1. A movement adjusting device for adjusting movement of a disc drive which is movable by a mover unit between a first position at which a disc-shaped recording medium is attachable and detachable and a second position at which the disc-shaped recording medium is processed,
the movement adjusting device comprising:
a guide surface extending along a motion path of the disc drive;
a guide member which is provided on the disc drive and contacts the guide surface;
a biasing unit which biases the guide member in a direction in which the guide member is pressed toward the guide surface; and
a variable unit which increases a biasing force of the biasing unit when the disc drive is near the first and second positions;
wherein the biasing unit includes an elastic member which is elastically deformable; and
the variable unit increases the biasing force by increasing the elastic deformation of the biasing unit when the disc drive is near the first and second positions, whereby the biasing force is weakened by decreasing the elastic deformation of the biasing unit while moving the disc drive between the first position and the second position.
2. The movement adjusting device according to claim 1, wherein the variable unit shortens a distance between the guide surface and the guide member in a pressing direction thereof, when the disc drive is near the first and second position positions.
3. The movement adjusting device according to claim 2, wherein the variable unit is so provided that the guide surface is swollen in a pressing direction thereof to contact the guide member, when the disc drive is near the first and second positions.
4. The movement adjusting device according to claim 1, wherein the variable unit executes at least either reduction of the biasing force in accordance with increase in speed of movement of the disc drive by the mover unit or increase of the biasing force in accordance with decrease in speed of the disc drive by the mover unit.
5. The movement adjusting device according to claim 1, wherein the variable unit is so provided that the guide surface being in contact with the guide member is inclined toward the pressing direction thereof, corresponding to a period in which the speed of movement of the disc drive increases.
6. The movement adjusting device according to claim 1, wherein the disc drive is a processing device which executes at least one of operations of reading information recorded on a recording medium and recording information on the recording medium at the first and second positions.
7. The movement adjusting device according to claim 1, wherein the disc drive comprises a disc tray accepting the disc-shaped recording medium and the disc tray is movable in and out of the disc drive.
8. The movement adjusting device according to claim 7, wherein the disc tray is movable in a radial direction of the optical disc, and the mover unit moves the disc drive in a thickness direction of the optical disc.
9. A carrier device, comprising:
a mover unit which moves a disc drive between first position at which a disc-shaped recording medium is attachable and detachable and a second position at which the disc-shaped recording medium is processed; and
a movement adjusting device for adjusting movement of the disc drive, the movement adjusting device having:
a guide surface extending along a motion path of the disc drive;
a guide member which is provided on the disc drive and contacts the guide surface;
a biasing unit which biases the guide member in a direction in which the guide member is pressed toward the guide surface; and
a variable unit which increases a biasing force of the biasing unit when the disc drive is near the first and second positions;
wherein the biasing unit includes an elastic member which is elastically deformable; and
the variable unit increases the biasing force by increasing the elastic deformation of the biasing unit when the disc drive is near the first and second positions, whereby the biasing force is weakened by decreasing the elastic deformation of the biasing unit while moving the disc drive between the first position and the second position.
10. The movement adjusting device according to claim 9, wherein the disc drive comprises a disc tray accepting the disc-shaped recording medium and the disc tray is movable in and out of the disc drive.
11. The movement adjusting device according to claim 10, wherein the disc tray is movable in a radial direction of the optical disc, and the mover unit moves the disc drive in a thickness direction of the optical disc.
12. A movement adjusting method of adjusting movement of a disc drive which is movable between a first position at which a disc-shaped recording medium is attachable and detachable and a second position at which the disc-shaped recording medium is processed by a mover unit, the method comprising:
pressing a guide member provided on the disc drive to contact a guide surface extending along a motion path of the disc drive with a biasing force; and
increasing the biasing force by increasing the elastic deformation of a biasing unit when the disc drive is near the first and second positions, whereby the biasing force is weakened by decreasing the elastic deformation of the biasing unit while moving the disc drive between the first position and the second position.
13. The movement adjusting method according to claim 12, wherein the disc-shaped recording medium is attachable and detachable in a direction different from a direction of the motion between the first position and the second position.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An apparatus for testing substrates in multiple configurations, said apparatus comprising:
a tester configured to hold an assembly of a first substrate, a second substrate, and an interposer therebetween and to test a functionality of a combination of a first selected chip located in a first area of a first substrate and a second selected chip in a second area of a second substrate, wherein said second selected chip overlies or underlies said first selected chip; and
a rotational assembly that is configured to rotate said second substrate by an angle of 1N\xd72\u03c0 about a center axis of said second substrate at least (N\u22121) times, wherein N is an integer greater than 1.
2. The apparatus of claim 1, wherein said interposer includes a set of lower pads configured to contact first conductive structures located on said first selected chip and a set of upper pads configured to contact second conductive structures located on said second selected chip.
3. The apparatus of claim 2, wherein each of said lower pads is electrically connected to one of said upper pads by electrical wiring embedded in said interposer.
4. The apparatus of claim 2, wherein said set of lower pads, said set of upper pads, test pads on said first selected chip, and test pads on said second selected chip have a same pitch and a same spacing.
5. The apparatus of claim 1, wherein said interposer does not provide any rotation in electrical connections between said first and second substrates.
6. The apparatus of claim 1, wherein said interposer provides a rotation in electrical corrections between said first and second substrates by a rotational angle of (i\u22121)N\xd72\u03c0, wherein N is an integer greater than 1 and not greater than N.
7. The apparatus of claim 1, further comprising means for determining a configuration that provides a maximum stack chip yield among multiple stacked chip yields on a functionality that depends on both said first selected chip and said second selected chip, wherein said stacked chip yields are determined at N different configurations of said assembly corresponding to N different rotational angles between said first substrate and said second substrate.
8. The apparatus of claim 1, wherein said N is selected from 2, 3, 4, 5, and 6.
9. A method of manipulating substrates in multiple configurations, said method including:
testing an assembly of a first substrate, a second substrate, and an interposer therebetween and to test a functionality of a combination of a first selected chip located in a first area of a first substrate and a second selected chip in a second area of a second substrate, wherein said second selected chip overlies or underlies said first selected chip;
rotating said second substrate by an angle of 1N\xd72\u03c0 about a center axis of said second substrate (N\u22121) times; and
repeating said testing of said assembly of said first substrate, said second substrate, and said interposer after each rotation of said second substrate.
10. The method of claim 9, further comprising determining a maximum-yield rotational angle between said first and second substrates, wherein test yield on said assembly is at a maximum when said first and second substrate are rotated by said maximum stacked chip yield rotational angle.
11. The method of claim 9, wherein said testing of said assembly and said repetition of said testing are performed employing an apparatus comprising a tester and a rotational assembly, wherein said tester configured to hold said assembly, and said rotational assembly is configured to rotate said second substrate.
12. The method of claim 9, wherein said interposer includes a set of lower pads configured to contact first conductive structures located on said first selected chip and a set of upper pads configured to contact second conductive structures located on said second selected chip.
13. The method of claim 12, wherein each of said lower pads is electrically connected to one of said upper pads by electrical wiring embedded in said interposer.
14. The method of claim 12, wherein said set of lower pads, said set of upper pads, test pads on said first selected chip, and test pads on said second selected chip have a same pitch and a same spacing.
15. The method of claim 9, wherein said interposer does not provide any rotation in electrical connections between said first and second substrates.
16. The method of claim 9, wherein said interposer provides a rotation in electrical corrections between said first and second substrates by a rotational angle of (i\u22121)N\xd72\u03c0, wherein N is an integer greater than 1 and not greater than N.
17. The method of claim 9, wherein said first substrate includes first semiconductor chips that include said first selected chip, and said second substrate includes second semiconductor chips that include said second selected chip, wherein said first semiconductor chips are arranged to have an N-fold rotational symmetry around a center axis of said first substrate, and said second semiconductor chips are arranged to have an N-fold rotational symmetry around said center axis of said second substrate.
18. The method of claim 9, wherein said first substrate and said second substrate are configured to be bondable to form a plurality of stacked chips having a functionality that is not provided by chips in said first substrate alone or by chips in said second substrate alone.
19. The method of claim 9, further comprising bonding said first substrate and said second substrate in a configuration at a rotational angle that provides a maximized stacked chip yield.
20. The method of claim 9, wherein said N is selected from 2, 3, 4, 5, and 6.