1. Apparatus for supplying heated replacement air to a process in which air is exhausted, said apparatus comprising
an air intake connected to an injection chamber from which a desired volume of replacement air flows to the process,
a source of BTU energy positioned outside said injection chamber and configured to inject heated gas into said injection chamber;
at least one process fan configured to:
i) draw replacement air through said air intake and into said injection chamber, and
ii) deliver a predetermined and adjustable volume of the heated replacement air to the process, wherein the volume of the heated replacement air does not affect the products of combustion of the BTU energy that is injected; and,
an adjustable mode changing damper configured to be movable between a first position wherein replacement air from a first location is drawn by said at least one fan from said air intake into said injection chamber and a second position wherein air from a second location is drawn by said at least one fan into said injection chamber.
2. Apparatus for supplying heated replacement air to a process in which air is exhausted, said apparatus comprising
an air intake connected to an injection chamber for supplying a desired volume of replacement air to the process;
a source of BTU energy positioned outside said injection chamber and configured to inject heated gas into said injection chamber,
at least one fan configured to:
i) draw replacement air through said air intake and into said injection chamber,
II) mix the heated gas with the replacement air to blend the heated replacement air, and
iii) deliver a predetermined and adjustable volume of the heated replacement air to the process, wherein the volume of the heated replacement air is substantially the same volume as the exhaust air from the process; and
a mode changing damper having: i) a first position wherein replacement air from a first location is drawn by said at least one fan from said air intake into said injection chamber, and II) a second position wherein air from a second location is drawn by said at least one fan into said injection chamber across a movable indirect heat exchanger mounted in said injection chamber,
said indirect heat exchanger being in said first position when said damper is in said first position and heated gas is injected directly into replacement air drawn through said injection chamber, and
said indirect heat exchanger being in said second position when said damper is in said second position and heated gas flows through said indirect heat exchanger and replacement air is drawn through said injection chamber and is indirectly heated by said indirect heat exchanger.
3. Apparatus for supplying heated replacement air to a process, as set forth in claim 1, further including a mixing device located between said injection chamber and said at least one fan.
4. Apparatus for supplying heated replacement air to a process, as set forth in claim 2, and further including
an indirect heat exchanger mounted in said injection chamber to move between first and second positions,
wherein when said indirect heat exchanger is in said first position heated gas is injected directly into replacement air drawn through said injection chamber, and
wherein when said indirect heat exchanger is in said second position heated gas flows through said indirect heat exchanger and replacement air drawn through said injection chamber and is indirectly heated by said indirect heat exchanger.
5. Apparatus for supplying heated replacement air to a process, as set forth in claim 4, and further including an adjustable intake damper mounted between said air intake and said injection chamber; said adjustable intake damper having a position permitting an unrestricted flow of air from the first location through said air intake when said mode changing damper is in its first position and said intake damper blocking air flow from the first location through said air intake when said mode changing damper is in its second position.
6. Apparatus for supplying heated replacement air to a process, as set forth in claim 5, and wherein said source of heated gas is a gas burner, said gas burner including a blower connected to develop a proper air-to-fuel ratio and blow hot combustion gases from said gas burner into said injection chamber thereby preventing a change in the volume of replacement air from affecting the products of combustion.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A heat sink for use with an axial flow fan comprising:
a core having a central axis; and
a plurality of cooling fins arranged about the core, each fin having a base and a tip, wherein the bases are coupled to the core substantially parallel to the central axis, wherein the fins are shaped to capture a tangential component of air from the fan, and wherein an upper portion of each of the fins is bent towards the tangential component.
2. The heat sink recited in claim 1, wherein the core comprises a central cavity to receive a thermal plug formed of a material having a high thermal conductivity.
3. The heat sink recited in claim 1, wherein the core has a circular or semi-rectangular shape.
4. The heat sink recited in claim 1, wherein the fin tips define a face having a periphery, wherein the face is to thermally contact an electronic component, and wherein the face comprises inter-fin openings.
5. The heat sink recited in claim 4, wherein the periphery of the face has a semi-rectangular shape.
6. A heat sink for use with an axial flow fan comprising:
a core having a central axis; and
a plurality of cooling fins arranged about the core, each fin having a base and a tip, wherein the bases are coupled to the care substantially parallel to the central axis, wherein the fins are shaped to capture a tangential component of air from the fan, wherein the core is shaped to maximize the number of fins while maintaining a substantially uniform aspect ratio in the fins, and wherein an upper portion of each of the fins is bent towards the tangential component.
7. The heat sink recited in claim 6 wherein the core comprises a central cavity to receive a thermal plug formed of a material having a high thermal conductivity.
8. The heat sink recited in claim 6, wherein the fin tips define a face having a periphery, wherein the face is to thermally contact an electronic component, and wherein the face comprises inter-fin openings.
9. The heat sink recited in claim 8, wherein the periphery of the face has a semi-rectangular shape.
10. An electronic assembly comprising:
a substrate;
an electronic component mounted on a surface of the substrate;
an axial flow fan to move air towards the substrate, the air having an axial component and a tangential component; and
a heat sink including
a first face in thermal contact with the electronic component;
a second face facing the fan;
a core having a central axis; and
a plurality of cooling fins arranged about the core, each fin having a base and a tip, wherein the bases are coupled to the core substantially parallel to the central axis, wherein the fins are shaped to capture both components of air, and wherein an upper portion of each of the fins is bent towards the tangential component.
11. The electronic assembly recited in claim 10, wherein the electronic component comprises an integrated circuit (IC).
12. The electronic assembly recited in claim 11, wherein the fins are formed of material having a high thermal conductivity, and wherein the aspect ratio of the fins is sufficient to maintain a junction temperature within the IC at or below a predetermined maximum value.
13. The electronic assembly recited in claim 10, wherein the fin tips define the first face, and wherein the first face comprises inter-fin openings.
14. An electronic system comprising:
a circuit board;
a processor integrated circuit (IC) mounted on the circuit board;
at least one chipset mounted on the circuit board and electrically coupled to the processor IC for operation in conjunction with the processor IC;
at least one axial flow fan to move air towards the circuit board, the air having both an axial component and a tangential component; and
at least one heat sink including
a first face in thermal contact with either the processor IC or the chipset;
a second face facing the at least one fan;
a core having a central axis; and
a plurality of cooling fins arranged about the core, each fin having a base and a tip, wherein the bases are coupled to the core substantially parallel to the central axis, wherein the fins are shaped to capture both components of air, wherein the core is shaped to maximize the number of fins while maintaining a substantially uniform aspect ratio in the fins, and wherein an upper portion of each of the fins is bent towards the tangential component.
15. The electronic system recited in claim 14, wherein the fins are formed of material having a high thermal conductivity, and wherein the aspect ratio of the fins is sufficient to maintain a junction temperature within the IC at or below a predetermined maximum value.
16. The electronic system recited in claim 14, wherein the fin tips define the first face, and wherein the first face comprises inter-fin openings.
17. A heat sink comprising:
a core having a central axis, and having a surface to thermally contact a heat-generating electrical component;
a plurality of cooling fins arranged about the core, each fin having a base and a tip, wherein the bases are coupled to the core substantially parallel to the central axis, and wherein an upper portion of each of the fins is bent in the same relative direction; and
a first face having a periphery defined by the fin tips, wherein the first face is to face the component, and wherein the first face comprises inter-fin openings.
18. The heat sink recited in claim 17, wherein the inter-fin openings extend from the base to the tip of selected fins.
19. The heat sink recited in claim 17, wherein the periphery of the first face has a semi-rectangular shape.
20. The heat sink recited in claim 17, wherein the first face substantially matches the shape of the core.
21. The heat sink recited in claim 17, wherein the electronic component is to comprise an integrated circuit (IC).
22. The heat sink recited in claim 21, wherein the fins are formed of material having a high thermal conductivity, and wherein the aspect ratio of the fins is sufficient to maintain a junction temperature within the IC at or below a predetermined maximum value.
23. A heat sink comprising:
a core having a central axis, and having a surface to thermally contact a heat-generating electrical component;
a plurality of cooling fins arranged about the core, each fin having a base and a tip, wherein the bases are coupled to the core substantially parallel to the central axis, wherein each fin comprises a vertical portion and an angled portion, and wherein the angled portion of each fin is bent in the same relative direction; and
a first face having a periphery defined by the fin tips, wherein the first face is to face the component, and wherein the first face comprises inter-fin openings.
24. The heat sink recited in claim 23, wherein the inter-fin openings extend from the base to the tip of selected fins.
25. The heat sink recited in claim 23, wherein the periphery of the first face has a semi-rectangular shape.
26. The heat sink recited in claim 23, wherein the first face substantially matches the shape of the core.
27. The heat sink recited in claim 23, wherein the electronic component is to comprise an integrated circuit (IC).
28. The heat sink recited in claim 27, wherein the fins are formed of material having a high thermal conductivity, and wherein the aspect ratio of the fins is sufficient to maintain a junction temperature within the IC at or below a predetermined maximum value.