holes in at least one pair of corners thereof, and a pair of positioning blocks are interferentially received in the at least a pair of positioning holes for retaining the metal stiffener to the printed circuit board.
7. The electrical connector as claimed in claim 1, wherein said stiffener further includes four edge walls extending upwardly from the flat board.
8. The electrical connector as claimed in claim 7, wherein said stiffener is dimensionally larger than the housing in a top view in both front-to-back and transverse directions so as to have the housing surrounded among said four edge walls.
9. An LGA (Land Grid Array) connector adapted for electrically connecting a chip module to a printed circuit board, comprising:
an insulative housing defining a plurality of contact-receiving passageways along up-to-down direction;
a plurality of contacts received in the contact-receiving passageways of the insulative housing;
a metal stiffener partially surrounding the insulative housing defining a window to permit the protrusion of the insulative housing;
a metal clip pivotally mounted to one end of the metal stiffener; and
a lever pivotally mounted to opposite the other end of the metal stiffener; and wherein
the insulative housing has an extension portion with dimension larger than that of the window and located below the metal stiffener to be compressed by the metal stiffener; and the metal stiffener defines four positioning holes at four corners thereof, and wherein four positioning blocks are interferentially received in the positioning holes to position the electrical connector to the printed circuit board.
10. The LGA connector as claimed in claim 9, wherein the insulative housing comprises a main portion, a surrounding wall extending upwardly from the main portion and said extension portion extending horizontally and outwardly from the surrounding wall.
11. The LGA connector as claimed in claim 9, wherein each contact has upper and lower ends exposed beyond upper and lower surfaces of the insulative housing and both being compression structure.
12. An LGA (Land Grid Array) connector assembly comprising:
a printed circuit board;
an insulative housing located above the printed circuit board and provided with a plurality of contacts therein and defining a receiving space in an upper face, said housing defining a flange round a bottom face;
a metallic stiffener essentially located above the flange and defining an opening to enclose said housing;
a metallic clip pivotally mounted on one end of the stiffener; and
lever pivotally mounted on1the other end of the stiffener; wherein
a plurality of positioning blocks supportably sandwiched between the stiffener and the printed circuit board.
13. The LGA connector assembly as claimed in claim 12, wherein the said flange results in a downward assembling of the stiffener to the housing.
14. The LGA connector assembly as claimed in claim 12, wherein the stiffener is assembled to the printed circuit board around the positioning blocks instead of through the housing.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A label to be applied to a package for a cosmetic product, comprising:
a printed substrate; and
a film of nonwoven material placed on the printed substrate, said film being sufficiently transparent that the printing on the substrate can be seen through said film.
2. The label according to claim 1, wherein a side of the substrate opposite the film of nonwoven material is covered with an adhesive layer to which a peel-off sheet is affixed, and wherein a side of the peel-off sheet in contact with the adhesive layer is covered with a nonstick material.
3. The label according to claim 2, wherein the peel-off sheet includes a material chosen from among polyethylene terephthalates, polypropylenes and paper.
4. The label according to claim 1, wherein said film of nonwoven material is fastened to the substrate by bonding with an adhesive or a varnish.
5. The label according to claim 1, wherein the substrate comprises a material chosen from among high-density polyethylenes, polypropylenes, polyvinyl chlorides, polyethylene terephthalates and paper.
6. The label according to claim 1, wherein the substrate has a thickness of from 20 m to 200 m.
7. The label according to claim 1, wherein the nonwoven material is a nonwoven material of thermoplastic fibers.
8. The label according to claim 1, wherein the film of nonwoven material has a thickness of from 20 m to 500 m.
9. The label according to claim 4, wherein said bonding comprises one of an adhesive and a varnish.
10. The label according to claim 1, wherein the substrate has a thickness of from 40 m to 100 m.
11. The label according to claim 1, wherein the nonwoven material is a nonwoven material of polyolefin fibers.
12. The label according to claim 11, wherein the polyolefin fibers comprise one of polypropylene, fibers, polyethylene fibers and polyester fibers.
13. The label according to claim 1, wherein the film of nonwoven material has a thickness of from 100 m to 300 m.
14. A container having a label comprising:
a printed substrate; and
a film of nonwoven material placed on the printed substrate, said film being sufficiently transparent that the printing on the substrate can be seen through said film.
15. The container according to claim 14, wherein the container comprises one of a bottle, a tube and a can.