1. An apparatus for substantially planarizing a plurality of outer surfaces of an array of solder bumps attached to a bumped device, comprising:
a planarization member engageable with at least some of the plurality of outer surfaces, the planarization member applying a planarization action on one or more of the plurality of outer surfaces to substantially planarize the solder bumps; and
a securing element engageable with the bumped device to securely position the bumped device during engagement of the planarization member with the outer surfaces.
2. The apparatus of claim 1, further comprising a planarization gauge engageable with at least a portion of the outer surfaces to assess a planarization condition of the solder bumps.
3. The apparatus of claim 1 wherein the planarization member includes a cutting tool and the planarization action comprises a milling action on the one or more outer surfaces.
4. The apparatus of claim 1 wherein the planarization member includes a heated platen and the planarization action comprises a thermo-mechanical deformation action on the one or more outer surfaces.
5. The apparatus of claim 1 wherein the planarization member includes an abrasive surface and the planarization action comprises a grinding action on the one or more outer surfaces.
6. The apparatus of claim 1 wherein the planarization member includes a chemical solution and the planarization action comprises a chemical reaction with the one or more outer surfaces.
7. The apparatus of claim 1 wherein the planarization member includes a solder deposition device and the planarization action comprises a solder deposition on the one or more outer surfaces.
8. The apparatus of claim 7, further comprising a contact member engageable with one or more of the solder bumps to determine a seating plane, the solder deposition device applying the solder deposition on the one or more outer surfaces until the outer surfaces are substantially planarized along the seating plane.
9. The apparatus of claim 1 wherein the securing element includes a retaining wall sized to define a receiving space for receiving the bumped device, further comprising a protective layer disposed within the receiving space and at least partially covering the solder bumps except for the one or more outer surfaces, and wherein the planarization member includes a reactive solution disposed within the receiving space on the protective layer, the planarization action comprising an etching of the one or more outer surfaces by the reactive solution.
10. The apparatus of claim 1 wherein the planarization member includes a reservoir of a reactive solution and the securing element securely positions the bumped device with the solder bumps projecting downwardly toward the reservoir, the planarization action comprising an etching of the one or more outer surfaces by the reactive solution when the one or more outer surfaces are brought into contact with the reactive solution.
11. The apparatus of claim 1 wherein the at least some outer surfaces engageable by the planarization member include the one or more outer surfaces upon which the planarization action is applied.
12. The apparatus of claim 1 wherein the securing element includes a retaining mass positioned on the bumped device and the planarization member includes a substantially flat surface positioned below the bumped device in contact with the at least some outer surfaces, the planarization action comprising a compressive force due to the weight of the retaining mass, the compressive force mechanically flattening the one or more outer surfaces.
13. The apparatus of claim 1, further comprising a load device engageable with at least one of the bumped device or the planarization member to urge the at least some outer surfaces of the bumped device into engagement with the planarization member.
14. The apparatus of claim 13 wherein the load device includes a fixed surface and a pressurizable vessel disposed between the fixed surface and the bumped device, a pressure in the pressurizable chamber urging the bumped device away from the fixed surface and into engagement with the planarization member.
15. The apparatus of claim 13 wherein the securing element includes a retaining clip engageable with a substrate of the bumped device and the planarization member includes a substantially flat surface in contact with the at least some outer surfaces, the load device including a centrifuge engageable with the planarization member, the planarization action comprising a centrifugal force that compresses and mechanically flattens the one or more outer surfaces against the flat surface.
16. An apparatus for approximately planarizing a plurality of solder bumps, comprising:
a planarization member engageable with at least some of the plurality of solder bumps to apply a planarization action on one or more of the plurality of solder bumps to approximately equalize the heights of the solder bumps on a bumped device; and
a securing element engageable with the bumped device to securely position the bumped device during engagement of the planarization member with the solder bumps.
17. The apparatus of claim 16, further comprising a planarization gauge engageable with at least a portion of the solder bumps to assess a planarization condition of the solder bumps.
18. The apparatus of claim 16, further comprising a load device engageable with at least one of the planarization member or the bumped device to urge the at least some solder bumps into engagement with the planarization member.
19. A method of substantially planarizing an array of solder bumps attached to a bumped device, comprising:
securely positioning the array of solder bumps proximate a planarization member;
engaging the planarization member with at least some of a plurality of outer surfaces of the solder bumps; and
applying a planarization action with the planarization member to one or more of the outer surfaces to substantially planarize the array of solder bumps.
20. The method of claim 19, further comprising sensing at least some of the plurality of outer surfaces to define a seating plane.
21. The method of claim 19, further comprising gauging a planarization condition of the array of solder bumps.
22. The method of claim 21 wherein gauging a planarization condition of the array of solder bumps comprises gauging the planarization condition of the array of solder bumps after engaging the planarization member with at least some of the plurality of outer surfaces of the solder bumps.
23. The method of claim 19 wherein the planarization member has a substantially flat surface and applying a planarization action with the planarization member to one or more of the outer surfaces comprises applying a compressive force with the substantially flat surface to mechanically flatten the one or more outer surfaces.
24. The method of claim 19 wherein the planarization member includes a heated platen and applying a planarization action with the planarization member to one or more of the outer surfaces comprises at least partially thermo-mechanically deforming the one or more outer surfaces with the heated platen.
25. The method of claim 19 wherein the planarization member includes a cutting tool and applying a planarization action with the planarization member to one or more of the outer surfaces comprises milling the one or more outer surfaces with the cutting tool.
26. The method of claim 19 wherein the planarization member includes a chemically reactive solution and applying a planarization action with the planarization member to one or more of the outer surfaces comprises dissolving the one or more outer surfaces with the chemically reactive solution.
27. The method of claim 19 wherein applying a planarization action with the planarization member to one or more of the outer surfaces comprises applying a planarization action with the planarization member to the at least some outer surfaces engaged with the planarization member.
28. The method of claim 19, further comprising engaging a load member with at least one of the bumped device or the planarization member to urge the at least some outer surfaces into engagement with the planarization member.
29. The method of claim 19, further comprising forming a protective layer at least partially surrounding the solder bumps.
30. A method of substantially planarizing an array of solder bumps attached to a bumped device, comprising adjusting the thickness of at least some of the solder bumps so that all of the solder bumps in the array project from the bumped device by substantially the same distance.
31. The method of claim 30, further comprising securing the position of the bumped device during engagement of the planarization member with the at least some solder bumps.
32. The method of claim 30, further comprising gauging a planarization condition of the array of solder bumps.
33. The method of claim 30 wherein adjusting the thickness of at least some of the solder bumps comprises milling the at least some solder bumps with a cutting tool.
34. The method of claim 30 wherein adjusting the thickness of at least some of the solder bumps comprises thermo-mechanically deforming the at least some solder bumps.
35. The method of claim 30 wherein adjusting the thickness of at least some of the solder bumps comprises grinding the at least some solder bumps with an abrasive.
36. The method of claim 30 wherein adjusting the thickness of at least some of the solder bumps comprises dissolving a portion of the at least some solder bumps with a chemical solution.
37. The method of claim 30 wherein adjusting the thickness of at least some of the solder bumps comprises mechanically flattening the at least some solder bumps.
38. The method of claim 30 wherein adjusting the thickness of at least some of the solder bumps comprises depositing a volume of solder on the at least some solder bumps.
39. A bumped device having an array of substantially Planarized solder bumps created by a method comprising:
securely positioning the array of solder bumps proximate a planarization member;
engaging the planarization member with at least some of a plurality of outer surfaces of the solder bumps; and
applying a planarization action with the planarization member to one or more of the outer surfaces to substantially planarize the array of solder bumps.
40. The bumped device of claim 39 wherein the method further comprises gauging a planarization condition of the array of solder bumps.
41. The bumped device of claim 39 wherein applying a planarization action with the planarization member to one or more of the outer surfaces comprises milling the one or more outer surfaces with a cutting tool.
42. The bumped device of claim 39 wherein applying a planarization action with the planarization member to one or more of the outer surfaces comprises thermo-mechanically deforming the one or more outer surfaces with a heated tool.
43. The bumped device of claim 39 wherein applying a planarization action with the planarization member to one or more of the outer surfaces comprises grinding the one or more outer surfaces with an abrasive.
44. The bumped device of claim 39 wherein applying a planarization action with the planarization member to one or more of the outer surfaces comprises dissolving a portion of the one or more outer surfaces with a reactive solution.
45. The bumped device of claim 39 wherein applying a planarization action with the planarization member to one or more of the outer surfaces comprises mechanically flattening the one or more outer surfaces.
46. The bumped device of claim 39 wherein applying a planarization action with the planarization member to one or more of the outer surfaces comprises depositing a volume of solder on the one or more outer surfaces.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A device for bundling a stack (02) of sheet-like objects, having a support plate (06) for the stack (02) and a banding strip (01) crossing between the surface of the support plate (06) and the underside of the stack (02), wherein a channel (07) for pushing the banding strip (01) under the stack (02) is formed in the support plate (06), and the support plate (06) can be pushed into a chute (26) formed between lateral border walls (27) in order to fold the banding strip (01) over against the lateral faces between the border walls (27) and the lateral faces of the stack (02), and having devices (29, 32, 32, 33, 34) for folding the end sections (28) of the banding strip (01) over against the top of the stack (02), characterized in that at least one spring element (08) for pressing the banding strip (01) against the underside of a stack (02) sitting on the support plate (06) is provided.
2. The device in accordance with claim 1, characterized in that the tongue (09) is embodied as a hollow profile, in particular a rectangular tube.
3. The device in accordance with claim 1 or 2, characterized in that in the extended position the tongue (09) is flush with the surface of the support plate (06).
4. The device in accordance with claim 1, characterized in that a tongue (09) can be displaced between an extended position, in which it separates the channel (07) from the support plate (06), and a retracted position, in which the channel (07) is open toward the surface of the support plate (06).
5. The device in accordance with claim 4, characterized in that the spring element (08) can be displaced by the tongue (09) in such a way that, in the extended state of the tongue (09), it clears the channel (07) for the passage of the banding strip (01).
6. The device in accordance with claim 5, characterized in that the tongue (09) has at least one elongated fin (11), which in the extended state displaces the spring element (08) out of the channel (07).
7. The device in accordance with claim 1, characterized in that at least one spring element (08) is arranged for creating a channel (07) between the support plate (06) and the stack (02).
8. The device in accordance with claim 7, characterized in that the spring element (08) is movable, and that the banding strip (01) can be fixed in place between the stack (02) and the support plate (06).
9. The device in accordance with claim 1, characterized in that a first actuator (17) is arranged for pushing a stack (02) into the chute (26).
10. The device in accordance with claim 9, characterized in that the first actuator (17) comprises pressing elements (18) for pushing against the top of the stack (02), wherein a gap (21) for the passage of a tool for connecting the ends of the banding strip (01) is provided between the pressing elements (18).
11. The device in accordance with claim 10, characterized in that the tool is a heatable die (22).
12. The device in accordance with one of the preceding claims, characterized in that a second actuator (24) for pushing the stack (02) out of the chute (26) is provided.
13. The device in accordance with claim 12, characterized in that an arresting device (37) for arresting the support plate (06) at a predetermined depth in the chute (26) is arranged.
14. The device in accordance with one of claims 9 to 13, characterized in that at least one actuator (17, 24) is a pneumatic cylinder.
15. A method for drawing in a banding strip (01) for bundling a stack (02) of sheet-like objects by means of a banding strip (01), containing the following steps:
a channel (07) is formed between the stack (02) and a support plate (06),
a free end of the banding strip (01) is passed through this channel (07),
the banding strip (01) is pressed against the stack (02) by means of a spring element (08).
16. The method in accordance with claim 15, characterized in that following the fixing of the banding strip (01) in place, the stack (02) is moved into a chute (26) in order to place the banding strip (01) against the lateral faces of the stack (02).
17. The method in accordance with claim 15, characterized in that the position of the banding strip is detected by means of a sensor (15) or a reading device (14) prior to the fixation in place of the banding strip (01).
18. The method in accordance with claim 15, characterized in that the channel (07) is by changing the distance between the stack (02) and the support plate (06).
19. The method in accordance with claim 15, characterized in that in the course of introducing it into the channel (07), the leading end of the banding strip (01) is limited transversely to the conveying direction by at least one lateral wall of the channel.
20. The method in accordance with claim 15, characterized in that a tongue (09) is introduced into the channel (07).
21. The method in accordance with claim 16, characterized in that following the introduction of the tongue (09), the banding strip (01) is passed into the channel (07).
22. A device for bundling a stack (02) of sheet-like objects by means of a banding strip (01), wherein the stack (02) is arranged so that it is compressed by means of a first actuator (17) while the banding strip (01) is connected, and a second actuator (23) is arranged for moving a heatable die (22), characterized in that a further actuator (23) can be moved by means of this first actuator (17).