1. A method for installing a door into a doorframe having a top and a bottom, the method comprising:
providing a door assembly including a door panel with an external surface, a lock assembly mounted in the door panel and having a mortise lockbody with duplicate lock hardware located symmetrically about a horizontal axis, the lockbody further comprising dual dead bolts, a hinge z-bar, and a latch z-bar, the hinge z-bar pivotally mounted to a first side of the door panel and the latch z-bar removably secured to a second side of the door panel;
orienting the door assembly by rotating the door panel, lock assembly, hinge z-bar and latch z-bar together for either a right hinge or a left hinge operation;
attaching a bottom expander to a bottom side of the door panel, the bottom expander attachable in a selected position on the door panel
setting the door assembly in the doorframe and securing the hinge z-bar and the latch z-bar to the doorframe and releasing the latch z-bar from the second side of the door panel such that the door panel is free to swing between a closed position and an open position;
securing a header frame to the top of the doorframe;
securing a top mounting frame to the top of the doorframe, the top mounting frame extending above the door panel
inserting a key cylinder into one of two symmetrical key cylinder receiving members on the mortise lockbody mounted in the door panel, and operating the key cylinder to extend both dead bolts in coordination;
aligning one or more jamb bracket bases onto the doorframe in a desired position by matching a guide indicia on the jamb bracket base to the hinge z-bar;
mounting one or more closers to each jamb bracket base and attaching the closers to the door panel, the closers being of variable length but releasably secured at an installation length;
releasing the one or more closers; and
adjusting the position of the bottom expander relative to the doorframe to lightly contact the bottom side of the doorframe.
2. The method of claim 1 further comprising inserting a handle spindle into a one of a pair of spindle receiving lumens in the mortise lockbody mounted in the door panel and attaching handles to the handle spindle.
3. The method of claim 1, wherein the hinge and latch z-bars are fixedly secured to the doorframe.
4. The method of claim 1, wherein the door panel and the header frame and the top mounting frame forms a seal with the top of the doorframe when the door panel is in the closed position.
5. The method of claim 1, wherein the door panel and the bottom expander forms a seal with the bottom of the doorframe when the door panel is in the closed position.
6. The method of claim 1 further including removably securing a top spacer to the top mounting frame to position the top mounting frame relative to the door panel.
7. The method of claim 6 further comprising removing the top spacer from the top mounting frame after installation of the top mounting frame.
8. The method of claim 1 further including removably securing a bottom spacer to the bottom expander to position the door panel and bottom expander relative to the bottom of the doorframe.
9. The method of claim 8 further comprising removing the bottom spacer from the bottom expander after positioning the door panel and bottom expander.
10. The method of claim 1 wherein the step of securing a header frame to the top of the doorframe includes covering a gap between the door panel and the top of the doorframe.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A circuit comprising:
a first integrated circuit having a first circuit and a first inductive interface; and
a second integrated circuit, coupled to the first integrated circuit, the second integrated circuit having a second circuit and a second inductive interface, wherein the first inductive interface and the second inductive interface are aligned to magnetically communicate first signals between the first circuit and the second circuit and wherein the second inductive interface is coupled to engage in near field communications with a remote device, wherein the near field communications include second signals.
2. The circuit of claim 1 wherein the first signals is magnetically communicated in a first frequency band and the near field communications are communicated in a second frequency band that is different from the first frequency band.
3. The circuit of claim 1 wherein the first inductive interface includes a first coil and the second inductive interface includes a second coil.
4. The circuit of claim 3 wherein the second coil responds to both magnetic communication of the first signals and the near field communications.
5. The circuit of claim 1 wherein the second inductive interface serially engages in magnetic communication of the first signals and the near field communications.
6. The circuit of claim 1 wherein the second inductive interface contemporaneously engages in magnetic communication of the first signals and the near field communications.
7. An integrated circuit comprising:
a first integrated circuit die having a first circuit and a first inductive interface; and
a second integrated circuit die, coupled to the first integrated circuit die, the second integrated circuit having a second circuit and a second inductive interface, wherein the first inductive interface and the second inductive interface are aligned to magnetically communicate first signals between the first circuit and the second circuit and wherein the second inductive interface is coupled to engage in near field communications with a remote device, wherein the near field communications include second signals.
8. The integrated circuit of claim 7 wherein the first signals is magnetically communicated in a first frequency band and the near field communications are communicated in a second frequency band that is different from the first frequency band.
9. The integrated circuit of claim 7 wherein the first inductive interface includes a first coil and the second inductive interface includes a second coil.
10. The integrated circuit of claim 9 wherein the second coil responds to both magnetic communication of the first signals and the near field communications.
11. The integrated circuit of claim 7 wherein the second inductive interface serially engages in magnetic communication of the first signals and the near field communications.
12. The integrated circuit of claim 7 wherein the second inductive interface contemporaneously engages in magnetic communication of the first signals and the near field communications.
13. The integrated circuit of claim 7 further comprising:
a substrate coupled to support the first integrated circuit die and the second integrated circuit die, the substrate including a magnetic communication path aligned with the first inductive interface and the second inductive interface, to magnetically communicate the first signals between the first circuit and the second circuit.
14. A method comprising:
magnetically communicating first signals between a first integrated circuit and a second interface circuit via a first inductive interface and a second inductive interface; and
engaging in near field communications via the second inductive interface with a remote device, wherein the near field communications include second signals.
15. The method of claim 14 wherein the first signals are magnetically communicated in a first frequency band and the near field communications are communicated in a second frequency band that is different from the first frequency band.
16. The method of claim 14 wherein the engaging in the near field communications is performed serially to the magnetic communication of the first signals.
17. The method of claim 14 wherein the engaging in the near field communications is performed contemporaneously to the magnetic communication of the first signals.
18. A method comprising:
magnetically communicating first signals between a first integrated circuit die and a second interface circuit die via a first inductive interface and a second inductive interface; and
engaging in near field communications via the second inductive interface with a remote device, wherein the near field communications include second signals.
19. The method of claim 18 wherein the first signals are magnetically communicated in a first frequency band and the near field communications are communicated in a second frequency band that is different from the first frequency band.
20. The method of claim 18 wherein the engaging in the near field communications is performed serially to the magnetic communication of the first signals.
21. The method of claim 18 wherein the engaging in the near field communications is performed contemporaneously to the magnetic communication of the first signals.