1. An apparatus comprising:
a semiconductor substrate having a non-metal silicon-based semiconductor surface; and
a reactive solder material bonded to said surface of said semiconductor substrate, said reactive solder material including:
a base solder material consisting of indium; and
an active element material alloyed with the base solder material, wherein the active material is less than about 2% of the reactive solder material and wherein the active element material is selected from the group consisting of hafnium, cerium, titanium, lutetium, iron, cobalt, magnesium, and strontium.
2. The apparatus of claim 1 wherein said semiconductor surface is a backside surface of one of a wafer and a die.
3. The apparatus of claim 2 wherein said die is of a semiconductor package, said semiconductor package including a sealant adjacent a perimeter of said die.
4. The apparatus of claim 3 wherein said sealant is of a material that includes one of a polymer and said reactive solder material.
5. The apparatus of claim 1 wherein said reactive solder material is to bond to said semiconductor surface with a bong strength up to about 2000 psi.
6. An apparatus comprising:
a semiconductor substrate having a non-metal silicon-based semiconductor surface;
a thermal management device; and
a reactive solder material bonded to said semiconductor surface and said thermal management device, said reactive solder material being bonded to said semiconductor substrate at only said non-metal silicon-based semiconductor surface and to act as an interface between said semiconductor substrate and said thermal management device, wherein said reactive solder material comprises:
a base solder material consisting of indium; and
an active element material alloyed with the base solder material, wherein the active material is less than about 2% of the reactive solder material and wherein the active element material is selected from the group consisting of hafnium, cerium, titanium, lutetium, iron, cobalt, magnesium, and strontium.
7. The apparatus of claim 6 wherein said semiconductor surface is a surface on one of a wafer and a die and said thermal management device comprises one of an integrated heat spreader and a heat sink.
8. A semiconductor package, comprising:
a package substrate having a plurality of conductive pads on an upper surface thereof;
a semiconductor die attached to the upper surface of the package substrate, the semiconductor die having a first surface with a plurality of conductive bumps thereon and a second surface that is not metallized, the conductive bumps begin in contact with the conductive pads on the upper surface of the package substrate;
a heat spreader positioned over the semiconductor die; and
a reactive solder material bonded to the semiconductor die and the heat spreader, the reactive solder material including:
a base solder consisting of indium, wherein the base solder is greater than about 98% and less than 100% of the reactive solder material, and
an active element material alloyed with the base solder material, wherein the active material is less than about 2% of the reactive solder material and wherein the active element material is selected from the group consisting of hafnium, cerium, titanium, lutetium, iron, cobalt, magnesium, and strontium.
9. An apparatus comprising:
a semiconductor substrate having a non-metal silicon-based semiconductor surface; and
a reactive solder material bonded to said surface of said semiconductor substrate, said reactive solder material comprising:
a base solder material consisting of indium, wherein the base solder is greater than about 98% and less than 100% of the reactive solder material, and
an active element material alloyed with the base solder material, wherein the active materials is less than about 2% of the reactive solder material and wherein the active element material is selected from the group consisting of hafnium, cerium, titanium, lutetium, iron, cobalt, magnesium, and strontium.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An apparatus, comprising:
an optical receiver for receiving a modulated optical carrier comprising a polarization-multiplexed (PMUX) return-to-zero (RZ) pulse stream having first and second polarization components bearing respective first and second phase-shift keying (PSK) modulated data streams, the optical receiver comprising:
a first polarization-independent optical delay interferometer (ODI) to provide an optical signal associated with in-phase data tributaries of each of said first and second PSK modulated data streams to a first balanced optical detector;
a first electrical decision circuit, coupled to said first balanced optical detector, for extracting said in-phase data tributaries of each of said first and second PSK modulated data streams;
a second polarization-independent ODI to provide an optical signal associated with quadrature-phase data tributaries of each of said first and second PSK modulated data streams to a second balanced optical detector; and
a second electrical decision circuit, coupled to said second balanced optical detector, for extracting said quadrature-phase data tributaries of each of said first and second PSK modulated data streams.
2. The apparatus of claim 1, further comprising an optical transmitter configured to split a RZ pulse stream having a duty cycle not exceeding 50% into first and second orthogonal polarization components to provide respective first and second optical signals of orthogonal polarization, modulate respective data streams onto the first and second optical signals using phase-shift keying (PSK) modulation, and combine the modulated optical signals to provide said modulated optical carrier.
3. The apparatus of claim 1, wherein at least one of the first and second phase-shift keying (PSK) modulated data streams comprises a differential quadrature phase-shift keying (DQPSK) modulated data stream.
4. The apparatus of claim 1, wherein at least one of the first and second phase-shift keying (PSK) modulated data streams comprises a m-ary Phase Shift Keyed (mPSK) modulated data streams.
5. The apparatus of claim 1, wherein said first electrical decision circuit comprises:
an analog to digital (AD) converter having a sample rate twice the orthogonal polarization component symbol rate for providing a bitstream including multiplexed in-phase data tributaries of each of said first and second PSK modulated data streams; and
a de-interleaver, for demultiplexing said in-phase data tributaries of each of said first and second PSK modulated data streams.
6. The apparatus of claim 5, wherein said optical receiver further comprises a digital signal processor (DSP), coupled to said first and second de-interleavers to process demultiplexed in-phase and quadrature-phase data tributaries of each of said first and second PSK modulated data streams to recover respective first and second data streams therefrom.
7. The apparatus of claim 2, further comprising an all-optical transmission line connecting the optical transmitter to the optical receiver.
8. The apparatus of claim 2, wherein the optical transmitter further comprises a pulse carver configured to generate the stream of RZ pulses from a continuous wave optical carrier.
9. The apparatus of claim 8, wherein the pulse carver is configured to generate RZ pulses having a pulse period substantially matching a symbol period Ts of said first and second orthogonal polarization components.
10. The apparatus of claim 1, wherein the receiver further comprises:
a power divider responsive to said modulated optical carrier signal, for providing thereby first and second divided signals to, respectively, first and second ODIs.
11. The apparatus of claim 2, wherein the optical transmitter comprises:
a first modulator, for modulating first and second digital data streams onto a first orthogonal polarization component; and
a second modulator, for modulating third and fourth digital data streams onto a second orthogonal polarization component.
12. The apparatus of claim 11, the optical transmitter further comprising:
a third modulator, for modulating digital data onto one or both of the first and second orthogonal polarization components according to a phase modulation format.
13. A method, comprising:
receiving a modulated optical carrier comprising a polarization-multiplexed (PMUX) return-to-zero (RZ) pulse stream having first and second polarization components bearing respective first and second phase-shift keying (PSK) modulated data streams;
processing said modulated optical carrier using a first polarization-independent optical delay interferometer (ODI) and a first balanced optical detector to provide a first detected output signal including in-phase data tributaries of each of said first and second PSK modulated data streams;
extracting from said first detected output signal said in-phase data tributaries of each of said first and second PSK modulated data streams;
processing said modulated optical carrier using a second polarization-independent optical delay interferometer (ODI) and a second balanced optical detector to provide a second detected output signal including quadrature-phase data tributaries of each of said first and second PSK modulated data streams; and
extracting from said second detected output signal said quadrature-phase data tributaries of each of said first and second PSK modulated data streams.
14. The method of claim 13, further comprising
splitting a RZ (return-to zero) pulse stream having a duty cycle not exceeding 50% into first and second orthogonal polarization components to provide respective first and second optical signals of orthogonal polarization;
modulating respective data streams onto the first and second optical signals using phase-shift keying (PSK) modulation; and
combining the modulated optical signals to provide said modulated optical carrier.
15. A system, comprising:
an optical transmitter configured to split a RZ (return-to zero) pulse stream having a duty cycle not exceeding 50% into first and second orthogonal polarization components to provide respective first and second optical signals of orthogonal polarization, modulate respective data streams onto the first and second optical signals using phase-shift keying (PSK) modulation; and combining the modulated optical signals to provide a modulated optical carrier; and
an optical receiver connected to receive the modulated optical carrier from the optical transmitter, extract in-phase data tributaries of each of said first and second PSK modulated data streams via first circuit elements comprising a first polarization-independent optical delay interferometer (ODI), a first balanced optical detector and a first electrical decision circuit, and extract quadrature-phase data tributaries of each of said first and second PSK modulated data streams via second circuit elements comprising a second polarization-independent ODI, a second balanced optical detector and a second electrical decision circuit.