1. A device (01, 14) for fastening an auxiliary part (19), in particular a targeting unit or the like, to a weapon, which has at least one ferromagnetic part, the device comprising a base plate (02, 15), to which the auxiliary part (19) may be fastened,
characterized in that
the device (01, 14) is fixed on the weapon by at least one magnet (04).
2. The device (01, 14) according to claim 1,
characterized in that
the device is fastened to a barrel (13) of the weapon.
3. The device (01, 14) according to claim 1,
characterized in that
the device is fastened to a barrel rail (20).
4. The device (01, 14) according to claim 1,
characterized in that
the magnet (04) is attached to the side of the base plate (02, 15) facing toward the barrel rail (20).
5. The device (01, 14) according to claim 1,
characterized in that
the magnet (04) is integrated or inlaid in the base plate (02, 15).
6. The device (01, 14) according to claim 1,
characterized in that
at least individual areas of the base plate (02, 15) comprise magnetic material.
7. The device (01, 14) according to claim 3,
characterized in that
diametrically opposite clamping jaws (06, 16), which at least regionally enclose the barrel rail (20), are provided laterally on the base plate (02, 15).
8. The device (01, 14) according to claim 7,
characterized in that
at least parts of the jaw faces of the clamping jaws (06, 16) andor parts of the side of the base plate (02, 15) facing toward the barrel rail (20) are provided with a friction-increasing layer (05), in particular a friction-increasing film.
9. The device (01, 14) according to claim 7,
characterized in that
at least one magnet (04) is attached in or on each clamping jaw (06, 16).
10. The device (01, 14) according to claim 7,
characterized in that
at least individual areas of the clamping jaws (06, 16) comprise magnetic material.
11. The device (01, 14) according to claim 1,
characterized in that
at least individual magnets (04) comprise magnetic film (17, 18).
12. The device (01, 14) according to claim 7,
characterized in that
the clamping jaws (06, 16) enclose partial areas of a barrel (13) of the weapon in a formfitting way.
13. The device (01, 14) according to claim 7,
characterized in that
the clamping jaws (06, 16) are mounted on the base plate (02, 15) so they are displaceable perpendicularly to the barrel rail direction, so that, in addition to the magnetic fixing of the device (01, 14) on the barrel rail (20), they may exert a removable mechanical clamping effect on the barrel rail (20) andor on the barrel (13) of the weapon.
14. The device (01, 14) according to claim 13,
characterized in that
the clamping jaws (06, 16) are mounted on the base plate (02, 15) by a dovetail guide (07, 12).
15. The device (01, 14) according to claim 13,
characterized in that
at least one clamping jaw (06, 16) may be clamped in a lockable way against the barrel rail (20) andor the barrel (13) of the weapon using a locking lever (03).
16. The device (01, 14) according to claim 1,
characterized in that
the base plate (02, 15) has at least one fastening element (09) for fastening andor position fixing of the auxiliary part (19) on the face facing toward the auxiliary part (19).
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor device comprising:
an insulating substrate having a circuit plate on a principal surface thereof;
a semiconductor element fixed to the circuit plate;
an external terminal having one end fixed to the circuit plate; and
a printed circuit board facing the principal surface of the insulating substrate, and having a through-hole for passing through the external terminal, wherein a rigidity of a peripheral region of the through-hole is lower than a rigidity of other regions.
2. The semiconductor device according to claim 1, further comprising a post electrode,
wherein the semiconductor element has an electrode on a front surface thereof, and
the post electrode has one end fixed to the electrode of the semiconductor element and another end fixed to the printed circuit board.
3. The semiconductor device according to claim 1, wherein the peripheral region is formed with a slit.
4. The semiconductor device according to claim 3, wherein the peripheral region is formed with a plurality of slits.
5. The semiconductor device according to claim 4, wherein the through-hole has a circular shape in a plan view, and
the plurality of slits is formed radially at a uniform angle when viewed from the principal surface of the printed circuit board.
6. The semiconductor device according to claim 4, wherein the through-hole has a polygonal shape in a plan view, and
the plurality of slits is formed radially to extend from apexes of respective corners when viewed from the principal surface of the printed circuit board.
7. The semiconductor device according to claim 6, wherein the polygonal shape is a quadrangular shape in a plan view.
8. The semiconductor device according to claim 1, wherein the peripheral region of a surface of the printed circuit board facing the insulating substrate is formed with a chamfered portion.