What is claimed is:
1. An adhesive construction comprising:
(a) a flexible substrate defining a having a first side;
(b) a first adhesive field comprising pressure sensitive adhesive;
(i) the first adhesive field being a discontinuous pattern of adhesive with adhesive covering no more than 80% of an area of a portion of the first side of the flexible substrate defined by the first adhesive field; the area of a portion of the first side of the flexible substrate defined by the first adhesive field being at least 10 sq. nm. and,
(c) a second adhesive field comprising pressure sensitive adhesive;
(ii) the second adhesive field covering at least 90% of an area of a portion of the first side of the flexible substrate defined by the second adhesive field; the area of a portion of the first side of the flexible substrate defined by the second adhesive field being at least 10 sq. mm.
2. An adhesive construction according to claim 1 wherein:
(a) the flexible substrate defines an outer perimeter edge;
(b) the first adhesive field comprises an outer perimeter adhesive field positioned on the flexible substrate first side and adjacent the outer perimeter edge;
(i) the outer perimeter adhesive field having a width, in direction inwardly from the perimeter edge, of at least 0.8 mm.; and,
(c) the second adhesive field comprises an inner adhesive field spaced from the outer perimeter edge and completely surrounded by the outer perimeter adhesive field;
(i) the inner adhesive field comprising adhesive covering at least 95% of an area of the portion of the first side of the flexible substrate defined by the inner adhesive field.
3. An adhesive construction according to claim 2 wherein:
(a) the inner adhesive field comprises a continuous adhesive field over the area of the portion of the first side of the flexible substrate defined by the inner adhesive field.
4. An adhesive construction according to claim 3 including:
(a) an adhesive-free region on the first side of the flexible substrate;
(i) the adhesive-free region being completely surrounded by the inner adhesive field.
5. An adhesive construction according to claim 4 wherein:
(a) the adhesive-free region comprises at least 40% of a perimeter area defined by the flexible substrate outer perimeter edge.
6. An adhesive construction according to claim 5 wherein:
(a) the outer perimeter edge defines a rectangular pattern.
7. An adhesive construction according to claim 6 wherein:
(a) the adhesive-free region of the flexible substrate is transparent.
8. An adhesive construction according to claim 7 wherein:
(a) the outer perimeter adhesive field defines a rectangular frame.
9. An adhesive construction according to claim 8 wherein:
(a) the inner adhesive field defines a rectangular frame.
10. An adhesive construction according to claim 2 wherein:
(a) the outer perimeter edge has no segment of extension of greater than 8 mm., at which there is not adhesive on the substrate first side and immediately adjacent the outer perimeter edge.
11. An adhesive construction according to claim 11 wherein:
(a) the outer perimeter edge has no segment of extension of greater than 5 mm., at which there is not adhesive on the substrate first side and immediately adjacent the outer perimeter edge.
12. An adhesive construction according to claim 1 including:
(a) a release liner to which the flexible substrate is secured by the first adhesive field and the second adhesive field.
13. A roll of adhesive constructions; the roll comprising:
(a) an extension of release liner;
(b) at least 10 spaced adhesive constructions secured to the extension of release liner; each adhesive construction comprising:
(i) a flexible substrate having a first side;
(ii) a first adhesive field comprising pressure sensitive adhesive;
(A) the first adhesive field being a discontinuous pattern of adhesive with adhesive covering no more than 80% of an area of a portion of the first site of the flexible substrate defined by the first adhesive field; the area of a portion of the first side of the flexible substrate defined by the first adhesive field being at least 10 sq. mm.; and,
(iii) a second adhesive field comprising pressure sensitive adhesive;
(A) the second adhesive field covering at least 90% of an area of a portion of the first side of the flexible substrate defined by the second adhesive field; the area of a portion of the first side of the flexible substrate defined by the second adhesive field being at least 10 sq. mm.
14. A roll of adhesive constructions according to claim 13 wherein:
(a) the flexible substrate of each adhesive construction defines an outer perimeter edge;
(b) the first adhesive field of each adhesive construction comprises an outer perimeter adhesive field positioned on the associated flexible substrate first side and adjacent the outer perimeter edge;
(i) each outer perimeter adhesive field having a width, in direction inwardly from an associated perimeter edge, of at least 0.8 mm.; and,
(c) the second adhesive field of each adhesive construction comprises an inner adhesive field spaced from an associated outer perimeter edge and completely surrounded by an associated outer perimeter adhesive field;
(i) each inner adhesive field comprising adhesive covering at least 95% of an area of the portion of the first side of an associated flexible substrate defined by the inner adhesive field.
15. A roll of adhesive constructions according to claim 14 wherein:
(a) each inner adhesive field comprises a continuous adhesive covering over the area of an associated portion of the first side of the flexible substrate defined by that inner adhesive field.
16. A method of preparing an adhesive construction; said method including the steps of:
(a) preparing a laminate stock comprising a release liner layer secured to a flexible substrate layer, with an adhesive pattern of pressure sensitive adhesive therebetween;
(i) the adhesive pattern defining:
(A) a first adhesive field comprising a discontinuous pattern of adhesive with the adhesive covering no more than 80% of an area of a portion of a side of the flexible substrate layer defined by the first adhesive field; and,
(B) a second adhesive field comprising adhesive covering at least 90% of an area of a portion of a side of the flexible substrate layer defined by the second adhesive field;
(b) die cutting the laminate stock by cutting a die cut perimeter pattern completely through the flexible substrate layer but not completely through the release liner layer;
(i) the perimeter pattern being die cut through a region in overlap with adhesive in the first adhesive field and surrounding adhesive in the second adhesive field,
(ii) the step of die cutting defining:
(A) waste flexible substrate layer outside of the die cut perimeter pattern; and,
(B) a die cut adhesive construction within the die cut perimeter pattern; and,
(c) stripping the waste flexible substrate from the laminate stock, while leaving at least one die cut adhesive construction on the release liner layer.
17. A method according to claim 16 wherein:
(a) the second adhesive field is an inner adhesive field comprising adhesive covering at least 95% of the area of the portion of the flexible substrate layer defined by the second adhesive field; and,
(b) the first adhesive field is an outer perimeter adhesive field completely surrounding the first inner adhesive field.
18. A method according to claim 17 wherein:
(a) the adhesive pattern defines a first adhesive-free region completely surrounded by the second adhesive field.
19. A method according to claim 18 wherein:
(a) said step of die cutting comprises cutting to form a die cut perimeter pattern spaced at least 0.8 mm. from the inner adhesive field completely around the first inner adhesive field.
20. A method according to claim 19 wherein:
(a) said method comprises a process of generating a series of spaced adhesive constructions adhered to the release liner;
(i) each one of the series of spaced adhesive constructions comprising:
(A) a flexible substrate defining an outer perimeter edge; the flexible substrate having a first side;
(B) an outer perimeter adhesive field adjacent the outer perimeter edge;
(I) the outer perimeter adhesive field having a width, in direction inwardly from the perimeter edge, of at least 0.8 mm.;
(II) the outer perimeter adhesive field being a discontinuous pattern of adhesive with adhesive covering no more than 80% of an area of a portion of the first side of the flexible substrate defined by the outer perimeter adhesive field; and,
(C) an inner adhesive field spaced from the outer perimeter edge and completely surrounded by the outer perimeter adhesive field;
(I) the inner adhesive field comprising adhesive covering at least 95% of an area of a portion of the first side of the flexible substrate defined by the inner adhesive field; and,
(ii) each one of the series of spaced adhesive constructions being formed in a die cutting operation which involves cutting die cut perimeter patterns each of which is:
(A) completely through the flexible substrate layer but not completely through the release lines layer; and,
(B) cut through a region in overlap with adhesive in an outer perimeter adhesive field and surrounding and not in overlap with adhesive in an inner adhesive field.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A lithographic apparatus comprising:
an illumination system configured to condition a radiation beam;
a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam, the patterning device having upper and lower planar surfaces connected to each other by side faces;
a substrate table constructed to hold a substrate;
a projection system configured to project the patterned radiation beam onto a target portion of the substrate; and
a position controller configured to control a position of the patterning device in a direction substantially parallel to the planar surfaces of the patterning device by selectively pressing at least one of the side faces of the patterning device, the position controller including a gas pressure supply and one or more outflow openings directed towards the at least one of the side faces of the patterning device, the gas pressure supply and the one or more outflow openings configured to exert pressurized gas on the at least one of the side faces so as to control the position of the patterning device in the direction substantially parallel to the planar surfaces of the patterning device in a contactless manner.
2. The lithographic apparatus of claim 1, wherein the position controller includes at least one pair of opposing outflow openings that are directed towards opposite side faces of the patterning device so as to constrain the patterning device in a contactless manner between the pair of opposing outflow openings with pressurized gas.
3. The lithographic apparatus of claim 2, wherein the position controller includes at least two pairs of opposing outflow openings that are directed towards two pairs of opposite side faces of the patterning device so as to constrain the patterning device in a contactless manner between the two pairs of opposing outflow openings with pressurized gas.
4. The lithographic apparatus of claim 1, wherein the position controller includes one or more positioning elements that are arranged such that a gap is present between each positioning element and the patterning device, and wherein the one or more outflow openings open out in the gap.
5. The lithographic apparatus of claim 4, wherein the position controller includes a driver configured to position the one or more positioning elements in the direction substantially parallel to the planar surfaces relative to the patterning device support.
6. The lithographic apparatus of claim 5, wherein the position controller includes a plurality of positioning elements that are each mounted in a common frame which is moveable relative to the patterning device support, and wherein the driver configured to position the plurality of the positioning elements is directly coupled to the frame.
7. The lithographic apparatus of claim 6, wherein each of the positioning elements is flexibly mounted relative to the frame in order to flexibly adjust itself to irregularities in the respective side of the patterning device.
8. The lithographic apparatus of claim 6, wherein the frame extends around the entire circumference of the patterning device.
9. The lithographic apparatus of claim 5, wherein the driver includes a plurality of the positioning elements that are each individually moveable relative to the patterning device support, and wherein the driver configured to position the plurality of the positioning elements is directly coupled to each of the positioning elements individually.
10. The lithographic apparatus of claim 1, further comprising a gas bearing configured to keep the patterning device floating relative to a planar surface of the support.
11. The lithographic apparatus of claim 10, wherein the patterning device is held floating under the planar surface of the support.
12. The lithographic apparatus of claim 1, wherein the position controller includes a frame which extends around an entire circumference of the patterning device and arranged such that a gap is present between the frame and the patterning device, the outflow openings opening out in the gap in opposite positions directed towards opposite side faces of the patterning device so as to constrain the patterning device in a contactless manner between the outflow openings with pressurized gas, the position controller further comprising a driver configured to position the frame with the patterning device constrained therein in the planar direction relative to the patterning device support.
13. A lithographic apparatus comprising:
a projection system arranged to transfer a pattern from a patterning device onto a substrate;
a support constructed to support the patterning device, the patterning device having upper and lower planar surfaces connected to each other by side faces;
a substrate table constructed to hold the substrate; and
a position controller configured to control a position of the patterning device in a direction substantially parallel to the planar surfaces of the patterning device by selectively pressing at least one of the side faces of the patterning device, the position controller including a gas pressure supply and one or more outflow openings directed towards the at least one of the side faces of the patterning device, the gas pressure supply and the one or more outflow openings configured to exert pressurized gas on the at least one of the side faces so as to control the position of the patterning device in the direction substantially parallel to the planar surfaces of the patterning device in a contactless manner.
14. A device manufacturing method for projecting a patterned beam of radiation onto a substrate, comprising:
supporting a patterning device on a support, the patterning device having upper and lower planar surfaces connected to each other by side faces;
imparting a radiation beam using the patterning device to form a patterned radiation beam;
projecting the patterned radiation beam onto a target portion of the substrate; and
controlling a position of the patterning device in a direction substantially parallel to the planar surfaces, the controlling including
selectively pressing against at least one of the side faces of the patterning device by exerting pressurized gas on the at least one of the side faces of the patterning device using one or more outflow openings and a gas pressure supply so as to control the position of the patterning device in the direction substantially parallel to the planar surfaces of the patterning device in a contactless manner.
15. The method of claim 14, wherein the patterning device is constrained in a contactless manner between pressurized gas exerted out of at least one pair of opposing outflow openings which are directed towards opposite side faces of the patterning device.
16. The method of claim 15, wherein the patterning device is constrained in a contactless manner between pressurized gas exerted out of at least two pairs of opposing outflow openings which are directed towards two pairs of opposite side faces of the patterning device.