1. A photoelectric integrated circuit device, comprising:
a substrate including an electronic device region and an on die optical inputoutput device region, the substrate having a trench in the on die optical inputoutput device region;
a lower clad layer in the trench, the lower clad layer having an upper surface lower than a surface of the substrate;
a core on the lower clad layer;
an insulating pattern on the core;
an optical detection pattern on the insulating pattern, the optical detection pattern having at least a portion provided in the trench; and
at least one transistor on the electronic device region.
2. The photoelectric integrated circuit device of claim 1, wherein the optical detection pattern is spaced apart from sidewalls of the trench in a direction crossing where the core extends.
3. The photoelectric integrated circuit device of claim 1, wherein the optical detection pattern has an upper surface having a same height as the surface of the substrate.
4. The photoelectric integrated circuit device of claim 1, wherein the substrate is a bulk silicon wafer.
5. The photoelectric integrated circuit device of claim 1, further comprising:
an upper clad layer covering the substrate on which the optical detection pattern is provided.
6. The photoelectric integrated circuit device of claim 5, further comprising:
at least one electrode penetrating the upper clad layer to be electrically connected to the optical detection pattern.
7-15. (canceled)
16. A photoelectric integrated circuit device, comprising:
a substrate including an on die optical inputoutput device region, the substrate having a trench in the on die optical inputoutput device region; and
at least a portion of an optical detection pattern in the trench, the optical detection pattern having an upper surface a same height as the surface of the substrate.
17. The photoelectric integrated circuit device of claim 16, wherein the substrate includes an electronic device region, further comprising:
a lower clad layer in the trench, the lower clad layer having an upper surface lower than a surface of the substrate;
a core on the lower clad layer;
an insulating pattern on the core;
the optical detection pattern on the insulating pattern; and
at least one transistor on the electronic device region.
18. The photoelectric integrated circuit device of claim 16, wherein the optical detection pattern is spaced apart from sidewalls of the trench.
19. The photoelectric integrated circuit device of claim 16, further comprising:
an upper clad layer covering the substrate on which the optical detection pattern is provided; and
at least one electrode penetrating the upper clad layer to be electrically connected to the optical detection pattern.
20. The photoelectric integrated circuit device of claim 16, wherein the substrate is a bulk silicon wafer.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of decoding an audio signal performed by an audio decoding system, comprising:
receiving the audio signal, the audio signal including at least one frame, the frame comprising at least one time slot and at least one parameter set;
determining a frame type of the audio signal, the frame type indicating that an interval of a time slot to which a corresponding parameter set is applied is variable distant,
when the frame type indicates that the interval of the time slot is variable distant, performing operations comprising:
extracting a number of time slots and a number of parameter sets from the audio signal to identify time slot information, the time slot information indicating a time slot to which a parameter set is applied;
determining a bit length of the time slot information, the bit length being variable according to the number of time slots and the number of parameter sets; and
extracting the time slot information based on the bit length, wherein a number of the time slot information is equal to the number of parameter sets; and
decoding the audio signal based on the time slot information and the corresponding parameter sets,
wherein the time slot information includes an absolute value indicating a time slot to which a first parameter set is applied or a difference value indicating a time slot to which a following parameter set of the first parameter set is applied, wherein the time slot to which the following parameter set is applied is determined by adding the difference value to previous time slot information associated with a previous parameter set.
2. The method of claim 1, wherein the time slot information is position information indicating a position of the time slot to which the parameter set is applied.
3. An apparatus of decoding an audio signal, the apparatus comprising:
an interface for receiving the audio signal, the audio signal including a downmix signal and spatial information, the spatial information including at least one frame, the frame comprising at least one time slot and at least one parameter set; and
a processor comprising:
a spatial information decoding unit configured to determine a frame type of the audio signal, the frame type indicating that an interval of a time slot to which a corresponding parameter set is applied is variable distant, wherein when the frame type indicates that the interval of the time slot is variable distant, the spatial information decoding unit is configured to perform operations comprising:
extracting a number of time slots and a number of parameter sets from the audio signal;
identifying time slot information, the time slot information indicating a time slot to which a parameter set is applied;
determining a bit length of the time slot information, the bit length being variable according to the number of time slots and the number of parameter sets; and
extracting the time slot information based on the bit length, wherein a number of the time slot information is equal to the number of parameter sets;
a downmix signal decoding unit configured to decode the downmix signal; and
a multi-channel generating unit configured to generate multi-channel audio signal using the time slot information and the corresponding parameter sets,
wherein the time slot information includes an absolute value indicating a time slot to which a first parameter set is applied or a difference value indicating a time slot to which a following parameter set of the first parameter set is applied, and wherein the time slot to which the following parameter set is applied is determined by adding the difference value to previous time slot information associated with a previous parameter set.
4. The apparatus of claim 3, wherein the time slot information is position information indicating a position of the time slot to which the parameter set is applied.