What is claimed is:
1. A method for forming a predetermined resist pattern on the surface of a substrate coated with an undercoat, comprising the steps of:
(a) detecting a light reflectivity of the undercoat;
(b) coating the substrate with a resist based upon a first condition;
(c) exposing the substrate coated with the resist based upon a second condition;
(d) developing the exposed substrate based upon a third condition; and
(e) controlling at least one of the first, second and third condition based upon the detected reflectivity.
2. The method as set forth in claim 1,
further comprising a step of predetermining the relation between the reflectivity and at least one of the first, second and third condition,
wherein said step (e) controls at least one of the first, second and third condition based upon said relation.
3. The method as set forth in claim 1,
wherein said step (b) includes a step of supplying a resist solution on the substrate while rotating the substrate, and
wherein said first condition is the rotation speed.
4. The method as set forth in claim 1,
wherein said second condition is the exposure time when exposing the substrate.
5. The method as set forth in claim 3,
wherein said third condition is the developing time when developing the substrate.
6. A method for forming a predetermined resist pattern on a substrate coated with a predetermined undercoat, by coating a resist, exposing and developing, comprising the steps of:
(a) forming said predetermined undercoat on a substrate for measurement along with said substrate;
(b) coating a resist on the measurement substrate;
(c) exposing the measurement substrate, to find out the exposure energy needed and sufficient for the resist to be fully exposed; and
(d) performing a predetermined process based upon the exposure energy determined.
7. The method as set forth in claim 6,
wherein the step (d) includes a step of judging whether or not to process the substrate, according to the value of said exposure energy.
8. The method as set forth in claim 6,
wherein the step (d) includes a step of exposing and developing the substrate, with the processing conditions changed according to the value of said exposure energy.
9. The method as set forth in claim 6,
wherein the step (c) includes a step of exposing the measurement substrate for several times, changing the exposure level according to the predetermined exposure position, and then developing it to find out the exposure energy.
10. The method as set forth in claim 9,
wherein the exposure level is changed, by changing the exposure time.
11. The method as set forth in claim 6,
wherein the step (c) includes a step of measuring the thickness of a resist film with a film thickness measuring unit after said development, and finding out the exposure energy from the exposure energy of the position where the film thickness is zero.
12. The method as set forth in claim 1, further comprising the steps of:
(f) forming the predetermined undercoat on the measurement substrate, along with said substrate;
(g) coating a resist on the measurement substrate;
(h) exposing the measurement substrate, and finding out the exposure energy needed and sufficient for the resist to be fully exposed; and
(i) performing the predetermined process based upon the exposure energy determined.
13. An apparatus for forming a predetermined resist pattern on a substrate coated with an undercoat, the apparatus comprising:
means for detecting a light reflectivity of the undercoat;
means for coating the resist on the substrate based upon a first condition;
means for exposing the substrate coated with the resist based upon a second condition;
means for developing the exposed substrate based upon a third condition; and
means for controlling at least one of the first, second and third conditions based upon the detected reflectivity.
14. The apparatus as set forth in claim 13,
further comprising a library with a predetermined relation between the reflectivity and at least one of the first, second and third conditions,
wherein the controlling means controls at least one of the first, second and third conditions based upon the relation determined in the library.
15. The apparatus as set forth in claim 14,
wherein said coating means supplies a resist solution on the substrate while rotating the substrate, and said first condition is the rotation speed of the substrate.
16. The apparatus as set forth in claim 14,
wherein said second condition is the exposure time when exposing the substrate.
17. The apparatus as set forth in claim 14,
wherein said third condition is the developing time when developing the substrate.
18. The apparatus as set forth in claim 14, further comprising:
means for forming the predetermined undercoat on the measurement substrate along with said substrate;
means for coating the resist on the measurement substrate;
means for exposing the measurement substrate, to find out the exposure energy needed and sufficient for the resist to be fully exposed; and
means for performing the predetermined process based upon the exposure energy determined.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1.-13. (canceled)
14. A process for producing a silicate foam, which comprises the steps:
(a) partial hydrolysis of an aqueous dispersion of SiO2 particles which have an average particle diameter in the range from 1 to 100 nm by means of a strong base,
(b) adding a surfactant and a blowing agent and dispersion of the blowing agent at temperatures below 50\xb0 C.,
(c) foaming of the mixture by heating to a temperature in the range from 35 to 100\xb0 C. or by depressurization,
(d) stabilizing the foam obtained in step c) by means of an acidic gas or aerosol,
(e) sintering of the foam at a temperature above 500\xb0 C.
15. The process according to claim 14, wherein said strong base is sodium hydroxide, potassium hydroxide or lithium hydroxide.
16. The process according to claim 15, wherein the partially hydrolyzed aqueous dispersion in step a) has a molar ratio of SiO2:Me2O of less than 50:1, where Me is an alkali metal.
17. The process according to claim 14, wherein said surfactant is an alkyl ether sulfate or alkyl ether phosphate.
18. The process according to claim 14, wherein said blowing agent is a C4-C8-hydrocarbon.
19. The process according to claim 16, wherein said surfactant is an alkyl ether sulfate or alkyl ether phosphate and said blowing agent is a C4-C8-hydrocarbon.
20. The process according to claim 14, wherein starch or modified cellulose is added to the aqueous dispersion of SiO2 particles.
21. The process according to claim 14, wherein the foam is treated with a solution of alkoxysilanes before or after step d).
22. The process according to claim 14, wherein the stabilization in step d) is effected by treatment with gaseous carbon dioxide as hardener.
23. The process according to claim 19, wherein starch or modified cellulose is added to the aqueous dispersion of SiO2 particles.
24. The process according to claim 23, wherein the foam is treated with a solution of alkoxysilanes before or after step d).
25. The process according to claim 24, wherein the stabilization in step d) is effected by treatment with gaseous carbon dioxide as hardener.
26. A silicate foam which has a density of less than 25 kgm3 and a proportion of open cells in accordance with DIN ISO 4589 of more than 50% and which can be obtained by the process according to claim 14.
27. The silicate foam according to claim 26, wherein the average pore diameter is in the range from 10 to 1000 \u03bcm.
28. Thermal or acoustic insulation which comprises the silicate foam according to claim 26.
29. A process for cleaning or for polishing which comprises utilizing the silicate foam according to claim 26.