1. A protector holding end portions of opposing corrugated tubes receiving an electrical wire or a bundle of electrical wires thereof, the protector comprising:
a pair of tube holding portions which hold the end portions of the corrugated tubes; and
an electrical wire receiving portion
which receives the electrical wire or the bundle of the electrical wires exposed from the end portions of the corrugated tubes and
which formed between the pair of the tube holding portions,
wherein the corrugated tubes are without slit and the protector is fixed on a vehicle underfloor,
wherein a drainage hole for discharging water is formed at the electrical wire receiving portion and penetrates therethrough, and a penetration direction of the drainage hole is set toward a rear of the vehicle.
2. The protector as claimed in claim 1, wherein the drainage hole is formed so as to gradually slope from the electrical wire receiving portion toward the ground.
3. A wire harness comprising:
a protector having the drainage hole described in claim 1;
a corrugated tube held in the protector and formed into a shape without slit; and
an electrical wire or a bundle thereof which is received in the corrugated tube,
wherein a body under floor of a vehicle is included at a arranged object position.
4. The wire harness as claimed in claim 3, wherein the corrugated tube is a plastic flat-corrugated tube having insulation performance, and a cross-section shape thereof is formed into a noncircular- shaped.
5. The wire harness as claimed in claim 3, wherein the drainage hole is arranged with a position which is closest to the ground when arranging at the body under floor.
6. The wire harness as claimed in claim 3, wherein the protector is arranged at a position with which an arrangement direction of the electrical wire or the bundle of the electrical wire is changed.
7. A wire harness comprising:
a protector having the drainage hole described in claim 2;
a corrugated tube held in the protector and formed into a shape without slit; and
an electrical wire or a bundle thereof which is received in the corrugated tube,
wherein a body under floor of a vehicle is included at a arranged object position.
8. The wire harness as claimed in claim 7, wherein the corrugated tube is a plastic flat-corrugated tube having insulation performance, and a cross-section shape thereof is formed into a noncircular- shaped.
9. The wire harness as claimed in claim 4, wherein the drainage hole is arranged with a position which is closest to the ground when arranging at the body under floor.
10. The wire harness as claimed in claim 7, wherein the drainage hole is arranged with a position which is closest to the ground when arranging at the body under floor.
11. The wire harness as claimed in claim 8, wherein the drainage hole is arranged with a position which is closest to the ground when arranging at the body under floor.
12. The wire harness as claimed in claim 4, wherein the protector is arranged at a position with which an arrangement direction of the electrical wire or the bundle of the electrical wire is changed.
13. The wire harness as claimed in claim 5, wherein the protector is arranged at a position with which an arrangement direction of the electrical wire or the bundle of the electrical wire is changed.
14. The wire harness as claimed in claim 7, wherein the protector is arranged at a position with which an arrangement direction of the electrical wire or the bundle of the electrical wire is changed.
15. The wire harness as claimed in claim 8, wherein the protector is arranged at a position with which an arrangement direction of the electrical wire or the bundle of the electrical wire is changed.
16. The wire harness as claimed in claim 10, wherein the protector is arranged at a position with which an arrangement direction of the electrical wire or the bundle of the electrical wire is changed.
17. The wire harness as claimed in claim 11, wherein the protector is arranged at a position with which an arrangement direction of the electrical wire or the bundle of the electrical wire is changed.
18. The protector as claimed in claim 1, wherein the drainage hole is formed by three surfaces.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A package structure comprising:
a first die;
a second die over and bonded to the first die, wherein the second die has a size smaller than a size of the first die;
a dummy chip over the first die, wherein the dummy chip comprises a portion encircling the second die, wherein the dummy chip comprises a material selected from the group consisting essentially of silicon and a metal, wherein the dummy chip comprises an opening extending from a bottom surface to an intermediate level of the dummy chip, wherein a portion of the dummy chip covers the opening, and wherein the second die extends into the opening;
an adhesive adhering the dummy chip to the first die;
metal pillars extending from a top surface to a bottom surface of the dummy chip;
a gap in the opening and horizontally between a sidewall of the second die and a sidewall of the dummy chip; and
a thermally conductive material horizontally between and contacting the dummy chip and the second die, wherein the thermally conductive material is in physical contact with the sidewall of the second die and the sidewall of the dummy chip.
2. The package structure of claim 1, wherein the dummy chip is a dummy silicon chip.
3. The package structure of claim 1, wherein the first die is an interposer die substantially free from active devices.
4. The package structure of claim 3 further comprising a third die bonded to the interposer die, wherein the second die and the third die are on opposite sides of the interposer die.
5. The package structure of claim 4 further comprising solder bumps on a surface of the interposer die, wherein the solder bumps and the third die are on a same side of the interposer die.
6. The package structure of claim 4 further comprising a dummy silicon die bonded to the interposer die, wherein the dummy silicon die and the second die are on opposite sides of the interposer die, and wherein the dummy silicon die comprises an opening, with the third die being in the opening.
7. The package structure of claim 6 further comprising solder bumps on a side of the dummy silicon die and electrically connected to through-silicon vias in the dummy silicon die, wherein the interposer die and the solder bumps are on opposite sides of the dummy silicon die.
8. The package structure of claim 1, wherein the first die comprises active devices.
9. The package structure of claim 1, wherein the dummy chip is a dummy metal chip.
10. The package structure of claim 1, wherein the dummy chip comprises an opening extending from a top surface to a bottom surface of the dummy chip, with the second die extending into the opening.
11. The package structure of claim 1, wherein the thermally conductive material forms a ring encircling the second die.