1. A method of manufacture of an integrated circuit packaging system comprising:
mounting an integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached the device through via;
attaching a conductive support over the substrate with the conductive support adjacent to the integrated circuit;
providing a pre-formed interposer, having an interposer through via, active circuitry, and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via;
mounting the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via; and
forming an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer.
2. The method as claimed in claim 1 wherein mounting the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via includes electrically coupling the pre-attached interconnect and the device through via.
3. The method as claimed in claim 1 wherein forming the encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer includes exposing the interposer through via.
4. The method as claimed in claim 1 wherein forming the encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer includes forming the encapsulation coplanar with the exposed portion of the pre-formed interposer.
5. The method as claimed in claim 1 wherein providing the pre-formed interposer, having the interposer through via and the pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via includes providing the pre-formed interposer having a pre-attached solder on pad bump.
6. A method of manufacture of an integrated circuit packaging system comprising:
mounting an integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached the device through via and the substrate;
attaching a conductive support over the substrate with the conductive support adjacent to the integrated circuit;
providing a pre-formed interposer, having an interposer through via, active circuitry, and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via;
mounting the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via; and
forming an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer with the encapsulation coplanar with the exposed portion of the pre-formed interposer.
7. The method as claimed in claim 6 wherein mounting the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via includes electrically coupling the pre-attached interconnect and the conductive support.
8. The method as claimed in claim 6 wherein providing the pre-formed interposer includes providing an organic interposer.
9. The method as claimed in claim 6 further comprising connecting a mounting device and the device through via.
10. The method as claimed in claim 6 wherein mounting the integrated circuit includes mounting a flip chip.
11. An integrated circuit packaging system comprising:
a substrate;
an integrated circuit, having a device through via and a device interconnect, over the substrate with the device through via traversing the integrated circuit and the device interconnect attached the device through via;
a conductive support over the substrate with the conductive support adjacent to the integrated circuit;
a pre-formed interposer, having an interposer through via, active circuitry, and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via including:
the pre-formed interposer having the characteristics of the pre-attached interconnect pre-attached to a carrier of the pre-foamed interposer, and
the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via; and
an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer.
12. The system as claimed in claim 11 wherein the pre-attached interconnect is electrically coupled to the device through via.
13. The system as claimed in claim 11 wherein the encapsulation exposes the interposer through via.
14. The system as claimed in claim 11 wherein the encapsulation is coplanar with the exposed portion of the pre-formed interposer.
15. The system as claimed in claim 11 wherein the pre-attached interconnect includes a pre-attached solder on pad bump.
16. The system as claimed in claim 11 wherein:
the device interconnect is attached to the substrate; and
the encapsulation is coplanar with the exposed portion of the pre-formed interposer.
17. The system as claimed in claim 16 wherein the pre-formed interposer is electrically coupled to the conductive support.
18. The system as claimed in claim 16 wherein the pre-formed interposer includes an organic interposer.
19. The system as claimed in claim 16 further comprising a mounting device connected to the device through via.
20. The system as claimed in claim 16 wherein the integrated circuit includes a flip chip.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A fuel cell stack comprising:
a membrane electrode assembly including electrode catalyst layers and an electrolyte membrane between the electrode catalyst layers;
a metal separator on each side of first and second surfaces of the membrane electrode assembly, each metal separator having a base material comprising a stainless steel containing at least one of Fe, Ni, and Cr as a main component and having a corrosion-resistant coating layer provided only on a reaction-side surface facing the membrane electrode assembly, each metal separator constituting gas flow paths,
the membrane electrode assembly and the metal separators constituting a cell of a fuel cell; and
a temperature-control medium flow path provided by forming joined portions where back surfaces of the metal separators of adjacent stacked cells are in contact with each other;
wherein the joined portions are formed by welding portions of the metal separators that constitute groove bottoms of the gas flow paths; and
wherein an oxide film is provided on a surface of respective welded portions after welding by at least one of:
irradiating a laser beam on the surfaces of the welded portions to form an oxide film;
immersing the surfaces of the welded portions in an acidic solution to form an oxide film; and
performing electrolysis while the surfaces of the welded portions arc immersed in an acidic solution to form an oxide film.
2. The fuel cell stack according to claim 1, wherein each of the metal separators has a corrugated shape including projecting portions constituting one of the gas flow paths provided on the membrane electrode assembly, and recesses constituting the temperature-control medium flow path, and peripheral portions of planar surfaces each disposed or the top of respective projecting portions, which constitute the groove bottom of the gas flow path, are joined by welding.
3. The fuel cell stack according to claim 1, wherein a ratio of a joined area corresponding to a joined portion to the contact area where the back surfaces of the metal separators are in contact with each other is 5% or more.
4. A method of producing a fuel cell stack comprising the steps of:
forming a corrosion-resistant coating layer on a surface of individual metal having a base material comprising a stainless steel containing at least one of Fe, Ni, and Cr as a main component;
forming a temperature control medium flow path by joining portions where surfaces of the metal separators of adjacent stacked cells not having the corrosion-resistant coating layer thereon are in contact with each other;
performing a corrosion-resistant treatment on surfaces of welded portions of the joined portions after welding by at least one of:
irradiating a laser beam on the surfaces of the welded portions to form an oxide film;
immersing the surfaces of the welded portions in an acidic solution to form an oxide film; and
performing electrolysis while the surfaces of the welded portions are immersed in an acidic solution to form an oxide film; and
forming gas flow paths by joining the corrosion-resistant coating layers of the metal separators on each side of first and second surfaces of a membrane electrode assembly, the membrane electrode assembly including electrode catalyst layers and an electrolyte membrane between the electrode catalyst layers.
5. The method of producing a fuel cell stack according to claim 4, further comprising a step of: before the step of forming the temperature control medium flow path, removing an oxide film on the portions to be joined.
6. The method of producing a fuel cell stack according to claim 5, wherein the oxide film is removed by immersing the portions to be joined in a solution and applying a predetermined potential to the metal separators.
7. The method of producing a fuel cell stack according to claim 5, wherein the oxide film is removed by grinding the oxide film on the portions to be joined.
8. The method of producing a fuel cell stack according, to claim 4, wherein the temperature control medium flow path is formed while the portions to be joined are compressed.
9. The method of producing a fuel cell stack according to claim 4, wherein, before the step of forming the temperature control medium flow path, the metal separator disposed at a cathode side of the membrane electrode assembly is heated.
10. The method of producing a fuel cell stack according to claim 4, wherein, in the step of forming the temperature-control medium flow path, the metal separator disposed at a cathode side is irradiated with a laser beam at a high output sufficient to form the welded portions, and the corrosion-resistant treatment is then performed by irradiating the laser beam with a reduced output on the surfaces of the welded portions.
11. The method of producing a fuel cell stack according to claim 10, wherein, in the step of forming the temperature-control medium flow path, the metal separator disposed at the cathode side is irradiated with a laser beam to form the welded portions, and the corrosion-resistant treatment is then performed by irradiating the laser beam on the surfaces of the welded portions while the focusing area of the laser beam is expanded.